Core Insights - The DKV56 series is the world's first ultra-high voltage millimeter-wave isolation driver chip, integrating advanced wireless isolation technology for various applications including AI data centers and renewable energy systems [1][2] - The chip has entered mass production and demonstrates significant performance improvements over traditional isolation methods, achieving stable operation under extreme conditions [1][2] Group 1: Product Features - The DKV56 series supports five current output combinations, ranging from 2.5A to 30A, enhancing efficiency in driving high-performance devices like SiC [2] - It includes real-time fault detection and reset functions, simplifying circuit design and reducing development costs [2] - The chip operates within a temperature range of -40℃ to 125℃ and is currently seeking safety certifications [2] Group 2: Market Context - The global power semiconductor market has surpassed $30 billion and is projected to grow at a CAGR of 8-10% until 2028, with SiC and GaN driver chips experiencing the fastest growth [2] - The industry is moving towards high-frequency and modular solutions, with the DKV56 series positioning itself as a key player in this transition [2] Group 3: Technological Advancements - Since 2025, the company has been enhancing its millimeter-wave wireless isolation product lineup, recently launching a digital isolation chip capable of transmitting data at 5Gbps under high voltage conditions [3] - The new chip has been validated by several leading companies in the industry and is entering large-scale production [3]