ASMPT (00522) Q2 2025 Earnings Call July 22, 2025 08:30 PM ET Company ParticipantsLeonard Lee Hung Kuen - Senior Manager - IRRobin Ng - Group CEO & Group Executive DirectorKatie Xu - EVP & Group CFOGokul Hariharan - Managing DirectorLeping Huang - Managing DirectorAlex Chang - Head - APAC Technology ResearchConference Call ParticipantsDonnie Teng - Executive Director, Research Analyst, Greater China Semi & TechSunny Lin - AnalystDaisy Dai - Global Capital Markets Summer AnalystNone - AnalystSimon Woo - Anal ...

ASMPT (00522) Q2 2025 Earnings Call July 22, 2025 08:30 PM ET Speaker0Good morning and good evening, ladies and gentlemen. This is Leonard Lee from the ASMPT RR team, and I'll be moderating today's call. On behalf of ASMPT, welcome to our twenty twenty five second quarter investor conference call. Thank you all for your interest and continued support. Please note that all participants will be in listen only mode while the management is presenting.We will start the Q and A session after the presentation. Dur ...

Investment Rating - The report maintains a positive outlook on the semiconductor industry, particularly in advanced packaging, driven by increasing demand from AI and high power chips [2]. Core Insights - There is a growing demand for advanced packaging tools, with management indicating that both non-China and China clients are expanding their capacities, benefiting the business growth of Capcon [9][10]. - Capcon's competitive edge lies in its ability to provide tools with higher throughput, enhancing manufacturing efficiency and profitability for clients [10]. - The adoption of Fan-out Panel-level Packaging (FOPLP) technology is expected to increase, particularly with glass substrates, which are cost-effective and perform well in heat dissipation [11]. Company Profile - Capcon Semi is an equipment manufacturer specializing in semiconductor advanced assembly and packaging, offering products such as Flip-Chip Bonder and Multi-Chip Die Bonder. Key clients include ASE, TSMC, and JCET [3].