Core Viewpoint - The company has developed the UltraLithTMTrack equipment for 300mm front-end integrated circuit manufacturing, which enhances production efficiency and reduces defect rates while optimizing costs [1] Group 1: Product Development - The UltraLithTMTrack equipment features uniform downward airflow, high-speed stable robotic arms, and a robust software system tailored to customer needs [1] - The equipment supports mainstream lithography machine interfaces and various lithography processes, including i-line, KrF, and ArF systems, ensuring compliance with process requirements [1] Group 2: Market Impact - After five years of dedicated research and development, the company plans to launch its first self-developed high-output (300WPH) KrF front-end coating and developing equipment, UltraLITHKrF, in Q3 2025 [1] - The UltraLITHKrF has already been successfully delivered to leading logic wafer manufacturers in China, showcasing the company's capability to expand into new product categories [1]