Company Summary - Yongxi Electronics (SH 688362) announced on September 2 that as of August 31, 2025, it has repurchased approximately 2.56 million shares through the Shanghai Stock Exchange, accounting for 0.63% of the total share capital of approximately 410 million shares. The highest repurchase price was 31.8 CNY per share, and the lowest was 23.79 CNY per share, with a total expenditure of approximately 68.52 million CNY [1][1][1] - For the fiscal year 2024, Yongxi Electronics reported that its revenue composition is as follows: integrated circuit packaging and testing accounted for 97.96%, while other businesses contributed 2.04% [1][1][1] - As of the report date, Yongxi Electronics has a market capitalization of 14.5 billion CNY [1][1][1]

中信建投证券股份有限公司 关于合肥颀中科技股份有限公司 保荐人名称：中信建投证券股份有限 上市公司名称：合肥颀中科技股份有限 公司 公司 联系方式：021-68801584 保荐代表人姓名：吴建航 联系地址：上海市浦东新区浦东南路 联系方式：021-68801584 保荐代表人姓名：廖小龙 联系地址：上海市浦东新区浦东南路 经中国证券监督管理委员会（简称"中国证监会"）"证监许可〔2023〕415 号文"批准，合肥颀中科技股份有限公司（简称"公司"或"颀中科技"）向社 会公开发行人民币普通股 200,000,000 股。公司本次发行新股的发行价为 12.10 元/股，募集资金总额人民币 2,420,000,000.00 元，扣除发行费用合计人民币 票于 2023 年 4 月 20 日在上海证券交易所上市。中信建投证券股份有限公司（简 称"中信建投证券"）担任本次公开发行股票的保荐人。根据《证券发行上市保荐 业务管理办法》，由中信建投证券完成持续督导工作，出具本 2025 年半年度持 续督导跟踪报告。 一、持续督导工作情况 工作内容 持续督导情况 保荐人已建立健全并有效执行了 建立健全并有效执行持续督导工作制 ...

每经AI快讯，通富微电（SZ 002156，收盘价：30.08元）8月28日晚间发布公告称，公司第八届第十三 次董事会会议于2025年8月27日以通讯表决方式召开。会议审议了《公司2025年半年度报告及摘要》等 文件。 2024年1至12月份，通富微电的营业收入构成为：集成电路封装测试占比95.97%，模具及材料销售占比 4.03%。 截至发稿，通富微电市值为456亿元。 每经头条（nbdtoutiao）——世界首例基因编辑猪肺成功移植人体 对话主要参与者：距离临床应用还有 多远？ （记者 王晓波） ...

（编辑 袁冠琳） 证券日报网讯 通富微电8月7日在互动平台回答投资者提问时表示，公司主营集成电路封装测试业务， 公司客户资源覆盖国际巨头企业以及各个细分领域龙头企业，大多数世界前20强半导体企业和绝大多数 国内知名集成电路设计公司都已成为公司客户。 ...

Core Viewpoint - Huayu Electronics has officially submitted its IPO application to the Shanghai Stock Exchange, focusing on integrated circuit packaging and testing services [1][2] Group 1: Company Overview - Huayu Electronics specializes in integrated circuit packaging and testing, with its headquarters in Chizhou and subsidiaries in Shenzhen, Wuxi, and Hefei, enhancing collaboration with global clients [1] - The company offers over 130 types of packaging and testing services, including SOP, QFN/DFN, SOT, TO, LQFP, LGA, FCLGA, BGA, and FCBGA [1] - Huayu Electronics has developed core technologies in multi-chip module (MCM) packaging, 3D stacking packaging, and high-density micro-spacing integrated circuit packaging, establishing a strong competitive position in the industry [1] Group 2: Testing Capabilities - The company has developed multiple core technologies in testing, covering wafer sizes of 12-inch, 8-inch, 6-inch, 5-inch, and 4-inch, including processes of 22nm, 28nm, and above [2] - Huayu Electronics has created over 30 testing solutions for various chips, including MCU, ADC, FPGA, GPU, video, RF, SoC, digital signal processing, automotive sensors, storage, optical sensors, mixed-signal, fingerprint recognition, and magnetic sensors [2] - The company has successfully implemented self-developed equipment such as 3D tape machines and fingerprint sorting machines in production [2] Group 3: Application Fields and Client Relationships - The applications of Huayu Electronics' packaging and testing products span across 5G communications, automotive electronics, industrial control, consumer products, smart home, smart positioning, information security, fire safety, and wearable technology [2] - The company has established long-term partnerships with well-known industry players such as BYD, Zhongke Lanyun, Jichuang Beifang, and others [2] Group 4: IPO Details - Huayu Electronics aims to raise 400 million yuan through its IPO to fund projects related to digital transformation of large-capacity memory and RF module packaging, as well as to support wafer testing and chip product testing in Hefei [2]

