Group 1 - The core viewpoint is that FOPLP (Fan-Out Panel Level Packaging) technology is expected to see broader applications in advanced node packaging for AI, 5G, and high-performance computing by around 2027, driven by improvements in compatibility, standardization, warpage control, and uniformity in plating and etching processes [1] - FOPLP technology offers greater flexibility, scalability, and cost-effectiveness by integrating multiple chips, passive components, and interconnections within a single package, with the substrate evolving from circular wafers to square materials, currently reaching a maximum size of 700mm x 700mm, which is eight times the area of a 12-inch wafer [1] - The semiconductor equipment industry has been given an "overweight" rating due to the anticipated growth in FOPLP technology applications [1] Group 2 - The FOPLP technology faces challenges that require collaborative efforts across the industry chain, including initial equipment costs, limited supply chains, yield issues due to large format sizes, material compatibility, and the need for standardization [2] - Key technical challenges include precise warpage control and material consistency for high-density designs, integration of new dielectric materials, and maintaining uniformity in plating and etching processes [2] Group 3 - Domestic equipment companies are actively entering the panel-level packaging field, with notable products such as Chipbond's PLP 3000 direct-write lithography machine, which supports various substrates and offers advantages in RDL, UBM, and TSV processes [3] - Shengmei Shanghai has launched Ultra ECP ap-p panel-level plating equipment for RDL copper plating and circuit applications, while Changchuan Technology has also introduced related equipment for panel-level packaging [3]

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 4月29日，2025势银异质异构集成封装产业大会（浙江宁波） 点此报名 添加文末微信，加 先进封装 群 更多内容详见4月29日于甬江实验室举办的 2025势银异质异构集成封装产业大会 本文核心观点及关键数据摘自势银（TrendBank） 《2025先进封装技术及材料市场研究》 ，报告共计51页。该市场研究报告展现了2025全 球及中国先进封装产品、先进IC载板及先进封装用胶膜材料等最新市场趋势及技术发展、供应链动态等详实内容，同时涵盖了当下产业热点的 中国FOPLP技术布局及市场发展预测、玻璃芯封装载板竞争格局及市场发展预测，该报告旨在助力产业链企业掌握最新市场发展态势，支撑其 内部做好战略调整；帮助政府机构了解中国本土先进封装产业链成熟度，并因地制宜的做好产业招引与培育；支撑投资机构了解中国本土先进 封装市场及技术现状，为先进封装产业链项目投资做决策依据。具体订阅联系详见文末。 核心观点 1 3大应用场景 先进封装的主要应用 ...