证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-003 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 中大君悦：陈修能、曲芳；东吴证券：刘玥娇；彤源：麦世学； | | 人员姓名 | 农银汇理基金：张璋；华宝信托：张卿隆；太平养老：张凯；华 | | | 源电子：熊宇翔；弘毅远方：陈祥辉；源乐晟：吴雨哲；博衍基 | | | 金：卢湛 | | 时间 2026 | 年 1 月 29 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 | | 5G | 等网络通讯、信息终端 ...

通富微电子股份有限公司投资者关系活动记录表 编号：2026-002 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 平安证券：陈福栋；弢盛资产：陶星辰；博时基金：赵宪成；工 | | 人员姓名 | 银瑞信：万力实；摩根基金：宋敬祎；国联民生：王晔；南方基 | | | 金：竺绍迪、吴春林；中信证券：王子源；富国基金：罗擎；长 | | | 城基金：余泽璇；长江资管：杨书权；中庚基金：徐润齐；平安 | | | 基金：江正清；长信基金：袁梦镜；银河基金：黄心叶；财通证 | | | 券：唐佳、詹小瑁；泉果基金：赵浩 | | 时间 | 2026 年 1 月 21 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、 ...

公司先后在江苏南通崇川、南通苏通科技产业园、安徽合肥、福建厦门、南通市北高新（600604）区建 厂布局；通过收购AMD苏州及AMD槟城各85%股权，在江苏苏州、马来西亚槟城拥有生产基地。2024 年，公司与相关方签订《股权买卖协议》，以自有资金收购京隆科技26%股权，京隆科技运营模式和财 务状况良好，其在高端集成电路专业测试领域具备差异化竞争优势。公司已于2025年2月13日完成交割 并支付了相关股权购买价款，公司收购京隆科技部分股权可提高公司投资收益，为公司带来稳定的财务 回报，为全体股东创造更多价值。 1月20日，通富微电（002156）公告，预计2025年度归母净利润为11亿元至13.5亿元，比上年同期增长 62.34%至99.24%。扣除非经常性损益后的净利润预计为7.7亿元至9.7亿元，增长幅度为23.98%至 56.18%。基本每股收益预计为0.72元至0.89元，较上年同期的0.45元有所提升。 公告称，业绩增长的主要原因是全球半导体行业的结构性增长，公司积极提高产能利用率，营业收入明 显上升，尤其是中高端产品的销售额显著增加。此外，公司通过加强经营管理和成本控制，整体效益得 到了显著提升，并 ...

Core Viewpoint - The company, Tongfu Microelectronics (002156), is a provider of integrated circuit packaging and testing services, offering a one-stop service from design simulation to packaging testing for global clients [1] Group 1: Company Overview - The company covers a wide range of products, technologies, and services across various fields including artificial intelligence, high-performance computing, big data storage, display drivers, 5G communications, information terminals, consumer terminals, the Internet of Things, automotive electronics, and industrial control, meeting diverse customer needs [1] Group 2: Market Strategy - The company is seizing market development opportunities by focusing on high value-added products and trending market directions, with a long-term vision [1] - The company is actively developing advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging while expanding its production capacity [1] - Additionally, the company is strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+, creating a differentiated competitive advantage [1]

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-001 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 鹏扬基金：章宏帆；泰康资产：余思雨；申万菱信：徐巡；拾贝 | | 人员姓名 | 投资：王祥宇；鑫元基金：施欣彤；南方基金：葛树名、金岚枫； | | | 兴银基金：阮姝漫；道仁资产：李晓光；汇丰晋信：刘昱辰；汇 | | | 添富：钱晨润；长江证券：钟智铧；丹羿投资：朱亮 | | 时间 | 2026 年 1 月 16 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 ...

Group 1 - The company Tongfu Microelectronics (SZ 002156) announced that its 15th meeting of the 8th board of directors was held via telecommunication on November 28, 2025, to review the proposal for amending the "Board Meeting Rules" [1] - For the first half of 2025, the company's revenue composition was 96.98% from integrated circuit packaging and testing, and 3.02% from the sales of molds and materials [1] - As of the report, Tongfu Microelectronics has a market capitalization of 55.6 billion yuan [1]

Core Viewpoint - The company, Qizhong Technology (688352), has demonstrated strong growth in its main business of integrated circuit packaging and testing, with a notable increase in revenue and a focus on technological innovation and customer relationships [10]. Group 1: Customer Structure - The company's current OLED customer base includes notable clients such as Ruiding, Yunyin Valley, Jichuang North, Lianying, Shengxianwei, Xinying, Yisiwei, and Yuchuang [2]. Group 2: Competitive Advantages - The company possesses outstanding technological research and innovation capabilities, having developed proprietary technologies in the field of display driver chip packaging, including high-reliability manufacturing techniques for fine-pitch gold bumps and core component design technologies [4]. - The company has a strong advantage in technical transformation and software/hardware development, with a specialized team of over 20 professionals dedicated to smart manufacturing and equipment modification [5]. - The management team is experienced and stable, primarily composed of internally trained personnel with over 15 years of experience in the advanced packaging and testing industry, which supports the company's leading position in the market [5]. Group 3: Pricing Trends and Order Visibility - The company aims to maintain stable pricing as a priority, with future adjustments based on market supply and demand conditions [7]. - Currently, customers typically provide a demand forecast of about three months [8]. Group 4: Financial Performance - For the first three quarters of 2025, the company reported a main revenue of 1.605 billion yuan, an increase of 11.8% year-on-year, while the net profit attributable to shareholders decreased by 19.2% to 185 million yuan [10]. - The gross profit margin for the company stands at 28.6% [10]. Group 5: Market Ratings and Predictions - In the last 90 days, four institutions have rated the stock, with three buy ratings and one hold rating [11]. - Detailed profit forecasts from various institutions indicate expected net profits of 336 million yuan for 2025, 400 million yuan for 2026, and 510 million yuan for 2027 [12].

