Core Viewpoint - The semiconductor industry is entering a transformative phase driven by bonding integration technology, which breaks traditional scaling limits and opens new avenues for semiconductor technology [1][3]. Group 1: Industry Challenges and Innovations - The high-end bonding equipment market has been dominated by a few overseas companies, creating significant barriers for Chinese semiconductor firms in terms of cost, technology access, and delivery times [3]. - Qinghe Crystal has made significant strides in overcoming these challenges through independent innovation, achieving breakthroughs in critical processes like room-temperature bonding and 3D heterogeneous integration [3][4]. - The company has developed over 200 authorized patents and offers bonding precision better than 100nm, with a delivery cycle reduced to 6-8 months compared to imported equipment [3][4]. Group 2: Product Offerings and Technological Advancements - Qinghe Crystal has created a comprehensive product matrix that includes various advanced bonding equipment, such as the SAB61 series for ultra-high vacuum room-temperature bonding and the SAB62 series for hydrophilic bonding [7][14][18]. - The SAB83 series offers high-precision TCB bonding, while the SAB64 series provides temporary bonding and debonding solutions, showcasing the company's diverse capabilities [16][21]. - The company has established modern bonding production lines in Tianjin and Shanxi, enabling stable mass production of critical bonding substrates [9][11]. Group 3: Future Vision and Market Position - Qinghe Crystal aims to become a global leader in heterogeneous integration within the semiconductor industry, emphasizing the importance of continuous innovation and collaboration with industry partners [3][5]. - The company is committed to exploring the limitless possibilities of bonding integration technology, contributing to the growth of the semiconductor industry and emerging strategic sectors [11][24]. - The rise of Qinghe Crystal signifies a new era in semiconductor bonding technology driven by Chinese innovation, positioning the company as a key player in advancing the industry [24].