Core Viewpoint - TSMC's recent technology forum in Shanghai highlighted the company's advancements in semiconductor technology and its market outlook, particularly focusing on the growth of the semiconductor market driven by high-performance computing (HPC) and AI integration, despite limitations in advanced process offerings to Chinese clients [3][4][5]. Market Outlook - The global semiconductor market is projected to exceed $1 trillion by 2030, with HPC accounting for 45%, smartphones for 25%, automotive for 15%, and IoT for 10% [5][6]. Advanced Process Technology - TSMC's 3nm family continues to evolve, with N3P expected to enter mass production in Q4 2024, enhancing performance by 5% or reducing power consumption by 5-10% compared to N3E [6][9]. - N2P is anticipated to begin production in H2 2026, offering an 18% performance increase at the same power level and a 36% reduction in power at the same performance level [11][13]. - The A16 process, set for mass production in H2 2026, integrates three innovative technologies, promising an 8-10% performance boost or a 15-20% reduction in power consumption compared to N2P [14][19][22]. - The A14 process, based on second-generation GAA technology, is expected to start production in 2028, with significant improvements in speed and energy efficiency [20][22]. Advanced Packaging Technology - TSMC's 3DFabric® technology includes SoIC platforms for 3D silicon stacking, with N3-on-N4 stacking expected to enter mass production in 2025 [23][25]. - The SoW-X platform, set for 2027, aims to enhance computational capabilities significantly, integrating essential components for AI training [30]. Special Process Technologies - TSMC is advancing automotive technology with its latest logic technologies, which enhance performance by approximately 20% per generation while reducing power consumption by 30-40% [32]. - The company is also focusing on IoT applications, with developments in ultra-low leakage SRAM and logic circuits to extend battery life [38]. Manufacturing Excellence - TSMC anticipates a twelvefold increase in wafer shipments for AI-related products by 2025 compared to 2021 [44]. - The company plans to add nine new facilities by 2025 to expand capacity, including six wafer fabs in Taiwan and two overseas [45]. - TSMC is committed to sustainable manufacturing, aiming for net-zero emissions by 2050 and a 98% resource recovery rate by 2030 [46][48].