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英特尔前CEO:美国芯片制造,很难再回来了
半导体行业观察· 2026-01-12 01:31
Core Viewpoint - Intel's former CEO Pat Gelsinger emphasizes the long journey ahead for the U.S. to reclaim chip manufacturing from Asia, highlighting that the key measure is the number of wafers produced in the U.S. [1] Group 1: U.S. Chip Manufacturing - Gelsinger warns that while the U.S. government is taking steps to strengthen domestic chip manufacturing, such as acquiring Intel shares and promoting advanced semiconductor production, the majority of advanced chip manufacturing remains concentrated in Asia, particularly Taiwan [1] - He stresses that the return of manufacturing to the U.S. is crucial but will take time, as it took decades for manufacturing to shift to Asia [1] - The U.S. government policies, including the CHIPS Act and tariffs, are seen as significant catalysts for encouraging companies like NVIDIA and AMD to consider Intel's foundry services as alternatives to TSMC [3][4] Group 2: Technological Milestones - Gelsinger claims credit for the breakthroughs in Intel's 18A and Panther Lake processors, stating that these achievements are significant milestones for the company [2] - The successful launch of the Panther Lake chip, based on the 18A process, is viewed as a critical goal for Intel to gain the trust of fabless companies like NVIDIA [2] - The core technologies and R&D for the 18A process, including PowerVia and RibbonFET, were initiated under Gelsinger's leadership, indicating a strategic focus on enhancing energy efficiency [3] Group 3: Future Outlook - Intel's next important milestone in foundry services is to attract customers for front-end and back-end semiconductor products, particularly the 18A-P and 14A processes, which are vital for market acceptance [5] - Current developments suggest that Intel's leadership is optimistic about the future of its foundry and product divisions, with confidence expressed in the progress of the 14A process [5]