Core Insights - Super Micro Computer, Inc. (SMCI) is now shipping advanced 4-socket servers optimized for large-scale database and enterprise applications, utilizing the latest Intel Xeon 6 Processors with Performance-Cores [1][2] - These new servers are designed to support high-performance computing (HPC), mission-critical workloads, and in-memory databases, offering significantly higher performance compared to previous generations [1][6] - The servers can accommodate up to 16TB of memory and support up to 6 double-width GPUs, making them suitable for demanding enterprise needs [2][6] Product Features - The 4-socket servers are certified for SAP HANA and Oracle Linux, allowing for superior performance by scaling workloads within a single node [3] - The systems can host two double-width GPUs in a 2U configuration and up to 6 double-width GPUs in a 4U configuration, enhancing capabilities for AI training and enterprise database applications [3][4] - Performance increases of up to 50% compared to the previous generation of Intel processors are reported, with a total of up to 344 cores per system [6] Market Position - Supermicro is positioned as a global leader in Application-Optimized Total IT Solutions, committed to delivering first-to-market innovations across various sectors including Enterprise, Cloud, AI, and 5G [5] - The company emphasizes its ability to provide complete data center solutions worldwide, leveraging its DCBBS approach and production capabilities [2][5] - Supermicro's products are designed and manufactured in-house across multiple locations, optimizing for total cost of ownership (TCO) and reducing environmental impact [5]

Key Takeaways QCOM expects 2025 sales to rise 11.8% and EPS to grow 14.6%, while INTC sees a 4.3% drop in revenue. QCOM is expanding in EDGE networking and AI PCs, with strong demand in automotive and premium mobile chips. INTC is growing in AI PCs and 5G with Xeon, but faces revenue headwinds and tougher China-related challenges.Intel Corporation (INTC) and Qualcomm Incorporated (QCOM) are two premier semiconductor firms investing heavily in connectivity and edge computing, with both focusing on AI (arti ...

Key Takeaways INTC and Exostellar aim to boost AI efficiency with Gaudi accelerators and Kubernetes-native orchestration. The solution supports hybrid infrastructures with dynamic scheduling, quota control and multi-vendor access. INTC sees Gaudi 3 scaling AI with high throughput, Ethernet interconnect and open software flexibility.Intel Corporation (INTC) has partnered with Exostellar to make enterprise-grade AI infrastructure accessible in a cost-effective manner. Intel’s partnership with this leading i ...

Core Insights - Super Micro Computer, Inc. (SMCI) has announced the certification of its BigTwin Server for immersion cooling, utilizing 4th and 5th Gen Intel Xeon Scalable Processors, enhancing performance and efficiency in data centers [1][6] Group 1: Certification and Collaboration - The Supermicro BigTwin server has undergone rigorous testing and is now recognized as a certified immersion server, ensuring compatibility with Intel's guidelines and the Open Compute Project (OCP) specifications [1][4] - Supermicro's long-standing collaboration with Intel combines advanced processor technologies with high-performance solutions, ensuring that the BigTwin server remains fully functional when immersed in specified liquids [2][4] Group 2: Efficiency and Environmental Impact - Immersion cooling technology significantly lowers Power Usage Effectiveness (PUE), with data centers using Supermicro immersion servers achieving PUE values close to 1.05 or lower, thus reducing energy costs and environmental impact [3][8] - The immersion cooling method allows for denser compute configurations without increasing thermal load, improving overall energy efficiency and reducing the need for traditional air-based cooling systems [3][5] Group 3: Industry Standards and Future Outlook - Supermicro's involvement in the OCP Community has been crucial in advancing immersion cooling standards, promoting compatibility, efficiency, and scalability across data center deployments [4][5] - The growing demand for immersion-certified servers is driven by the need for efficient cooling solutions in data centers, particularly for AI and HPC applications, which require powerful processors [8]

Supermicro BigTwin System Certified for Immersion Cooling Supermicro BigTwin System Certified for Immersion Cooling "Supermicro's collaboration with Intel is a long-standing, strategic association that combines Intel's cutting-edge processor technologies with Supermicro's high-performance building block solutions, including AI, HPC, intelligent edge/IoT, networking, and storage," said Ray Pang, Senior Vice President of Technology Enablement, Supermicro. "Certifying our BigTwin server for immersion cooling w ...

