国联安中证全指半导体产品与设备ETF联接A（007300）基金经理为黄欣、章椹元。 截至发稿，黄欣累计任职时间15年182天，现任基金资产总规模420.52亿元，任职期间最佳基金回报 214.7%， 任职期间最差基金回报-35.8%。 章椹元累计任职时间11年313天，现任基金资产总规模408.22亿元，任职期间最佳基金回报387.76%， 任职期间最差基金回报-35.8%。 风险提示：市场有风险，投资需谨慎。本文为AI大模型自动发布，任何在本文出现的信息（包括但不 限于个股、评论、预测、图表、指标、理论、任何形式的表述等）均只作为参考，不构成个人投资建 议。 10月10日，晶方科技跌5.09%，截至发稿，报31.72元/股，成交12.57亿元，换手率6.01%，总市值206.87 亿元。 资料显示，苏州晶方半导体科技股份有限公司位于江苏省苏州工业园区汀兰巷29号，成立日期2005年6 月10日，上市日期2014年2月10日，公司主营业务涉及传感器领域的封装测试业务。主营业务收入构成 为：芯片封装及测试72.32%，光学器件25.91%，设计收入1.67%，其他0.10%。 从晶方科技十大流通股东角度 数据显 ...

Group 1: Company Overview - Keda Technology is focusing on AI as a core strategy, aiming to enhance its competitiveness in the intelligent transportation sector through continuous technological breakthroughs [10][11] - The company has launched the first domestic operating system for the transportation industry, "Traffic Jiahong," to establish a comprehensive and controllable operational foundation [11][12] - Keda Technology's R&D investment for 2024 is projected to be 243 million yuan, with a total of 89 patent applications and 41 granted patents [12] Group 2: International Expansion - Keda Technology views overseas business expansion as a necessity, with plans to establish a new model of "technology output + ecosystem co-construction" starting from Hong Kong [13][14] - The company is preparing for an overseas share issuance (H-shares) and listing on the Hong Kong Stock Exchange to enhance its international competitiveness [14] - Keda Technology aims to leverage its differentiated advantages to penetrate international markets, including establishing a Southeast Asia regional headquarters in Singapore [14] Group 3: Financial Performance - In the first half of the year, Keda Technology achieved a revenue of 4.919 billion yuan, a year-on-year increase of 65.22%, and a net profit of 135 million yuan, marking a turnaround from losses [15] Group 4: Industry Challenges and Strategies - Blue Arrow Electronics emphasizes the importance of continuous innovation to navigate the challenges posed by rising costs and competitive pressures in the semiconductor industry [20][21] - The company is transitioning from consumer electronics to high-value sectors, actively expanding into automotive electronics and industrial applications [21] Group 5: Autonomous Driving Sector - WeRide has been operating safely for over 2,200 days and holds seven national autonomous driving licenses, expanding its operations in 30 cities across 11 countries [22][24] - The company has launched various autonomous driving services, including Robotaxi, and is focusing on international expansion with tailored solutions for different regions [23][24] - WeRide is building an ecosystem of collaboration with major industry players to enhance its competitive edge in the global market [25][26]

