Core Viewpoint - Huayu Electronics has officially submitted its IPO application to the Shanghai Stock Exchange, focusing on integrated circuit packaging and testing services [1][2] Group 1: Company Overview - Huayu Electronics specializes in integrated circuit packaging and testing, with its headquarters in Chizhou and subsidiaries in Shenzhen, Wuxi, and Hefei, enhancing collaboration with global clients [1] - The company offers over 130 types of packaging and testing services, including SOP, QFN/DFN, SOT, TO, LQFP, LGA, FCLGA, BGA, and FCBGA [1] - Huayu Electronics has developed core technologies in multi-chip module (MCM) packaging, 3D stacking packaging, and high-density micro-spacing integrated circuit packaging, establishing a strong competitive position in the industry [1] Group 2: Testing Capabilities - The company has developed multiple core technologies in testing, covering wafer sizes of 12-inch, 8-inch, 6-inch, 5-inch, and 4-inch, including processes of 22nm, 28nm, and above [2] - Huayu Electronics has created over 30 testing solutions for various chips, including MCU, ADC, FPGA, GPU, video, RF, SoC, digital signal processing, automotive sensors, storage, optical sensors, mixed-signal, fingerprint recognition, and magnetic sensors [2] - The company has successfully implemented self-developed equipment such as 3D tape machines and fingerprint sorting machines in production [2] Group 3: Application Fields and Client Relationships - The applications of Huayu Electronics' packaging and testing products span across 5G communications, automotive electronics, industrial control, consumer products, smart home, smart positioning, information security, fire safety, and wearable technology [2] - The company has established long-term partnerships with well-known industry players such as BYD, Zhongke Lanyun, Jichuang Beifang, and others [2] Group 4: IPO Details - Huayu Electronics aims to raise 400 million yuan through its IPO to fund projects related to digital transformation of large-capacity memory and RF module packaging, as well as to support wafer testing and chip product testing in Hefei [2]