Group 1: AI Semiconductor Market Overview - The AI semiconductor industry, led by Nvidia, reported a $4.5 billion asset write-down due to export restrictions, yet the overall semiconductor sector remains resilient with expected growth [1] - The global market for AI-driven processor chips and accelerators is projected to reach $457 billion by 2030, with a compound annual growth rate (CAGR) of 23% [1] Group 2: AI Data Center Chip Forecast - GPU accelerators are expected to lead the market, while ASIC accelerators may gain attention from cloud service providers like Google and Amazon [2] - Key challenges in the short term include increasing memory capacity, improving connection protocols, and addressing rising power consumption [2] Group 3: NVIDIA GB100 Chip Analysis - TechInsights analyzed the GPU chip GB102-A01 within the NVIDIA GB100-886N-A1 package, which has been removed from the Supermicro SYS-A22GA-NBRT GPU super server [3] Group 4: Autonomous Driving AI Models - The development of autonomous driving systems involves end-to-end (E2E) or composite AI (CAIS) models, with CAIS offering a more efficient and safer alternative [4] - CAIS architecture divides AI tasks into three components: Primary (P), Guardian (G), and Fallback (F), ensuring safe navigation [4] - Adoption of CAIS is limited as original equipment manufacturers prefer developing their own E2E AI models, though some manufacturers like Volkswagen and Polaris have adopted CAIS [4] Group 5: Advanced Packaging Technology - The high-performance computing (HPC) and AI markets are driving advancements in packaging technology, leading to increased adoption of 2.5D and 3D packaging solutions [5] - New interconnect technologies, such as ultra-low pitch microbumps and through-insulator vias (TIV), are being developed to reduce costs and density [5] Group 6: Semiconductor Capital Expenditure Stability - The global semiconductor supply industry has shown resilience amid macroeconomic turmoil, with AI-driven demand being a key growth driver [6] - Strong revenue growth is reported from major manufacturers like TSMC and MediaTek due to robust demand for 3nm and 5nm process technologies [6] Group 7: Power Specifications Driven by AI - The increasing power demands of AI workloads in data centers are pushing existing 54V distribution systems to their limits, prompting companies like Nvidia to explore high-voltage direct current (HVDC) architectures [7] - Two main strategies are emerging: ±400V HVDC and 800V HVDC, with the latter improving efficiency and reducing wiring needs [7] - Power semiconductor suppliers are preparing to benefit from this transition, emphasizing the need for scalable solutions and cross-market synergies [7]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自 servethehome ，谢谢。 Ampere Computing 于12 月推出了其 AmpereOne Arm 服务器 CPU （但本周公布了更多信息），但略有不同。这款新的"M"版本没有采用标准 AmpereOne 的 8 通道内存，而是增加了 12 通道内存。这一插槽升级使其功能更接近AMD EPYC 9005 Turin和Intel Xeon 6900P。让我们来看 看这次发布的产品。 AmpereOne M 为其 Arm CPU 带来 12 通道大插槽 看看安 培 (Ampere) 的 2024 年路线 图，AmpereOne M 显然已经 出 现了。 为了了解这 个 平台的 预期时间， 我 们在 2023 年台 北国际 电脑展 (Computex 2023) 的展厅里看到了 12 通道的安培 (Ampere) 平台，虽然有些房间无法拍照。2024 年第二季度，路线图显示 12 通道平台及其对 应的 CPU 似乎已经普遍可用。 Ampere 路线图 2024 年第二季度 2024年8月，我们得知AmpereOne 12通道DDR5平台（称 ...

Group 1: AI and Technology Advancements - Intel Corporation has achieved industry-first full NPU compliance in the MLPerf Client v0.6 benchmark, which assesses AI system performance, particularly for client devices like laptops and PCs [1] - The Intel Core Ultra Series 2 processors demonstrated the fastest NPU response time of 1.09 seconds and the highest NPU throughput at 18.55 tokens per second, showcasing strong AI compute capabilities [2] - Intel's Xeon 6 processors have gained significant attention for their high-performance AI processing, setting a new benchmark in 5G cloud native core [3] Group 2: Market Strategy and Expansion - Intel is venturing into the automotive market with its second-generation AI-powered software-defined vehicle system-on-chip, which offers 10x performance enhancement for generative and multimodal AI [4] - The company is on track to power over 100 million AI PCs by the end of 2025, driven by strong demand for its core Ultra Chips [3] Group 3: Financial Performance and Challenges - Intel's stock has declined by 33.3% over the past year, underperforming compared to NVIDIA's growth of 18.7% but outperforming AMD [6] - Despite heavy investments in new chip design, Intel faces challenges from competitors like AMD and NVIDIA, which have gained market share in CPUs and AI acceleration [7][8] - Intel's debt-to-capital ratio is 32%, significantly higher than the industry average of 17.3%, indicating potential liquidity concerns [9] Group 4: Earnings Estimates and Investor Sentiment - Earnings estimates for Intel for 2025 have decreased by 37.5% to $0.30, reflecting bearish sentiments among investors [11] - The trend of estimate revisions shows a significant decline, with a 66.67% drop for Q1 and a 60% drop for Q2 over the past 60 days [13]