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骏码半导体(08490) - 2023 - 中期业绩
2023-08-09 11:26
香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈內容概不負責, 對其準確性或完整性亦不發表任何聲明,並明確表示概不會就本公佈全部或任何 部分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 Niche-Tech Semiconductor Materials Limited 駿碼半導體材料有限公司 (於開曼群島註冊成立的有限公司) (股份代號:8490) 截至二零二三年六月三十日止六個月之中期業績公佈 駿碼半導體材料有限公司(「本公司」)董事(「董事」)會(「董事會」)欣然公佈本公 司及其附屬公司(統稱「本集團」)於截至二零二三年六月三十日止六個月之未經審 核中期業績。本公佈載有本集團二零二三年中期報告全文,符合香港聯合交易所 有限公司(「聯交所」)GEM證券上市規則(「GEM上市規則」)中有關中期業績初步 公佈附載資料之相關規定。本公司二零二三年中期報告之印刷版本載有GEM上市 規則規定之資料,將適時寄發予本公司股東。 承董事會命 駿碼半導體材料有限公司 執行主席兼執行董事 周博軒 香港,二零二三年八月九日 ...
骏码半导体(08490) - 2023 Q1 - 季度财报
2023-05-12 08:34
Financial Performance - Revenue for the first quarter of 2023 was HKD 46,672,000, a decrease of 20.5% compared to HKD 58,683,000 in the same period of 2022[5] - Gross profit for the first quarter of 2023 was HKD 11,813,000, down 22.4% from HKD 15,250,000 year-on-year[5] - The net profit for the first quarter of 2023 was HKD 1,484,000, representing a decline of 29.7% compared to HKD 2,113,000 in the first quarter of 2022[5] - The company reported a basic earnings per share of HKD 0.21 for the first quarter of 2023, down from HKD 0.30 in the same quarter of 2022[7] - The total comprehensive income for the first quarter of 2023 was HKD 3,668,000, an increase of 15.8% from HKD 3,166,000 in the first quarter of 2022[7] - The company incurred selling and distribution expenses of HKD 2,621,000, a decrease of 41.3% from HKD 4,461,000 in the same period last year[5] - Administrative expenses for the first quarter of 2023 were HKD 6,853,000, down 8.2% from HKD 7,465,000 in the first quarter of 2022[5] - The income tax expense for the period was HKD 1.238 million, slightly up from HKD 1.231 million in the previous year[22] - The profit attributable to the company's owners for the period was approximately HKD 1.5 million, down from HKD 2.1 million for the same period last year[34] Revenue Breakdown - Revenue from bonding wires decreased by 13.2% to approximately HKD 25.5 million, while revenue from packaging adhesives decreased by 27.0% to approximately HKD 19.5 million[29] - The cost of sales decreased by 19.7% to approximately HKD 34.9 million, consistent with the revenue decline[31] - Gross profit decreased by 22.5% to approximately HKD 11.8 million, with a slight reduction in gross margin to approximately 25.3%[31] - Other income, including government subsidies and foreign exchange gains, amounted to approximately HKD 0.8 million, up from HKD 0.4 million in the previous year[32] Market and Product Development - The company continues to focus on developing advanced semiconductor materials for industries such as IGBT, mini-LED, artificial intelligence, and 5G[28] - The company anticipates a global semiconductor materials market growth rate of 6.3% in 2023, reaching a historical high of USD 485.8 billion[36] - Demand for semiconductor materials in China is expected to gradually recover due to government policies aimed at promoting economic growth[37] - The company plans to launch three new series of die attach adhesives, including epoxy insulation adhesive, silicone insulation adhesive, and conductive silver adhesive for LEDs[37] - A new copper alloy bonding wire for high-power integrated