3D打印铜及铜合金粉末

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有研粉材:公司3D打印铜及铜合金粉末下游客户已就电子产品散热部件应用开展开发工作,目前正在推进中
Mei Ri Jing Ji Xin Wen· 2025-08-29 10:21
Core Viewpoint - The company has confirmed that it is actively developing applications for 3D printed copper and copper alloy powders in electronic product cooling components, responding to market interest in copper-based liquid cooling plates showcased at a recent exhibition [2] Group 1 - An investor inquired about the company's preparations for copper-based liquid cooling plates, which were recently displayed by equipment manufacturers at an exhibition in Shenzhen [2] - The company stated that its downstream customers are already engaged in development work for electronic product cooling components using 3D printed copper and copper alloy powders, indicating ongoing progress in this area [2]