EMIB packaging technology
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美国半导体:高通、博通、苹果或在评估英特尔晶圆代工业务,但鉴于技术挑战,我们认为此事难以成行-US Semiconductors_ QCOM, AVGO, Apple Might Be Evaluating Intel Foundry But We Don‘t Think it Will Come to Fruition Given Technical Challenges
2025-11-24 01:46
Flash | 19 Nov 2025 12:21:49 ET │ 12 pages US Semiconductors QCOM, AVGO, Apple Might Be Evaluating Intel Foundry But We Don't Think it Will Come to Fruition Given Technical Challenges CITI'S TAKE We surmise Qualcomm could be evaluating Intel Foundry for its data center ASIC business (under 1% of sales) as we found QCOM job postings with qualifications including Intel's EMIB packaging technology. We also found job postings at Apple and AVGO that include references to Intel packaging technology, which is agai ...