Core Insights - Broadcom has begun shipping the industry's first 2nm custom compute SoC utilizing its 3.5D eXtreme Dimension System in Package (XDSiP) platform, which integrates advanced semiconductor technologies for enhanced performance and efficiency [1][3] Group 1: Technology and Innovation - The 3.5D XDSiP platform is foundational for next-generation XPUs, enabling high signal density, power efficiency, and low latency to meet the demands of large-scale AI clusters [2] - The integration of 2.5D techniques and Face-to-Face (F2F) technology in the 3.5D XDSiP allows for independent scaling of compute, memory, and network I/O in a compact form factor [2][3] - The launch of this technology represents a significant milestone in semiconductor integration, combining 2nm process innovation with advanced 3D integration to enhance compute density and energy efficiency [3] Group 2: Strategic Partnerships and Market Impact - Broadcom's collaboration with Fujitsu highlights the strategic importance of the 3.5D XDSiP technology in supporting Fujitsu's FUJITSU-MONAKA initiative for high-performance, low-power processors [3] - The advancements in Broadcom's 3.5D platform capabilities are set to support a broader customer base, with shipments expected to commence in the second half of 2026 [3]