股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2025年8月31日 狀態: 新提交 致：香港交易及結算所有限公司 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 08490 | 說明 | | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 2,000,000,000 | HKD | | 0.01 | HKD | | 20,000,000 | | 增加 / 減少 (-) | | | | | | | HKD | | | | 本月底結存 | | | 2,000,000,000 | HKD | | 0.01 | HKD | | 20,000,000 | 本月底法定/註冊股本總額： HKD 20,000,000 FF301 第 1 頁 共 10 頁 v 1.1.1 ...

Core Viewpoint - Junma Semiconductor (08490) reported a significant decline in its mid-year performance for 2025, indicating challenges in its financial health and operational efficiency [1] Financial Performance - The company reported revenue of HKD 76.846 million, representing a year-on-year decrease of 29.5% [1] - The net loss for the period was HKD 30.461 million, contrasting with a profit of HKD 2.162 million in the same period last year [1] - Basic loss per share was HKD 0.0432 [1]

Group 1 - The company, Junma Semiconductor, reported a mid-year performance for 2025 with revenues of HKD 76.846 million, representing a year-on-year decline of 29.5% [1] - The company incurred a net loss of HKD 30.461 million, compared to a profit of HKD 2.162 million in the same period last year [1] - The basic loss per share was HKD 0.0432 [1]

Financial Performance - For the six months ended June 30, 2025, the company reported revenue of HKD 76,846,000, a decrease of 29.5% compared to HKD 108,966,000 for the same period in 2024[7] - The gross profit for the same period was HKD 10,555,000, down 59.6% from HKD 26,105,000 in 2024[7] - The company recorded a net loss of HKD 30,461,000 for the six months ended June 30, 2025, compared to a profit of HKD 2,162,000 in the previous year[7] - The company reported a basic loss per share of HKD 4.32 for the six months ended June 30, 2025, compared to earnings of HKD 0.31 per share in 2024[9] - The company experienced a foreign exchange gain of HKD 8,166,000 for the period, contrasting with a loss of HKD 6,828,000 in the previous year[9] - The company experienced a net loss of HKD 30,461,000 for the six months ended June 30, 2025, compared to a profit of HKD 2,162,000 in the same period of 2024[23] - The group recorded a net loss of approximately HKD 30.5 million for the period, compared to a profit of HKD 2.2 million in the first half of 2024[53] Assets and Liabilities - The total assets as of June 30, 2025, were HKD 187,995,000, a slight decrease from HKD 191,030,000 as of December 31, 2024[10] - The company's cash and cash equivalents decreased to HKD 7,894,000 from HKD 19,689,000 at the end of 2024, indicating a liquidity challenge[10] - The company's intangible assets decreased to HKD 85,643,000 from HKD 99,150,000, reflecting a decline of 13.6%[10] - The total liabilities increased to HKD 158,583,000 as of June 30, 2025, compared to HKD 152,229,000 at the end of 2024[10] - The company's total equity as of June 30, 2025, was HKD 147,608,000, a decrease from HKD 220,938,000 as of January 1, 2024[13] - The company's trade payables increased to HKD 12.529 million as of June 30, 2025, compared to HKD 5.979 million as of December 31, 2024[40] - The company recorded a bank overdraft of approximately HKD 17.918 million as of June 30, 2025, compared to none as of December 31, 2024[44] - The group’s net current assets were approximately HKD 29.4 million as of June 30, 2025, down from approximately HKD 38.8 million as of December 31, 2024[57] - The group’s current ratio was approximately 1.2 as of June 30, 2025, compared to approximately 1.3 as of December 31, 2024[57] Revenue Breakdown - Revenue from key products showed a significant decline, with bonding wires generating HKD 48,551,000 (down 16.7%) and packaging adhesives at HKD 24,870,000 (down 46.8%) compared to the previous year[20] - Revenue from customers in mainland China was HKD 76,145,000, down 26.0% from HKD 102,823,000 in 2024[22] - Bond wire product revenue decreased by 16.7% to approximately HKD 48.6 million, while packaging glue product revenue significantly dropped by 46.9% to approximately HKD 24.9 million[48] Impairment and Expenses - The company recorded an impairment loss of approximately HKD 18,816,000 related to intangible assets for the six months ended June 30, 2025, whereas no impairment loss was reported for the same period in 2024[24] - The financing costs for the six months ended June 30, 2025, totaled HKD 2,955,000, a decrease from HKD 3,026,000 in the same period of 2024[28] - The income tax expense for the six months ended June 30, 2025, was HKD 884,000, compared to HKD 2,675,000 for the same period in 2024[29] - The total employee costs for the six months ended June 30, 2025, were HKD 17,996,000, a slight decrease from HKD 18,407,000 in the same period of 2024[31] - Sales and distribution expenses were approximately HKD 4.2 million, a decrease from approximately HKD 5.6 million in the first half of 2024, primarily due to reduced sales commissions[52] Corporate Governance - The company has established an audit committee composed of three independent non-executive directors to oversee financial reporting and internal control processes[92] - The audit committee has reviewed the unaudited condensed consolidated results for the period and confirmed compliance with applicable accounting standards and GEM listing rules[94] - The company has implemented remedial measures to enhance financial reporting procedures to comply with corporate governance codes[87] - The company has adopted a code of conduct for directors regarding securities trading, ensuring compliance with GEM listing rules throughout the period[90] - The company will continue to improve its corporate governance practices to align with statutory requirements and recent developments[89] Future Outlook and Strategy - The company plans to focus on improving operational efficiency and exploring new market opportunities to enhance future performance[6] - The company aims to focus on innovation in semiconductor packaging materials and accelerate domestic substitution to seize opportunities from the anticipated market recovery[47] - The group aims to enhance R&D investment to address global economic uncertainties and develop advanced, cost-effective products[54] - The group will continue to focus on the "domestic substitution" core strategy and expand its market share in automotive-grade packaging and AI chip materials[55] Shareholder Information - The company’s issued share capital was HKD 7,055,000, divided into 705,500,000 shares with a par value of HKD 0.01 each[81] - BVI Holdings and BVI Chows each hold 50.60% of the company's shares, totaling 357,000,000 shares[79] - Dr. Chow and Professor Chow each indirectly own 40% and 60% of BVI Chows, respectively[77] - Mr. Ma holds 21.61% of the company's shares, totaling 152,490,000 shares[79] - The board did not recommend the payment of an interim dividend for the period[65] Miscellaneous - There were no significant events after the reporting period up to the date of this report[68] - The company has not disclosed any new product developments or market expansion strategies in the report[70] - The company has not granted, exercised, canceled, or expired any stock options under the plan since its adoption, resulting in zero potential shares issued based on stock options during the period[85] - The stock option plan allows for a maximum of 68,000,000 shares to be issued, representing 10% of the total issued shares at the time of the plan's adoption[82] - The stock options must be accepted within 30 days of the grant date, with a nominal acceptance fee of HKD 1[83] - The company has no major shareholders or other individuals with disclosed interests in the company's shares, apart from those mentioned[80] - As of June 30, 2025, there were no significant contingent liabilities or guarantees[66] - As of June 30, 2025, the company had no significant encumbrances on its assets[64]

