Core Viewpoint - The semiconductor industry is transitioning from "device scaling" to "architectural innovation," with advanced packaging technologies like Fan-Out Wafer Level Packaging (FOWLP), Chiplet heterogeneous integration, and 3D stacking becoming essential for overcoming performance bottlenecks [1][3]. Group 1: Advanced Packaging Technologies - Advanced packaging technologies are critical for enhancing performance in the semiconductor industry, especially as traditional scaling approaches reach physical limits [1]. - The demand for advanced packaging materials is driven by the rapid growth in AI and automotive electronics, necessitating higher density, lower power consumption, and improved thermal management [3][5]. Group 2: Innovations in Packaging Materials - Henkel has introduced LOCTITE® ECCOBOND LCM 1000AG-1, a low-stress, ultra-low warpage liquid compression molding material suitable for wafer-level packaging and FOWLP, specifically designed to support AI chips [5]. - The company has developed a liquid molding bottom fill adhesive that simplifies processes by merging filling and encapsulation steps, enhancing packaging efficiency and reliability [5]. - Henkel's new capillary bottom fill adhesive for system-on-chip applications optimizes high flow performance, ensuring uniform flow and rapid filling while reducing stress damage during packaging [5][6]. Group 3: Automotive Electronics - The rise of electric vehicles and autonomous driving technologies has created new challenges for semiconductor packaging materials, requiring high thermal conductivity and reliability under extreme conditions [7][9]. - Henkel has launched several innovative solutions for automotive applications, including LOCTITE® ABLESTIK ABP 6395TC, designed for high reliability and thermal conductivity, suitable for power devices and automotive electronics [9]. - Another product, LOCTITE® ABLESTIK ABP 8068TH, utilizes pressure-less silver sintering technology, offering low stress and high thermal conductivity, making it ideal for semiconductor packaging [9][10]. Group 4: Sustainability and Localization - Henkel is committed to sustainability, developing tools to assess carbon footprints and promoting eco-friendly packaging solutions, such as 100% PCR resin tubes [11]. - The company is enhancing its local operations in China, with significant investments in R&D and production capabilities, including the recent establishment of a new factory in Yantai [11]. - Henkel's focus on material innovation and local partnerships aims to strengthen its position in the advanced packaging market and contribute to the sustainable development of the semiconductor industry [11][12].