Core Insights - Shengmei Shanghai has successfully delivered its first panel-level advanced packaging electroplating equipment, Ultra ECP ap-p, to a leading panel manufacturing customer, marking a significant milestone in the large panel market [2] - The Ultra ECP ap-p system is designed to meet stringent device requirements and offers performance comparable to traditional round wafer processes, enabling manufacturers to efficiently meet growing demands for next-generation devices [2] - The system utilizes patented ACM technology for horizontal electroplating and supports various materials including copper, nickel, tin-silver, and gold, enhancing its versatility in semiconductor manufacturing [2] Company Overview - Shengmei Shanghai provides wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, with a comprehensive portfolio of semiconductor process equipment [3] - The company has recently launched the Ultra LithKrF, its first KrF process front-end coating and developing equipment, aimed at supporting semiconductor front-end manufacturing, with the first system delivered to a leading logic wafer factory in September [3]