Summary of Conference Call on Global Semiconductors Industry Overview - The focus is on the semiconductor industry, specifically the competition between Intel and TSMC regarding advanced packaging technologies for AI chips, particularly the Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology offered by Intel as an alternative to TSMC's CoWoS packaging method [2][12]. Core Points and Arguments 1. **EMIB-T Technology**: - EMIB-T is an enhanced version of Intel's existing EMIB technology, designed to support larger reticle sizes and provide a more cost-effective solution for AI chip packaging compared to TSMC's CoWoS [3][34]. - Intel claims EMIB-T can support reticle sizes of 8-12x by 2026-2027, compared to TSMC's current capabilities of 3.3x and future plans for 5.5x and 9.5x [3][34]. 2. **Financial Impact**: - If 1 million chips shift from CoWoS to EMIB-T, TSMC could face a revenue loss of approximately $1 billion, which is about 5-10% of its advanced packaging revenue in 2027, but only 0.5% of its total revenue [4][52]. - Conversely, Intel could see a revenue increase of high triple-digit millions, representing 1-2% of its revenue [4][51]. 3. **Market Positioning**: - Ibiden is highlighted as a strong player in the EMIB-T market, with expectations of increased revenue and margins due to the complexity of EMIB-T substrates [5][54]. - The substrate value for EMIB-T is projected to rise to approximately $300, significantly higher than previous generations [5][49]. 4. **Geopolitical Considerations**: - Intel's existing advanced packaging capacity in the U.S. provides a competitive edge, especially as TSMC plans to build new packaging fabs in Arizona, which may not be operational until 2028 [13][35]. 5. **Challenges for EMIB-T**: - The main challenges for EMIB-T include a lack of proven track record and potential lower production yields due to the complexity of embedding silicon bridges in the substrate [3][34]. Additional Important Content - **Customer Engagement**: Intel has indicated potential early customer engagements worth "north of a billion dollars" each, although this remains uncertain [4][51]. - **Future Developments**: Intel is also exploring advancements in 3.5D packaging, which combines EMIB with Foveros Direct technology, aiming to compete more effectively with TSMC's offerings [42][43]. - **Investment Ratings**: - Ibiden, TSMC, and MediaTek are rated as "Outperform," while Intel is rated as "Market-Perform" [8][9][10][11]. Conclusion - The semiconductor industry is witnessing a significant shift with Intel's EMIB-T technology potentially challenging TSMC's dominance in advanced packaging for AI chips. The financial implications for both companies are substantial, with Ibiden positioned to benefit from this transition. However, challenges remain regarding production yields and the need for proven technology.

Core Viewpoint - A fresh analysis of global semiconductor supply chains indicates that hyperscaler demand is increasing, leading to tighter memory supply and reshaping the competitive landscape in the industry. Group 1: Hyperscaler Demand and Memory Pricing - Hyperscalers are securing Dynamic Random-Access Memory (DRAM) and NAND capacity in anticipation of a 50% growth in data center bits by 2026, resulting in higher contract prices [2] - DRAM contract prices are expected to rise by approximately 25% in Q1 2026 and 10%-12% in Q2 2026, while NAND prices are projected to increase by about 20% in Q1 2026 and 10%-15% in Q2 2026 [2] Group 2: Company Performance and Upgrades - Intel and AMD are highlighted as leading companies, with both upgraded to Overweight due to being largely sold out of 2026 server CPU capacity, with potential price increases of 10%-15% in Q1 2026 [4] - Micron Technology's price forecast has been raised to $450 from $325, reflecting positive views on AI compute and infrastructure demand [5] Group 3: Custom Silicon and Market Dynamics - Custom silicon is identified as a key battleground for hyperscalers, with Broadcom's Chip on Wafer on Substrate (CoWoS) supply for 2026 revised upward by 30% to 250K units, a significant increase compared to 2025 [6] - OpenAI's custom ASIC timeline has shifted to Q1 2027, with an expected lifetime unit opportunity of 1.5 million to 2 million, potentially adding $8 billion to $10 billion to Broadcom's AI backlog [7] Group 4: Challenges and Market Outlook - Higher memory prices and shortages are negatively impacting handset demand and margins, leading to lowered estimates for Qualcomm and highlighting Arm Holdings as a potential headwind due to anticipated smartphone market contraction in 2026 [9] - Memory constraints and price increases may affect PCs, smartphones, and automotive sectors, despite strong demand in AI and data center markets [9]