Grace Blackwell Ultra超级芯片

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英伟达Blackwell Ultra采用液冷散热 液冷市场“奇点”临近
Zheng Quan Ri Bao Wang· 2025-04-03 06:49
Core Insights - Liquid cooling technology has emerged as a highlight at NVIDIA's recent GTC conference, showcasing the integration of liquid cooling and silicon photonics in their new Blackwell Ultra chip, which features 288GB HBM3e memory and achieves 15 PetaFLOPS of FP4 computing power [1] - The introduction of the open-source inference framework Dynamo and the high-performance liquid cooling system indicates a significant shift towards liquid cooling in AI computing, with expectations for rapid penetration in the market [1][2] Group 1: NVIDIA's Innovations - NVIDIA's new DGX GB300 system, utilizing the Grace Blackwell Ultra super chip, offers a 70-fold increase in AI performance compared to the previous Hopper architecture [1] - The liquid cooling system can handle a power output of 120kW, enabling calculations at the scale of hundreds of quintillions [1] - Future plans include the Vera Rubin Ultra, expected to launch in the second half of 2027, with each rack potentially reaching 600kW of power [1] Group 2: Market Trends and Demand - The demand for AI computing power is expanding, necessitating higher performance and power levels from core chips, which in turn raises the requirements for liquid cooling technology [3] - Major tech companies like Microsoft, Google, Meta, and Intel are accelerating their adoption of liquid cooling solutions, indicating a broader industry trend [4] - A report from three major telecom operators anticipates that by 2025, over 50% of projects will utilize liquid cooling technology [4] Group 3: Industry Collaboration and Development - Green Cloud Technology, a leading domestic provider of liquid cooling solutions, has established a comprehensive capability from R&D to delivery, demonstrating maturity and reliability in its products [5] - The company has delivered multiple liquid cooling projects for AI firms, emphasizing the need for safety, efficiency, and standardization across the industry [6] - Collaboration among various stakeholders, including chip manufacturers and cooling solution providers, is essential for advancing liquid cooling technology and establishing unified standards [6]