私募开年密集调研 机构2026年进攻方向，或可从其1月调研路径窥得端倪。据私募排排网统计，1月有近660家私募参与A 股调研活动，合计调研频次超1700次。分行业来看，计算机、机械设备、医药生物和电子等板块备受关 注。在一些业内人士看来，尽管2025年科技板块整体涨幅显著，但从产业趋势和企业盈利情况来看，现 在远未行至"泡沫阶段"，尤其是半导体和AI应用值得重点挖掘。 私募排排网最新统计数据显示，2026年1月共有659家私募参与A股公司调研活动，覆盖了28个申万一级 行业中的332只标的，合计调研频次达1719次。 1月16日，丹羿投资创始人朱亮则调研了通富微电。据公开资料，通富微电是集成电路封装测试服务提 供商，开源证券研究报告分析称，算力产业已开启"军备竞赛"，国产算力跨越式发展的背景下，本土AI 算力芯片蓬勃发展，相关产业链迎来发展窗口，通富微电有望深度受益。 AI基建与应用受关注 私募机构认为，在AI产业高速发展的过程中，机会将持续涌现，科技仍将是2026年不可忽视的投资主 线之一。 畅力资产董事长宝晓辉分析称，作为AI产业的基建，半导体设备领域值得关注。具体来看，当前AI行 业的发展逻辑已发生转变 ...

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-003 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 中大君悦：陈修能、曲芳；东吴证券：刘玥娇；彤源：麦世学； | | 人员姓名 | 农银汇理基金：张璋；华宝信托：张卿隆；太平养老：张凯；华 | | | 源电子：熊宇翔；弘毅远方：陈祥辉；源乐晟：吴雨哲；博衍基 | | | 金：卢湛 | | 时间 2026 | 年 1 月 29 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 | | 5G | 等网络通讯、信息终端 ...

Company Overview - Tongfu Microelectronics is a provider of integrated circuit packaging and testing services, offering a one-stop service from design simulation to packaging and testing for global clients [2][4] - The company operates nine production bases globally, including locations in Jiangsu, Anhui, and Malaysia, employing over 20,000 staff [3] - Major shareholder is Nantong Huada Microelectronics Group, with stable ownership structure [2] Financial Performance - Revenue for 2022, 2023, 2024, and the first three quarters of 2025 were CNY 21.429 billion, CNY 22.269 billion, CNY 23.882 billion, and CNY 20.116 billion respectively [3] - Net profit attributable to shareholders for the same periods were CNY 0.502 billion, CNY 0.169 billion, CNY 0.678 billion, and CNY 0.860 billion [3] - Projected net profit for 2025 is estimated between CNY 1.1 billion and CNY 1.35 billion, indicating a year-on-year growth of 62.34% to 99.24% [11] Investment and Growth Strategy - The company plans to invest CNY 1.0995580 billion to enhance packaging capacity in emerging automotive applications, aiming to add 50.4 million units annually [7][8] - Focus on high-value products and market trends, including advanced packaging technologies like Chiplet and 2D+ [4][5] - The investment projects are aligned with the strategic goal of building a resilient domestic semiconductor supply chain [5][6] Key Technology and Market Position - The company emphasizes the importance of wafer-level packaging as a critical technology for high-performance chips, enhancing signal integrity and reducing latency [9][10] - Plans to strengthen capabilities in advanced packaging to support high-end computing and automotive sectors [10] Investor Engagement - The company held an investor relations activity on January 21, 2026, with participation from various financial institutions [2] - The issuance of shares targets up to 35 specific investors, including asset management companies and qualified foreign institutional investors [7]

公司先后在江苏南通崇川、南通苏通科技产业园、安徽合肥、福建厦门、南通市北高新（600604）区建 厂布局；通过收购AMD苏州及AMD槟城各85%股权，在江苏苏州、马来西亚槟城拥有生产基地。2024 年，公司与相关方签订《股权买卖协议》，以自有资金收购京隆科技26%股权，京隆科技运营模式和财 务状况良好，其在高端集成电路专业测试领域具备差异化竞争优势。公司已于2025年2月13日完成交割 并支付了相关股权购买价款，公司收购京隆科技部分股权可提高公司投资收益，为公司带来稳定的财务 回报，为全体股东创造更多价值。 1月20日，通富微电（002156）公告，预计2025年度归母净利润为11亿元至13.5亿元，比上年同期增长 62.34%至99.24%。扣除非经常性损益后的净利润预计为7.7亿元至9.7亿元，增长幅度为23.98%至 56.18%。基本每股收益预计为0.72元至0.89元，较上年同期的0.45元有所提升。 公告称，业绩增长的主要原因是全球半导体行业的结构性增长，公司积极提高产能利用率，营业收入明 显上升，尤其是中高端产品的销售额显著增加。此外，公司通过加强经营管理和成本控制，整体效益得 到了显著提升，并 ...

