Core Insights - The International Solid-State Circuits Conference (ISSCC) will take place from February 15 to 19, 2026, in San Francisco, showcasing significant advancements in semiconductor technology [2] Group 1: AI Chips - AMD's latest AI GPU, Instinct MI350, features a CDNA4 architecture with a theoretical peak performance increase of 1.9 times compared to its predecessor, and improvements in HBM input/output bandwidth and memory capacity by 1.5 times [2] - Rebellions has developed a large-scale AI inference subsystem using UCIe protocol, achieving a performance of 56.8 TPS on the Llama 3.3 model with 700 billion parameters [3] - IBM's AI accelerator, Spyre, is optimized for inference, boasting a throughput 32% higher than the latest GPUs and energy efficiency 2 to 3 times better [3] - MediaTek's MADiC, a generative diffusion accelerator, achieves performance of 7.4 TOPS/mm² and 17.4 TOPS/W, designed for generative image editing on edge devices [4] - NVIDIA's ALPhA-Vision real-time image processor has a face detection latency of 787 microseconds and an accuracy rate of 99.3% [5] Group 2: Memory Technologies - SanDisk and Kioxia have developed a 3D NAND flash memory with a density of 37.6 Gbit/mm², capable of reaching a storage capacity of 2 Tbit and a write speed of 85 MB/s [6] - Samsung is set to release a DRAM module with a capacity of 36GB and a data transfer rate of up to 3.3 TB/s, utilizing 12 chips stacked together [7] - SK Hynix has developed a 16Gbit LPDDR6 SDRAM with a data transfer rate of 14.4 Gbps per I/O pin [7] - Samsung will also introduce a 16Gbit LPDDR6 SDRAM with a data transfer rate of 12.8 Gbps [8] - SK Hynix's 24Gbit GDDR7 DRAM targets mid-range AI inference applications with a data transfer rate of 48 Gbps [8] Group 3: Image Sensors - STMicroelectronics will showcase a lidar receiver with a field of view of 54°×42° and a power consumption of 153 mW [9] - Sony Semiconductor Solutions has developed a Ge-on-Si SPAD sensor array designed for low-power AR/VR applications, with a power consumption of 26 mW at 30 fps [10] - SmartSens Technology's CMOS image sensor features 200 million pixels and supports 8K video recording at 60 fps [11] Group 4: AI Chip Presentations - NVIDIA will present its GB10 processor for desktop AI supercomputers, featuring 20 Armv9.2 cores and a performance of 31 TFLOPS in FP32 mode [12] - STMicroelectronics will discuss the STM32N6 microcontroller series, integrating an Arm Cortex-M55 CPU and a Neural-ART NPU with performance of 600 GOPS and 3 TOPS/W [13] - Microsoft will explain its AI accelerator architecture, MAIA, focusing on packaging technology and power management [13]