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联瑞新材(688300):半导体产业持续迭代,公司高阶球形品需求释放
Ping An Securities· 2025-08-27 09:52
Investment Rating - The report maintains a "Recommended" investment rating for the company, indicating an expectation that the stock will outperform the market by 10% to 20% over the next six months [11]. Core Views - The semiconductor industry is experiencing a rapid technological iteration, leading to an accelerated demand for high-end spherical materials. The global semiconductor sales reached $346 billion in the first half of 2025, marking an 18.9% year-on-year increase, indicating a strong growth momentum in the industry [7]. - The company is positioned as a leading producer of electronic-grade silicon micro-powder in China, with plans to expand its production capacity for high-purity spherical products, which are expected to contribute significantly to revenue growth [8]. - The company reported a revenue of 519 million yuan in the first half of 2025, a year-on-year increase of 17.12%, and a net profit attributable to shareholders of 139 million yuan, up 18.01% year-on-year [4]. Financial Summary - The company’s revenue projections for the upcoming years are as follows: 960 million yuan in 2024, 1.192 billion yuan in 2025, 1.444 billion yuan in 2026, and 1.724 billion yuan in 2027, with year-on-year growth rates of 34.9%, 24.1%, 21.2%, and 19.4% respectively [6]. - The net profit attributable to shareholders is expected to reach 316 million yuan in 2025, 398 million yuan in 2026, and 491 million yuan in 2027, with corresponding year-on-year growth rates of 25.9%, 25.7%, and 23.4% [6]. - The company’s gross margin is projected to improve from 40.4% in 2024 to 44.0% in 2027, while the net margin is expected to increase from 26.2% to 28.5% over the same period [6]. Industry Outlook - The advanced packaging market is projected to grow at a compound annual growth rate (CAGR) of 10.7% from 2023 to 2029, while the high-end CCL market is expected to see a CAGR of 26% from 2024 to 2026, driven by advancements in AI, 5G, and high-performance computing [7]. - The company plans to raise 720 million yuan through convertible bonds to fund the construction of high-performance ultra-pure spherical silica and high thermal conductivity spherical alumina projects, addressing capacity shortages and enhancing its competitive position in the market [7].