MicroLED光互连技术
Search documents
兆驰股份:400G/800G等高速模块已进入客户送样验证阶段
Xin Lang Cai Jing· 2025-11-07 14:16
Core Viewpoint - The company has made significant technological breakthroughs and progress in the industrialization of optical modules and optical chips, enhancing its market position and preparing for future growth [1] Group 1: Optical Modules - The company has successfully achieved bulk shipments of traditional 100G and below rate products to leading equipment manufacturers, steadily increasing its market share [1] - Development projects for high-speed modules such as 400G and 800G have been successfully initiated and are currently in the customer sample verification stage [1] - The company has commenced the intelligent transformation of its optical module production line to enhance large-scale delivery capabilities in response to anticipated high growth demand [1] Group 2: Optical Chips - The company’s 25G DFB laser chip has reached mass production capability, while the 2.5G optical chip is progressing towards mass production to achieve self-sufficiency in core raw materials [1] - Plans are in place to launch high-end products such as 50G and above DFB chips and CW light sources by 2026 [1] Group 3: Future Technology Development - The company is focusing on the next-generation optical communication technology path based on MicroLED, increasing investment in the research and development of MicroLED optical interconnect technology [1] - The aim is to address the low latency, high bandwidth, and low power consumption requirements in AI deployment [1]