Flash | Advantages of ultrafast laser drilling equipment – With minimum line width of 10µm (micrometers), ultrafast laser drilling equipment is ideal to process PCBs on 1.6T optical transceivers (60/40µm vs. 75µm for 800G optical transceiver) and even CoWoP (Chip on Wafer on PCB) based on mSAP technology. Meanwhile, ultrafast laser can remove materials with no-heat transfer so that it won't affect surrounding materials. ASP and GPM – General mechanical drilling equipment: Rmb500k and ~20%; CCD (Camera Contr ...