Core Viewpoint - The company, Qipai Technology, has announced a plan to raise no more than 159 million yuan through a private placement, primarily to supplement its working capital, amidst ongoing financial losses over the past three and a half years [2][5]. Group 1: Fundraising Details - Qipai Technology plans to issue shares at a price of 20.11 yuan per share, with a total of no more than 7.9 million shares to be issued [5]. - The issuance will be fully subscribed by the actual controllers, Liang Dazhong, Bai Ying, and their son Liang Huate, indicating their strong support and confidence in the company's future [5][8]. - The funds raised will be used entirely to improve the company's liquidity, which is crucial given the capital-intensive nature of the semiconductor packaging and testing industry [8]. Group 2: Financial Performance - The company has reported continuous losses, with net profits of -58.57 million yuan in the first half of 2025, which is a deterioration of 18.07 million yuan compared to the same period last year [11]. - Revenue for the first half of 2025 was 326 million yuan, reflecting a year-on-year growth of 4.09% [11]. - The company has experienced a significant stock price rebound since April, with an overall increase of over 21% year-to-date, although it faced a decline of 3.90% on August 14, closing at 26.38 yuan per share [9][11]. Group 3: Company Background and Industry Position - Qipai Technology is a leading domestic semiconductor packaging and testing company in South China, having been listed on the STAR Market in June 2021 [10]. - The company has developed several core technologies in semiconductor packaging, including GaN RF power amplifier packaging technology and high-density matrix integrated circuit packaging technology, which provide it with a competitive edge in the industry [10]. - Despite its technological advancements, the company has struggled financially, with projected revenues of 540 million yuan, 554 million yuan, and 667 million yuan for 2022, 2023, and 2024, respectively, alongside increasing net losses [10].

Core Viewpoint - The company plans to issue RMB ordinary shares (A shares) to specific investors, which is expected to dilute the earnings per share in the short term [1][4]. Financial Impact Analysis - The company estimates that the total number of shares will increase to 11,477.98 million after the issuance, with a fundraising amount of RMB 158.87 million [2][3]. - The projected net profit attributable to the parent company, excluding non-recurring gains and losses, is estimated to be -121.12 million [2][3]. - The basic and diluted earnings per share are projected to be -0.96 and -1.13 respectively under various scenarios of profit changes [2][3]. Measures to Mitigate Dilution - The company will strengthen the management of raised funds to ensure they are used effectively and for designated purposes [5][6]. - The company aims to accelerate the expansion of its main business to enhance competitiveness and improve asset quality [5][6]. - Operational management will be optimized to improve efficiency and control costs, thereby enhancing overall performance [5][6]. Commitments from Major Stakeholders - The controlling shareholder and actual controller, Liang Hua Te, along with board members and senior management, have committed to measures to compensate for the dilution of immediate returns [6][7]. - These commitments include not interfering with the company's management and ensuring that no unfair benefits are provided to other entities [7][8].

Group 1 - The latest stock price of Qipai Technology is 27.45 yuan, an increase of 1.87 yuan, representing a rise of 7.31% compared to the previous trading day [1] - The stock reached a maximum of 29.88 yuan and a minimum of 25.65 yuan during the day, with a volatility of 16.54% [1] - The trading volume for the day was 73,343 hands, with a total transaction amount of 206 million yuan [1] Group 2 - Qipai Technology operates in the semiconductor industry, focusing on integrated circuit packaging and testing [1] - The company is headquartered in Guangdong and its main products include QFN, DFN, and SOP packaging forms [1] - In the first half of the year, the company initiated the FCQFN advanced packaging project, which is currently in the process development stage [1] Group 3 - On the day of the stock price increase, the net inflow of main funds into Qipai Technology was 14.0174 million yuan, with a cumulative net inflow of 14.7099 million yuan over the past five days [2]

