Core Viewpoint - Beijing Huafeng Measurement and Control Technology Co., Ltd. plans to issue convertible bonds to raise funds not exceeding 749.4751 million yuan for the development of self-researched ASIC chip testing systems and the construction of a high-end SoC testing system manufacturing center [2][4]. Group 1: Investment Projects - The funds will be used for two main projects: the "Research and Innovation Project based on Self-Developed ASIC Chip Testing Systems" and the "High-End SoC Testing System Manufacturing Center Construction Project" [2][4]. - The total amount raised has been adjusted from 1 billion yuan to approximately 749.4751 million yuan, with the high-end SoC testing system manufacturing center project no longer included in the fundraising [4][29]. Group 2: Project Necessity and Feasibility - The "Research and Innovation Project" aims to develop core technology for self-controlled ASIC chips and create high-end SoC testing systems, which are essential for the company's strategic extension into the upstream of the semiconductor testing system industry chain [5][8]. - The project is necessary due to the increasing demand for high-end SoC testing systems in the semiconductor market, driven by advancements in AI, cloud computing, big data, and IoT [10][12]. - The domestic semiconductor market is projected to grow significantly, with estimates suggesting a market size exceeding 40 billion USD for SoC testing systems, indicating a strong demand for the company's products [12][14]. Group 3: Market Context and Competitive Landscape - The global semiconductor industry has maintained growth, with high-end SoC testing systems experiencing a surge in demand due to their complex architectures and high integration levels [10][12]. - The company faces competition from international giants like Advantest and Teradyne, which have established products in the SoC testing system market [12][14]. - The domestic market for SoC testing systems is estimated to be around 5.6 to 8.4 billion yuan, highlighting the potential for the company's new products to capture market share [12][14]. Group 4: R&D and Talent Development - The company has a robust R&D framework, having accumulated 210 patents, including 46 invention patents, which supports its ongoing innovation efforts [23][24]. - The R&D model for the "Research and Innovation Project" involves a modular approach, allowing for parallel development of various sub-projects, enhancing efficiency and adaptability [19][20]. - The company plans to recruit additional chip R&D engineers to ensure sufficient expertise for the project's implementation [23][28].