Core Viewpoint - The company, Tongfu Microelectronics (002156), is a provider of integrated circuit packaging and testing services, offering a one-stop service from design simulation to packaging testing for global clients [1] Group 1: Company Overview - The company covers a wide range of products, technologies, and services across various fields including artificial intelligence, high-performance computing, big data storage, display drivers, 5G communications, information terminals, consumer terminals, the Internet of Things, automotive electronics, and industrial control, meeting diverse customer needs [1] Group 2: Market Strategy - The company is seizing market development opportunities by focusing on high value-added products and trending market directions, with a long-term vision [1] - The company is actively developing advanced packaging technologies such as fan-out, wafer-level, and flip-chip packaging while expanding its production capacity [1] - Additionally, the company is strategically positioning itself in cutting-edge packaging technologies like Chiplet and 2D+, creating a differentiated competitive advantage [1]

证券代码：002156 证券简称：通富微电 通富微电子股份有限公司投资者关系活动记录表 编号：2026-001 | 投资者关系活动 ☑ | 特定对象调研 □分析师会议 | | --- | --- | | 类别 | □媒体采访 □业绩说明会 | | | □新闻发布会 □路演活动 | | | □现场参观 | | | □其他 （请文字说明其他活动内容） | | 参与单位名称及 | 鹏扬基金：章宏帆；泰康资产：余思雨；申万菱信：徐巡；拾贝 | | 人员姓名 | 投资：王祥宇；鑫元基金：施欣彤；南方基金：葛树名、金岚枫； | | | 兴银基金：阮姝漫；道仁资产：李晓光；汇丰晋信：刘昱辰；汇 | | | 添富：钱晨润；长江证券：钟智铧；丹羿投资：朱亮 | | 时间 | 2026 年 1 月 16 日 | | 地点 | 公司会议室 | | 上市公司接待人 | 董事会秘书 蒋澍 | | 员姓名 | | | | 一、公司概况 | | | 通富微电是集成电路封装测试服务提供商，为全球客户提供 | | | 从设计仿真到封装测试的一站式服务。公司的产品、技术、服务 | | | 全方位覆盖了人工智能、高性能计算、大数据存储、显示驱动、 ...

Group 1 - The company Tongfu Microelectronics (SZ 002156) announced that its 15th meeting of the 8th board of directors was held via telecommunication on November 28, 2025, to review the proposal for amending the "Board Meeting Rules" [1] - For the first half of 2025, the company's revenue composition was 96.98% from integrated circuit packaging and testing, and 3.02% from the sales of molds and materials [1] - As of the report, Tongfu Microelectronics has a market capitalization of 55.6 billion yuan [1]

Core Viewpoint - The company, Qizhong Technology (688352), has demonstrated strong growth in its main business of integrated circuit packaging and testing, with a notable increase in revenue and a focus on technological innovation and customer relationships [10]. Group 1: Customer Structure - The company's current OLED customer base includes notable clients such as Ruiding, Yunyin Valley, Jichuang North, Lianying, Shengxianwei, Xinying, Yisiwei, and Yuchuang [2]. Group 2: Competitive Advantages - The company possesses outstanding technological research and innovation capabilities, having developed proprietary technologies in the field of display driver chip packaging, including high-reliability manufacturing techniques for fine-pitch gold bumps and core component design technologies [4]. - The company has a strong advantage in technical transformation and software/hardware development, with a specialized team of over 20 professionals dedicated to smart manufacturing and equipment modification [5]. - The management team is experienced and stable, primarily composed of internally trained personnel with over 15 years of experience in the advanced packaging and testing industry, which supports the company's leading position in the market [5]. Group 3: Pricing Trends and Order Visibility - The company aims to maintain stable pricing as a priority, with future adjustments based on market supply and demand conditions [7]. - Currently, customers typically provide a demand forecast of about three months [8]. Group 4: Financial Performance - For the first three quarters of 2025, the company reported a main revenue of 1.605 billion yuan, an increase of 11.8% year-on-year, while the net profit attributable to shareholders decreased by 19.2% to 185 million yuan [10]. - The gross profit margin for the company stands at 28.6% [10]. Group 5: Market Ratings and Predictions - In the last 90 days, four institutions have rated the stock, with three buy ratings and one hold rating [11]. - Detailed profit forecasts from various institutions indicate expected net profits of 336 million yuan for 2025, 400 million yuan for 2026, and 510 million yuan for 2027 [12].

