Group 1 - The core viewpoint is that FOPLP (Fan-Out Panel Level Packaging) technology is expected to see broader applications in advanced node packaging for AI, 5G, and high-performance computing by around 2027, driven by improvements in compatibility, standardization, warpage control, and uniformity in plating and etching processes [1] - FOPLP technology offers greater flexibility, scalability, and cost-effectiveness by integrating multiple chips, passive components, and interconnections within a single package, with the substrate evolving from circular wafers to square materials, currently reaching a maximum size of 700mm x 700mm, which is eight times the area of a 12-inch wafer [1] - The semiconductor equipment industry has been given an "overweight" rating due to the anticipated growth in FOPLP technology applications [1] Group 2 - The FOPLP technology faces challenges that require collaborative efforts across the industry chain, including initial equipment costs, limited supply chains, yield issues due to large format sizes, material compatibility, and the need for standardization [2] - Key technical challenges include precise warpage control and material consistency for high-density designs, integration of new dielectric materials, and maintaining uniformity in plating and etching processes [2] Group 3 - Domestic equipment companies are actively entering the panel-level packaging field, with notable products such as Chipbond's PLP 3000 direct-write lithography machine, which supports various substrates and offers advantages in RDL, UBM, and TSV processes [3] - Shengmei Shanghai has launched Ultra ECP ap-p panel-level plating equipment for RDL copper plating and circuit applications, while Changchuan Technology has also introduced related equipment for panel-level packaging [3]