Core Viewpoint - The report highlights the financial performance and operational status of Qipai Technology Co., Ltd. for the first half of 2025, indicating a slight increase in revenue but a significant increase in net losses compared to the previous year. Financial Performance - The company's revenue for the first half of 2025 was approximately 325.91 million yuan, representing a 4.09% increase from 313.10 million yuan in the same period last year [3][15]. - The total profit for the period was a loss of approximately 62.66 million yuan, compared to a loss of 51.17 million yuan in the previous year [3][15]. - The net profit attributable to shareholders was a loss of approximately 58.67 million yuan, worsening from a loss of 40.60 million yuan year-on-year [3][15]. - The net cash flow from operating activities was approximately 14.11 million yuan, down 62.33% from 37.45 million yuan in the previous year [3][15]. - The company's net assets at the end of the reporting period were approximately 597.18 million yuan, down 8.64% from 653.63 million yuan at the end of the previous year [3][15]. Industry Overview - The semiconductor packaging and testing industry is experiencing a recovery, with global semiconductor market sales reaching 59 billion USD in May 2025, a year-on-year increase of 27% [5][7]. - The global semiconductor market is projected to grow to 718.9 billion USD in 2025, reflecting a 13.2% year-on-year increase [5][7]. - The demand for AI chips is expected to drive an 8% growth in the packaging and testing industry, with increasing needs for high-reliability and miniaturized packaging in automotive electronics and IoT [7]. Business Operations - The main business of the company includes semiconductor packaging and testing, divided into integrated circuit packaging testing, power device packaging testing, and wafer testing [5][8]. - The company has developed over 300 types of packaging forms, including MEMS, FC, GaN RF devices, and various traditional and advanced packaging technologies [8][13]. - The company emphasizes continuous R&D investment, with a total R&D expenditure of approximately 26.02 million yuan in the first half of 2025, a 2.50% increase year-on-year [16]. Competitive Advantages - The company has established a strong competitive edge through its proprietary technologies in packaging, including GaN microwave RF packaging and high-density matrix packaging technologies [18][19]. - The company has a well-structured team with extensive experience in semiconductor packaging and testing, contributing to its innovation and operational efficiency [19][20]. - The company operates a flexible production model that allows for quick adjustments to production plans based on customer orders, enhancing market responsiveness [20][21].

向不特定对象发行可转换公司债券 申请文件的审核问询函回复 天职业字[2025]35779号 目 录 关于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券 申请文件的审核问询函回复 1 关于合肥颀中科技股份有限公司 向不特定对象发行可转换公司债券申请文件的审核问询函回复 天职业字[2025]35779 号 上海证券交易所： 根据贵所于 2025 年 7 月 7 日出具的上证科审（再融资）〔2025〕73 号《关 于合肥颀中科技股份有限公司向不特定对象发行可转换公司债券申请文件的审 核问询函》（以下简称"问询函"）的要求，天职国际会计师事务所（特殊普通 合伙）（以下简称"申报会计师"）作为合肥颀中科技股份有限公司（以下简称 "颀中科技"、"发行人"或"公司"）本次向不特定对象发行可转换公司债券的 申报会计师，本着勤勉尽责、诚实守信的原则，就问询函所提问题逐项进行认 真讨论、核查与落实，并逐项进行了回复说明。具体回复内容附后。 关于回复内容释义、格式及补充更新披露等事项的说明： 有限公司向不特定对象发行可转换公司债券募集说明书》（以下简称"募集说明 书"）一致； 舍五入所致； | 问询函所列问题 | | 黑体 ...

本次发行股票拟在创业板上市，创业板公司具有创新投入大、新旧产业融合存在不确定性、 尚处于成长期、经营风险高、业绩不稳定、退市风险高等特点，投资者面临较大的市场风险。 投资者应充分了解创业板的投资风险及本公司所披露的风险因素，审慎作出投资决定。 佛山市蓝箭电子股份有限公司 FOSHAN BLUE ROCKET ELECTRONICS CO.,LTD. （佛山市禅城区古新路 45 号） 首次公开发行股票并在创业板上市 招股说明书 保荐人（主承销商） （海口市南宝路 36 号证券大厦 4 楼） 创业板投资风险提示 佛山市蓝箭电子股份有限公司 招股说明书 声 明 中国证监会、交易所对本次发行所作的任何决定或意见，均不表明其对发行 人注册申请文件及所披露信息的真实性、准确性、完整性作出保证，也不表明其 对发行人的盈利能力、投资价值或者对投资者的收益作出实质性判断或保证。任 何与之相反的声明均属虚假不实陈述。 根据《证券法》规定，股票依法发行后，发行人经营与收益的变化，由发行 人自行负责；投资者自主判断发行人的投资价值，自主作出投资决策，自行承担 股票依法发行后因发行人经营与收益变化或者股票价格变动引致的投资风险。 1- ...