Core Viewpoint - Coherent has achieved a significant milestone with its next-generation 300mm silicon carbide (SiC) platform, aimed at meeting the increasing thermal efficiency demands of artificial intelligence data center infrastructure [2]. Group 1: Technology and Innovation - The new 300mm solution is developed to address the growing thermal load and performance scalability needs of modern data centers, leveraging Coherent's established 200mm platform technology [2]. - The platform's conductive SiC substrate features low resistivity, low defect density, and high uniformity, enabling low power consumption, high frequency, and good thermal stability [2]. - The technology is also applicable in AR/VR devices and power electronics, allowing for the production of thinner, more efficient waveguides for immersive display modules [2]. Group 2: Market Impact - The 300mm platform solidifies Coherent's leadership in wide bandgap semiconductor materials, facilitating innovation in data centers, optics, and power applications [3]. - The transition to 300mm wafer size allows for more devices per wafer and reduces the cost per chip, supporting applications in electric vehicles, renewable energy systems, and industrial automation [2].