Core Viewpoint - The company, Kytan New Materials, has confirmed that its semiconductor packaging adhesive products are being utilized in advanced packaging fields, including 3D packaging and chip stacking, meeting high customer requirements in these areas [2]. Group 1 - The company offers a series of semiconductor packaging adhesive products, including underfill, TIM, and LID bonding [2]. - These products have been applied in advanced packaging types, indicating the company's involvement in cutting-edge technology [2]. - The company emphasizes its ability to precisely match customer demands in the advanced packaging segment [2].