circuits and IGBT products has been developed and validated by top customers in China[37] - The company is focusing on developing upstream packaging materials for the 5G industry, which is expected to become another growth point[37] Shareholder Information - As of March 31, 2023, the company has issued share capital of HKD 7,055,000, divided into 705,500,000 shares with a par value of HKD 0.01 each[57] - Chows Investment Group Limited and Junma Technology Investment Holdings Limited each hold 50.60% of the company's shares, totaling 357,000,000 shares[53] - Ms. Chow Fung Wai Lan Rita holds a spouse interest in 357,510,000 shares, representing 50.67% of the issued share capital[53] - Mr. Ma Yamu holds a beneficial interest in 152,490,000 shares, which accounts for 21.61% of the issued share capital[53] - The company has not granted any stock options under its stock option plan since its adoption on May 8, 2018[59] - The maximum number of shares that can be granted under the stock option plan is capped at 10% of the shares issued at the time of listing, which is 68,000,000 shares, approximately 9.6% of the issued shares as of the report date[58] Corporate Governance - The company has established an audit committee consisting of three independent non-executive directors to oversee financial reporting and internal control processes[68] - The company has complied with the corporate governance code as stipulated in the GEM Listing Rules during the reporting period[62] - There were no purchases, sales, or redemptions of the company's listed securities by the company or its subsidiaries during the period[67] - The company has not identified any conflicts of interest involving its directors or controlling shareholders during the reporting period[60] Future Outlook - The company provided a forward guidance of 10% revenue growth for the next quarter, projecting revenue to reach HKD 165 million[70] - New product development initiatives are expected to launch two innovative semiconductor materials by Q3 2023, aiming to capture a larger market share[70] - The company plans to expand its market presence in Southeast Asia, targeting a 25% increase in sales from this region by the end of 2023[70] - A strategic acquisition of a smaller tech firm is in progress, which is anticipated to enhance the company's R&D capabilities and product offerings[70] - The company is investing HKD 20 million in new technology to enhance production efficiency over the next year[70] - Customer satisfaction ratings increased to 90%, indicating strong market acceptance of existing products[70] - The company is exploring partnerships with key industry players to leverage synergies and drive innovation[70]
骏码半导体(08490) - 2023 Q1 - 季度业绩
2023-05-08 12:12
香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈內容概不負責, 對其準確性或完整性亦不發表任何聲明,並明確表示概不會就本公佈全部或任何 部分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 Niche-Tech Semiconductor Materials Limited 駿碼半導體材料有限公司 (於開曼群島註冊成立的有限公司) (股份代號:8490) 截至二零二三年三月三十一日止三個月之第一季度業績公佈 駿碼半導體材料有限公司(「本公司」)董事(「董事」)會(「董事會」)欣然公佈本公 司及其附屬公司(統稱「本集團」)於截至二零二三年三月三十一日止三個月之未經 審核業績。本公佈載有本集團二零二三年第一季度報告全文,符合香港聯合交易 所有限公司(「聯交所」)GEM證券上市規則(「GEM上市規則」)中有關季度業績初 步公佈附載資料之相關規定。本公司二零二三年第一季度報告之印刷版本載有 GEM上市規則規定之資料,將適時寄發予本公司股東。 承董事會命 駿碼半導體材料有限公司 執行主席兼執行董事 周博軒 香港,二零二三年五月八日 ...