Core Viewpoint - Tongfu Microelectronics is a leading integrated circuit packaging and testing company, achieving significant revenue and profit growth in the semiconductor industry, driven by advanced packaging demands, particularly from AI applications [2][6]. Group 1: Company Overview - Tongfu Microelectronics was established on February 4, 1994, and listed on the Shenzhen Stock Exchange on August 16, 2007. The company is headquartered in Nantong, Jiangsu Province, and is recognized for its full industry chain service capabilities in integrated circuit packaging and testing [1]. - The company operates in various sectors, including semiconductor packaging, storage, nuclear fusion, superconductivity, and nuclear power [1]. Group 2: Financial Performance - In Q3 2025, Tongfu Microelectronics reported a revenue of 20.116 billion yuan, ranking second among 13 companies in the industry. The top competitor, Changjiang Electronics Technology, achieved a revenue of 28.669 billion yuan, while the industry average was 5.49 billion yuan [2]. - The net profit for the same period was 999.4 million yuan, the highest in the industry, with Changjiang Electronics' net profit at 951 million yuan and the industry average at 250 million yuan [2]. Group 3: Financial Ratios - As of Q3 2025, the company's debt-to-asset ratio was 63.04%, an increase from 59.46% year-on-year and above the industry average of 40.98% [3]. - The gross profit margin was reported at 15.26%, up from 14.33% year-on-year but still below the industry average of 20.20% [3]. Group 4: Shareholder Information - As of September 30, 2025, the number of A-share shareholders increased by 27.05% to 350,700, with an average holding of 4,327.16 shares, a decrease of 21.29% [5]. - Among the top ten shareholders, Hong Kong Central Clearing Limited held 53.7918 million shares, an increase of 28.7179 million shares from the previous period [5]. Group 5: Market Outlook - Huachuang Securities noted that Tongfu Microelectronics achieved record high performance in Q3 2025, driven by the recovery of industry demand and product structure optimization. The company is well-positioned to benefit from the growing demand for advanced packaging driven by AI [6]. - Dongguan Securities highlighted the company's continuous high growth in operating performance, particularly in mid-to-high-end product revenues, and its strategic partnership with AMD as a core packaging supplier [6].

Core Viewpoint - Huatian Technology (002185.SZ), a major player in the domestic semiconductor packaging and testing industry, announced plans to acquire 100% of Huayi Microelectronics, aiming to enhance its business scope and create a second growth curve through this strategic acquisition [1][7]. Group 1: Acquisition Details - The acquisition will be executed through a combination of issuing shares and cash payments, along with raising supporting funds [1]. - Huayi Microelectronics specializes in semiconductor power devices and has a complete capability from chip design to packaging and testing [1][7]. - The acquisition is expected to help Huatian Technology expand its power device packaging and testing business, thereby enhancing its overall business layout [7]. Group 2: Financial Performance - Huatian Technology reported a revenue of 11.298 billion in 2023, a decrease of 5.10% year-on-year, with a net profit of 226 million, down 69.98% [8]. - In 2024, the company achieved a revenue of 14.462 billion and a net profit of 616 million, marking a year-on-year growth of 28% and 172.29%, respectively [8]. - Huayi Microelectronics had total assets of approximately 2.4 billion as of August 2025, with an expected profit exceeding 30 million in Q3 2025, representing a growth of about 80% quarter-on-quarter [2][11]. Group 3: Strategic Importance - The acquisition is categorized as a related party transaction, with Huatian Electronics Group being the controlling shareholder of Huatian Technology [4][5]. - Both companies are expected to benefit from synergies, maximizing customer resource value and enhancing customer loyalty through a more comprehensive product and service offering [11]. - Huayi Microelectronics has a strong client base, including well-known companies such as BYD and DJI, which could enhance Huatian Technology's market position post-acquisition [11].