Lowα球铝
Search documents
联瑞新材:公司应用于M9级高性能电子电路基板的球硅产品已与行业主流厂商形成深度合作
Zheng Quan Ri Bao Wang· 2026-02-05 11:49
Core Viewpoint - The company has established deep collaborations with mainstream manufacturers in the industry for its ball silicon products used in M9-level high-performance electronic circuit substrates, leading to small batch sales [1] Group 1 - The company's Lowα ball aluminum, a key filler for advanced packaging, is experiencing rapid sales growth and has become one of the few manufacturers capable of mass production of this material [1]