骏码半导体(08490) - 2022 - 年度财报
2023-03-30 08:43
Financial Performance - The group's revenue decreased by 12.5% from approximately HKD 249.0 million in 2021 to approximately HKD 217.9 million in 2022[8] - Gross profit slightly decreased by 0.6% to approximately HKD 58.0 million, with the gross margin increasing from 23.4% in 2021 to 26.6% in 2022[8] - Profit attributable to owners of the company was approximately HKD 8.6 million, up from HKD 6.8 million in 2021[8] - EBITDA for the year was approximately HKD 34.1 million, compared to HKD 29.3 million in 2021[8] - Revenue from bonding wire products decreased by 34.8% to approximately HKD 106.0 million, while revenue from packaging adhesive products increased significantly by 31.0% to approximately HKD 100.4 million[15] - Other income recorded a net gain of approximately HKD 4.3 million, compared to HKD 0.6 million in 2021, with foreign exchange gains of approximately HKD 2.4 million[17] - The group reported a profit attributable to owners of approximately HKD 8.6 million, an increase from HKD 6.8 million in 2021[22] - As of December 31, 2022, the company's distributable reserves were approximately HKD 156.2 million, down from HKD 169.7 million as of December 31, 2021[134] Market and Business Strategy - The company plans to expand its customer base from commercial to household markets[10] - The group aims to continue developing products related to mini LED displays and explore new technologies[10] - The company plans to launch three new series of die attach adhesives and has developed a new copper alloy bonding wire, which has received validation from top customers in China[27] - The group aims to expand its customer base from commercial to household markets, enhancing product applications beyond commercial uses[28] - The group anticipates a 6.3% growth rate in the global semiconductor materials market in 2023, reaching a historical high of USD 485.8 billion[26] Corporate Governance - The management team is committed to maintaining high standards in corporate governance and financial reporting, with independent directors overseeing these processes[56][57] - The company emphasizes the importance of good corporate governance practices to enhance accountability and transparency for shareholders[69] - The board consists of seven members, including three executive directors and three independent non-executive directors, ensuring a balance of power[70] - The company has complied with the GEM Listing Rules and has undergone no less than 15 hours of relevant professional training as of December 31, 2022[64] - The chairman and CEO roles are clearly separated to ensure effective governance and management of the company[71] - The company has established a board diversity policy to enhance board efficiency by considering factors such as gender, age, and professional experience[82] Risk Management and Compliance - The company has a structured approach to risk management and internal controls, which is regularly reviewed[77] - The board is responsible for ensuring effective risk management and internal controls, with a review conducted at least annually[107] - The company has established a dedicated internal audit department to regularly assess the effectiveness of risk management and internal control systems[105] - The board has confirmed that there are no significant uncertainties regarding the company's ability to continue as a going concern[112] Dividends and Shareholder Relations - The board proposed a final dividend of HKD 0.022 per share, subject to shareholder approval[8] - The board declared an interim dividend of HKD 0.00310 per share, totaling approximately HKD 2.2 million, and proposed a final dividend of HKD 0.0022 per share, totaling approximately HKD 1.6 million[33] - The company has adopted a dividend policy prioritizing cash distributions to shareholders, with the payout ratio determined by the board based on financial performance and future outlook[186] Environmental, Social, and Governance (ESG) Initiatives - The group has implemented green office measures to promote sustainability, including energy-saving practices and resource conservation[146] - The group is integrating Environmental, Social, and Governance (ESG) issues into its operations and regulatory systems to manage sustainability-related risks and opportunities[193] - The ESG report covers the group's main operations in Hong Kong and Shantou, focusing on the development, production, and sales of semiconductor packaging materials[194] - The board oversees the established sustainable governance