香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈內容概不負責， 對其準確性或完整性亦不發表任何聲明，並明確表示概不會就本公佈全部或任何 部分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 駿碼半導體材料有限公司（「本公司」）董事（「董事」）會（「董事會」）謹此宣佈，本公 司將於二零二五年八月三十一日（星期日）舉行董事會會議，藉以（其中包括）考慮 批准本公司及其附屬公司截至二零二五年六月三十日止六個月的未經審核中期業 績及其刊發，以及考慮派付中期股息的建議（如有）。 承董事會命 駿碼半導體材料有限公司 執行主席兼執行董事 周博軒 香港，二零二五年八月二十日 於本公佈日期，執行董事為周博軒博士、周振基教授及石逸武先生，非執行董事 為李超凡先生及周馮慧蘭女士，及獨立非執行董事為吳宏偉教授、潘禮賢先生及 戴進傑先生。 本公佈所載資料（本公司董事願共同及個別地承擔全部責任）乃遵照香港聯合交易 所有限公司GEM證券上市規則而刊載，旨在提供有關本公司的資料。各董事經作 出一切合理查詢後確認，就彼等所深知及確信，本公佈所載資料在各重大方面均 為準確及完整，且無誤導或欺詐成分；及並無遺漏任何其他事項致使本公佈 ...

