Core Viewpoint - The company has developed a CPO (Co-Packaged Optics) solution that integrates optical engines with ASIC chips on the same substrate, addressing high bandwidth and low power consumption needs across various applications [1][3]. Company Summary - The CPO solution offers bandwidth expansion and energy efficiency optimization for computing scenarios, facilitating generational upgrades of systems [3]. - Compared to traditional board-level interconnects, CPO has potential advantages in link distance, power consumption, and bandwidth density, making it suitable for high-performance interconnect needs in AI computing clusters and data centers [3]. - The company is collaborating with multiple clients on core aspects such as optical engine packaging integration, thermal management, and reliability validation, focusing on device layout, heat dissipation optimization, and long-term reliability assessment [3]. Industry Summary - CPO is viewed as a significant direction for enhancing interconnect efficiency, although mass production faces challenges related to optical alignment precision, yield, and maintainability [3]. - As the ecosystem matures and standards advance, manufacturers with advanced packaging and validation capabilities are expected to benefit from increasing demand [3]. - Industry perspectives suggest that if the company achieves large-scale adoption and stable yield on the client side, there could be improvements in order volume and product structure; however, uncertainties remain regarding downstream demand trends, standard evolution, and supply chain collaboration [3].