framework, enhancing the group's governance performance and strategies related to ESG matters[200] Management and Personnel - Professor Zhou, the co-founder and executive director, has over 41 years of experience in the electronic materials industry and was appointed as an executive director on February 21, 2017[46] - Mr. Shi, the general manager, has over 16 years of experience in the electronic materials industry and has been with the group since May 2007[47] - The company has a strong emphasis on research and development, with key personnel holding advanced degrees and significant industry experience[48][52] - The company has hired a personnel relations consultant for brand and digital marketing efforts[40] Supplier and Customer Relations - Sales to the top five customers accounted for approximately 42.6% of total sales, down from 48.1% in 2021, with the largest customer representing about 14.3% of total sales[135] - Purchases from the top five suppliers constituted approximately 55.7% of total purchases, a decrease from 71.1% in 2021, with the largest supplier accounting for about 19.6% of total purchases[135] - The group relies on a few suppliers for raw materials, with the largest supplier accounting for approximately 19.6% and the top five suppliers together representing 55.7% of total procurement[141] - The group has expanded its supplier base to mitigate risks associated with supplier concentration[141] Charitable Contributions - The group made charitable donations of HKD 33,500 in the review year, compared to HKD 12,000 in 2021[185]
骏码半导体(08490) - 2022 - 年度业绩
2023-03-24 13:24
香港交易及結算所有限公司及香港聯合交易所有限公司對本公佈內容概不負責, 對其準確性或完整性亦不發表任何聲明,並明確表示概不會就本公佈全部或任何 部分內容而產生或因依賴該等內容而引致的任何損失承擔任何責任。 Niche-Tech Semiconductor Materials Limited 駿碼半導體材料有限公司 (於開曼群島註冊成立的有限公司) (股份代號:8490) 截至2022年12月31日止年度全年業績公佈 駿碼半導體材料有限公司(「本公司」)董事(「董事」)會(「董事會」)欣然公佈本公 司及其附屬公司於截至2022年12月31日止年度的經審核全年綜合業績。 本公佈載有本公司2022年年度報告全文,符合香港聯合交易所有限公司GEM證券 上市規則(「GEM上市規則」)中有關全年業績初步公佈附載資料的相關規定。本 公司2022年年度報告之印刷版本載有GEM上市規則規定的資料,將適時寄發予本 公司股東。 承董事會命 駿碼半導體材料有限公司 執行主席兼執行董事 周博軒 香港,2023年3月24日 ...
骏码半导体(08490) - 2022 Q3 - 季度财报
2022-11-11 08:39
Financial Performance - Revenue for the three months ended September 30, 2022, was HKD 46,001 thousand, a decrease of 24.7% compared to HKD 61,086 thousand for the same period in 2021[5] - Gross profit for the nine months ended September 30, 2022, was HKD 44,673 thousand, representing an increase of 10.4% from HKD 40,569 thousand in the same period of 2021[5] - The net profit for the three months ended September 30, 2022, was HKD 528 thousand, down 75.2% from HKD 2,126 thousand in the same period of 2021[5] - The company reported a total comprehensive income of HKD (10,640) thousand for the three months ended September 30, 2022, compared to HKD 2,303 thousand for the same period in 2021[7] - Basic earnings per share for the nine months ended September 30, 2022, was HKD 0.88, slightly down from HKD 0.89 in the same period of 2021[7] - The company's revenue for the nine months ended September 30, 2022, was approximately HKD 168.9 million, a decrease of 7.9% compared to HKD 183.4 million for the same period in 2021[48] Revenue Breakdown - For the nine months ended September 30, 2022, total revenue was HKD 168,929 thousand, a decrease of 7.8% compared to HKD 183,376 thousand for the same period in 2021[17] - Revenue from key products included HKD 82,424 thousand from bonding wires and HKD 76,700 thousand from packaging adhesives, representing a decline of 36.4% and an increase of 61.6% respectively compared to the same period in 2021[17] - Revenue from customers in mainland China was HKD 167,670 thousand, down 7.6% from HKD 181,635 thousand in the same period last year[20] - Revenue from wire products decreased by 36.2% to approximately HKD 82.4 million, while revenue from packaging adhesive products increased significantly by 61.4% to approximately HKD 76.7 million[48] Expenses and Costs - The company incurred financing costs of HKD 328 thousand for the three months ended September 30, 2022, down from HKD 443 thousand in the same period of 2021[5] - Sales and distribution expenses for the nine months ended September 30, 2022, were HKD 10,946 thousand, an increase from HKD 9,576 thousand in the same period of 2021[5] - The income tax expense for the nine months ended September 30, 2022, was HKD 3,761 thousand, an increase from HKD 3,155 thousand for the same period in 2021[26] - Bank loan interest expenses for the nine months ended September 30, 2022, totaled HKD 354 thousand, an increase of 22.1% compared to HKD 290 thousand in