Core Viewpoint - The company has successfully established a mSAP (modified semi-additive process) production line, which is set to officially commence operations in September 2023, focusing on high-end applications in RF packaging substrates, SiP packaging substrates, PMIC packaging substrates, and TPMS substrates [1] Group 1 - The mSAP production line has achieved a line width/spacing capability of 20/20 micrometers for mass production, while the ETS buried line process can reach 15/15 micrometers, meeting the mass production requirements for advanced packaging substrates [1] - The company is currently centered on advanced packaging substrates and is building a technological moat through mSAP process upgrades and customer certification systems [1] - The COWOP technology is still in the industry research and validation stage, and the company has not yet directly engaged in COWOP packaging, but its experience in high-precision PCB manufacturing and advanced packaging substrates positions it for potential future involvement in higher-level packaging technology integration [1] Group 2 - The company will continue to monitor industry trends and assess technology extension paths in conjunction with market demand and technological maturity [1]