Group 1 - The company, Junma Semiconductor (08490), expects a loss attributable to shareholders of approximately HKD 30.4 million for the period ending June 30, 2025, compared to a profit of about HKD 2.2 million in the same period of 2024 [1] - The primary reasons for the shift from profit to loss include impairment losses on certain intangible assets and a decline in revenue and gross margin for the company's products during this period [1] - The impairment losses recognized during this period are attributed to intense competition and a general decrease in consumer demand in the first half of 2025, leading to underperformance of several products [1] Group 2 - The impairment is a non-cash expense and will not affect the overall operations of the company during this period [1] - The company's profit before interest, tax, depreciation, and amortization (EBITDA) for this period is approximately HKD 2.5 million, compared to about HKD 18.7 million for the period ending June 30, 2024 [1]

Group 1 - The company expects a loss attributable to shareholders of approximately HKD 30.4 million for the period ending June 30, 2025, compared to a profit of approximately HKD 2.2 million for the same period in 2024 [1] - The primary reasons for the shift from profit to loss include impairment losses on certain intangible assets and a decline in revenue and gross margin for the company's products during this period [1] - The impairment losses recognized during this period are attributed to intense competition and a general decrease in consumer demand in the first half of 2025, leading to underperformance of certain products [1] Group 2 - The impairment is a non-cash expense and will not affect the overall operations of the company during this period [1] - The company's profit before interest, tax, depreciation, and amortization (EBITDA) for this period is approximately HKD 2.5 million, compared to approximately HKD 18.7 million for the period ending June 30, 2024 [1]

駿碼半導體材料有限公司 （於開曼群島註冊成立的有限公司） （股份代號：8490） 盈利警告 本公佈乃由駿碼半導體材料有限公司（「本公司」，連同其附屬公司統稱「本集團」） 根據香港聯合交易所有限公司GEM證券上市規則（「GEM上市規則」）第17.10條及 香港法例第571章證券及期貨條例第XIVA 部的內幕消息條文（定義見GEM上市規則） 而作出。 香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈內容概不負責， 對其準確性或完整性亦不發表任何聲明，並明確表示概不會就本公佈全部或任何 部分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 Niche-Tech Semiconductor Materials Limited 股東及潛在投資者於買賣本公司股份時務請審慎行事。 承董事會命 駿碼半導體材料有限公司 執行主席兼執行董事 周博軒 香港，二零二五年八月十八日 於本公佈日期，執行董事為周博軒博士，周振基教授及石逸武先生，非執行董事 為李超凡先生及周馮慧蘭女士，及獨立非執行董事為吳宏偉教授、戴進傑先生及 潘禮賢先生。 本公司董事會（「董事會」）董事（「董事」）謹此知會本公司股東（「股東」）及潛在投 ...

股份發行人及根據《上市規則》第十九B章上市的香港預託證券發行人的證券變動月報表 截至月份: 2025年7月31日 狀態: 新提交 致：香港交易及結算所有限公司 公司名稱: 駿碼半導體材料有限公司 呈交日期: 2025年8月4日 I. 法定/註冊股本變動 | 1. 股份分類 | 普通股 | 股份類別 | 不適用 | | | 於香港聯交所上市 (註1) | | 是 | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 證券代號 (如上市) | 08490 | 說明 | | | | | | | | | | | 法定/註冊股份數目 | | | 面值 | | | 法定/註冊股本 | | | 上月底結存 | | | 2,000,000,000 | HKD | | 0.01 | HKD | | 20,000,000 | | 增加 / 減少 (-) | | | | | | | HKD | | | | 本月底結存 | | | 2,000,000,000 | HKD | | 0.01 | HKD | | 20,000,000 | 本月底法定/註冊股 ...

Impairment Loss - The company recognized an impairment loss of approximately HKD 20,026,000 for the fiscal year 2024, compared to no impairment loss in 2023[4] - The recoverable amount for the copper alloy bonding wire cash-generating unit was determined to be HKD 6,526,000, down from HKD 13,018,000 in 2023, resulting in an impairment loss of approximately HKD 900,000[4] - The silver alloy bonding wire cash-generating unit was assessed to have a recoverable amount of zero, leading to a full impairment loss of approximately HKD 19,126,000 for the fiscal year 2024[5] - The pre-tax discount rate used for the impairment testing was 16.28%, down from 18.41% in 2023[5] Financial Performance - The budgeted gross profit margin for the copper alloy bonding wire cash-generating unit was 20.8%, a decrease from 21.7% in 2023[4] - The company plans to provide monthly updates to the board on financial and operational performance to comply with corporate governance codes[8] - The company will deliver monthly revenue and gross profit analysis segmented by product within three weeks after each month-end[8] - The company aims to enhance its financial reporting procedures to ensure compliance with GEM listing rules[6] Market Conditions - The management team noted increased competitive activity, prompting a reassessment of market share and expected profits for certain products[3] - The company continues to receive positive feedback from customers regarding its projects, indicating satisfactory performance expectations[3]