Workflow
MicroLED光模块传输方案
icon
Search documents
天风证券:MicroLED光模块传输方案 打破光铜取舍困境
Di Yi Cai Jing· 2025-08-25 00:39
Core Insights - MOSAIC is backward compatible with existing standard link forms and electrical host interfaces, allowing direct replacement of current optical and copper links without changes to servers or switches [1] - The prototype has been validated with Ethernet and InfiniBand protocol stacks, confirming compatibility with new protocols such as NVink and CXL [1] - The Mosaic solution utilizes a WaS architecture, operating with a relatively low data rate of 2Gbps per channel through massive parallel channels [1] - If the solution scales, MicroLED, multi-core imaging fibers, TIR lenses, CMOS sensors, and MicroLED optical connectors are expected to be major beneficiaries [1] Industry Implications - The adoption of MOSAIC technology could lead to significant advancements in the fields of MicroLED and optical modules, as well as in the supply chain for related components [1] - Companies involved in MicroLED chips, multi-core imaging fibers, potential TIR lens suppliers, and CMOS sensors should be monitored for investment opportunities as they may benefit from the increased demand driven by MOSAIC's implementation [1]
天风证券:MicroLED光模块传输方案,打破光铜取舍困境
Xin Lang Cai Jing· 2025-08-25 00:24
Core Viewpoint - MOSAIC is backward compatible with existing standard link forms and electrical host interfaces, allowing direct replacement of current optical copper links without changes to servers or switches [1] Group 1 - MOSAIC has validated its prototype with Ethernet and InfiniBand protocol stacks, confirming compatibility with new protocols such as NVink and CXL [1] - The architecture of Mosaic utilizes a WaS structure, operating each channel at a relatively low data rate of 2Gbps [1] - If the solution scales, MicroLED, multi-core imaging fibers, TIR lenses, CMOS sensors, and MicroLED optical connectors are expected to be major beneficiaries [1] Group 2 - Companies to watch include those involved in MicroLED and optical modules, MicroLED chips, multi-core imaging fibers, potential TIR lens suppliers, and CMOS sensors [1]