Core Viewpoint - Tongfu Microelectronics is a leading integrated circuit packaging and testing company, achieving significant revenue and profit growth in the semiconductor industry, driven by advanced packaging demands, particularly from AI applications [2][6]. Group 1: Company Overview - Tongfu Microelectronics was established on February 4, 1994, and listed on the Shenzhen Stock Exchange on August 16, 2007. The company is headquartered in Nantong, Jiangsu Province, and is recognized for its full industry chain service capabilities in integrated circuit packaging and testing [1]. - The company operates in various sectors, including semiconductor packaging, storage, nuclear fusion, superconductivity, and nuclear power [1]. Group 2: Financial Performance - In Q3 2025, Tongfu Microelectronics reported a revenue of 20.116 billion yuan, ranking second among 13 companies in the industry. The top competitor, Changjiang Electronics Technology, achieved a revenue of 28.669 billion yuan, while the industry average was 5.49 billion yuan [2]. - The net profit for the same period was 999.4 million yuan, the highest in the industry, with Changjiang Electronics' net profit at 951 million yuan and the industry average at 250 million yuan [2]. Group 3: Financial Ratios - As of Q3 2025, the company's debt-to-asset ratio was 63.04%, an increase from 59.46% year-on-year and above the industry average of 40.98% [3]. - The gross profit margin was reported at 15.26%, up from 14.33% year-on-year but still below the industry average of 20.20% [3]. Group 4: Shareholder Information - As of September 30, 2025, the number of A-share shareholders increased by 27.05% to 350,700, with an average holding of 4,327.16 shares, a decrease of 21.29% [5]. - Among the top ten shareholders, Hong Kong Central Clearing Limited held 53.7918 million shares, an increase of 28.7179 million shares from the previous period [5]. Group 5: Market Outlook - Huachuang Securities noted that Tongfu Microelectronics achieved record high performance in Q3 2025, driven by the recovery of industry demand and product structure optimization. The company is well-positioned to benefit from the growing demand for advanced packaging driven by AI [6]. - Dongguan Securities highlighted the company's continuous high growth in operating performance, particularly in mid-to-high-end product revenues, and its strategic partnership with AMD as a core packaging supplier [6].

Core Viewpoint - Huatian Technology (002185.SZ), a major player in the domestic semiconductor packaging and testing industry, announced plans to acquire 100% of Huayi Microelectronics, aiming to enhance its business scope and create a second growth curve through this strategic acquisition [1][7]. Group 1: Acquisition Details - The acquisition will be executed through a combination of issuing shares and cash payments, along with raising supporting funds [1]. - Huayi Microelectronics specializes in semiconductor power devices and has a complete capability from chip design to packaging and testing [1][7]. - The acquisition is expected to help Huatian Technology expand its power device packaging and testing business, thereby enhancing its overall business layout [7]. Group 2: Financial Performance - Huatian Technology reported a revenue of 11.298 billion in 2023, a decrease of 5.10% year-on-year, with a net profit of 226 million, down 69.98% [8]. - In 2024, the company achieved a revenue of 14.462 billion and a net profit of 616 million, marking a year-on-year growth of 28% and 172.29%, respectively [8]. - Huayi Microelectronics had total assets of approximately 2.4 billion as of August 2025, with an expected profit exceeding 30 million in Q3 2025, representing a growth of about 80% quarter-on-quarter [2][11]. Group 3: Strategic Importance - The acquisition is categorized as a related party transaction, with Huatian Electronics Group being the controlling shareholder of Huatian Technology [4][5]. - Both companies are expected to benefit from synergies, maximizing customer resource value and enhancing customer loyalty through a more comprehensive product and service offering [11]. - Huayi Microelectronics has a strong client base, including well-known companies such as BYD and DJI, which could enhance Huatian Technology's market position post-acquisition [11].

Core Viewpoint - Huatian Technology resumed trading on October 17 after announcing a restructuring plan, opening with a limit-up at 12.96 CNY per share, resulting in a total market capitalization of 41.85 billion CNY [1][2]. Group 1: Restructuring Announcement - On October 16, Huatian Technology announced plans to acquire 100% of Huayi Microelectronics through a combination of share issuance and cash payment, involving 27 counterparties [3][5]. - Huayi Microelectronics is recognized as a high-tech enterprise in China, specializing in power device R&D, packaging testing, reliability verification, and system solutions [3][5]. Group 2: Business Focus and Growth Strategy - Huatian Technology primarily focuses on integrated circuit packaging and testing, having mastered various advanced packaging technologies [4]. - The acquisition aims to enhance Huatian's packaging and testing business, expanding into power device packaging and creating a comprehensive service offering across various segments [5]. Group 3: Financial Performance - Huatian Technology's revenue from 2021 to 2024 showed fluctuations: 120.97 billion CNY (2021), 119.06 billion CNY (2022), 112.98 billion CNY (2023), and 144.62 billion CNY (2024), with a notable growth of 28% in 2024 [7]. - The net profit figures for the same period were 14.16 billion CNY (2021), 7.54 billion CNY (2022), 2.26 billion CNY (2023), and 6.16 billion CNY (2024), indicating a significant recovery in 2024 with a growth of 172.29% [7]. - In the first half of 2025, Huatian achieved a revenue of 77.80 billion CNY, reflecting a year-on-year growth of 15.81% [8].