Core Viewpoint - The company, Kytan New Materials, has confirmed that its semiconductor packaging adhesive products are being utilized in advanced packaging fields, including 3D packaging and chip stacking, meeting high customer requirements in these areas [2]. Group 1 - The company offers a series of semiconductor packaging adhesive products, including underfill, TIM, and LID bonding [2]. - These products have been applied in advanced packaging types, indicating the company's involvement in cutting-edge technology [2]. - The company emphasizes its ability to precisely match customer demands in the advanced packaging segment [2].

on 24-Sep-2025 24 September 2025 Global Semis Global Semis: SiC for advanced packaging? Identifying the investment opportunities David Dai, CFA +852 2918 5704 david.dai@bernsteinsg.com Mark Li +852 2123 2645 mark.li@bernsteinsg.com Juho Hwang +852 2123 2632 juho.hwang@bernsteinsg.com Carmine Milano +44 207 762 1857 carmine.milano@bernsteinsg.com Edward Hou, CFA +852 2123 2623 edward.hou@bernsteinsg.com Yipin Cai, CFA +852 2123 2669 yipin.cai@bernsteinsg.com According to news reports, TSMC is considering usi ...