299.90%。2025 年第一季度，公司实现营业收入 60.92 亿元，同 比增长 15.34%；公司实现归属于母公司股东的净利润 1.01 亿元， 同比增长 2.94%。其他 2024 年度及 2025 年第一季度详细情况， 可以关注公司对外披露的公告。 四、投资者关注的主要问题 证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2025-003 | 投资者关系活动 | ☑特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 东北证券：黄磊；国信证券：胡剑 | | 人员姓名 | | | 时间 | 2025 年 6 月 25 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 设计仿真和封装测试一站式服务。公司的产品、技术、服务全方 ...

通富微电：大多数世界前20强半导体企业和绝大多数国内知名集成电路设计公司都已成为公司客户 金十数据5月22日讯，就公司与小米公司的玄戒O1项目是否有合作的问题，通富微电5月22日在互动平 台表示，公司主营集成电路封装测试业务，公司客户资源覆盖国际巨头企业以及各个细分领域龙头企 业，大多数世界前20强半导体企业和绝大多数国内知名集成电路设计公司都已成为公司客户。 ...

Company Overview - Tongfu Microelectronics is an integrated circuit packaging and testing service provider, offering one-stop services for design simulation and packaging testing across various fields including AI, high-performance computing, and 5G [2][5] - The company has established production bases in multiple locations, including Jiangsu, Anhui, and Malaysia, enhancing its ability to serve clients locally [2][3] - In 2024, the company acquired a 26% stake in Jinglong Technology, which is expected to improve investment returns and create more value for shareholders [2][3] Financial Performance - Revenue for 2021, 2022, 2023, and 2024 was 15.812 billion, 21.429 billion, 22.269 billion, and 23.882 billion CNY respectively [3] - Net profit for the same years was 0.957 billion, 0.502 billion, 0.169 billion, and 0.678 billion CNY respectively [3] - In Q1 2025, revenue reached 6.092 billion CNY, a 15.34% increase year-on-year, with net profit of 0.101 billion CNY, a 2.94% increase [4] Industry Trends - The semiconductor industry is entering an upward cycle, with global semiconductor sales expected to reach 627.6 billion USD in 2024, a 19.1% increase from 2023 [3] - Memory products, particularly high-performance DRAM and server SSDs, are projected to grow significantly, with memory product growth rates reaching 75.6% [3] - The global integrated circuit packaging and testing market is expected to reach 82 billion USD in 2024, a 7.8% increase [3] Business Operations - The company has seen significant growth in its core areas, including a 46% increase in mobile SOC and over 200% growth in automotive products [6][7] - In 2024, the company applied for 95 patents, achieving a total of 142 authorized patents, reflecting its commitment to innovation [7][9] - The company plans to invest 6 billion CNY in 2025 for facility construction, production equipment, IT, and R&D [12] Strategic Initiatives - The company is focusing on high-value products and advanced packaging technologies, including Chiplet and 2D+ packaging [5][6] - It has successfully localized procurement for over 100 materials, significantly reducing costs [7] - The company is enhancing its market share in advanced packaging through strategic collaborations with international clients [8]

不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 5月19日消息，通富微电公告，持有公司股份13315.6578万股（占公司总股本比例8.77%）的股东国家集 成电路产业投资基金股份有限公司计划在本减持计划公告发布之日起15个交易日后的3个月内（即2025 年6月11日至2025年9月8日），以集中竞价或大宗交易方式减持持有的公司股份不超过3793.9922万股 （即不超过公司股份总数的2.5%）。 国家集成电路产业投资基金俗称"大基金"，是国内规模最大的产业投资基金。 工信部官网显示，设立大基金是贯彻《国家集成电路产业发展推进纲要》的重要举措，也是适应集成电 路产业投资大风险高的产业特征、破解集成电路产业融资瓶颈、创新产业投资体制机制的积极探索。 2019年，大基金一期过了五年投资期之后，按照其自身规划，将进入回收期，开始分阶段退出。同年10 月，大基金二期成立，注册资本达2041.5亿元。 值得一提的是，大基金三期也在2024年5月成立，旨在引导社会资本加大对集成电路产业的多渠道融资 支持，重点投向集成电路全产业链。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 通富微电是集成电路封装测试 ...