the same period last year[24] - The total employee costs for the nine months ended September 30, 2022, were HKD 21.7 million, compared to HKD 20.4 million for the same period in 2021, reflecting an increase of 6.2%[31] - Selling and distribution expenses increased by 14.3% to approximately HKD 10.9 million, primarily due to increased freight and sales commissions[53] Foreign Exchange and Other Income - The company recorded a foreign exchange loss of HKD (14,357) thousand for the three months ended September 30, 2022, compared to a gain of HKD 213 thousand in the same period of 2021[7] - The company reported a net loss of HKD 1,155 thousand from foreign exchange, compared to a gain of HKD 101 thousand in the same period last year[23] - Other income and losses for the period were approximately HKD 0.1 million, down from HKD 1.3 million in the same period of 2021[52] Dividends and Grants - The company declared an interim dividend of HKD 0.0031 per share, totaling approximately HKD 2.2 million, compared to HKD 2.1 million for the same period in 2021[42] - The company received government grants totaling HKD 1,317 thousand for the nine months ended September 30, 2022, compared to HKD 1,243 thousand in the same period last year[23] Corporate Governance - The company has complied with the corporate governance code as stipulated in the GEM Listing Rules during the reporting period[90] - The board of directors is composed of experienced individuals, including three independent non-executive directors, ensuring a balance of power and authority within the company[91] - The Audit Committee has been established to oversee the financial reporting process and internal control procedures of the group[98] - The Audit Committee consists of three independent non-executive directors, with Mr. Pan Lai-hin serving as the chairman[98] Strategic Focus and Development - The company continues to focus on the development and sales of semiconductor packaging materials, with no further discrete segment information provided[19] - The company plans to focus on developing advanced semiconductor materials suitable for electric vehicles, mini-LED, artificial intelligence, and 5G communications[47] - The company is committed to enhancing its R&D capabilities to seize opportunities in emerging markets such as 5G networks, automotive electrification, and industrial automation[63] - The company anticipates growth in demand for bonding wires and semiconductor packaging materials due to government policies promoting 5G development in China[61] - Three new series of adhesive products are set to be launched, including epoxy insulation adhesive, silicone insulation adhesive, and silver adhesive for LEDs, to capitalize on the growth opportunities in the 5G industry[61] Share Capital and Ownership - As of September 30, 2022, the company has issued share capital of HKD 7,055,000, divided into 705,500,000 shares[69] - Chows Investment Group Limited holds a 100% interest in Junma Technology Investment Holdings Limited, which owns 357,000,000 shares, representing 50.60% of the company's issued share capital[79] - Chow Fung Wai Lan Rita holds 357,510,000 shares, accounting for 50.67% of the company's issued share capital, as a spouse interest[79] - Ma Yamu holds 152,490,000 shares, representing 21.61% of the company's issued share capital, as a beneficial owner[79] - The company has not granted any stock options under its stock option plan since its adoption on May 8, 2018, and there are no unexercised stock options as of September 30, 2022[88]
骏码半导体(08490) - 2022 - 中期财报
2022-08-12 08:34
Financial Performance - Revenue for the six months ended June 30, 2022, was HKD 122,928 thousand, a slight increase from HKD 122,290 thousand in the same period of 2021, representing a growth of 0.5%[4] - Gross profit for the six months ended June 30, 2022, was HKD 33,247 thousand, compared to HKD 26,545 thousand for the same period in 2021, reflecting a growth of 25.6%[4] - The net profit for the six months ended June 30, 2022, was HKD 5,659 thousand, an increase of 36.0% from HKD 4,163 thousand in the same period of 2021[4] - Basic earnings per share for the six months ended June 30, 2022, was HKD 0.80, compared to HKD 0.59 for the same period in 2021, an increase of 35.6%[7] - The company reported a gross margin of 27.0% for the six months ended June 30, 2022, compared to 21.7% for the same period in 2021, indicating an improvement of 5.3 percentage points[4] - The company reported a total comprehensive income of HKD 5,667 thousand for the six months ended June 30, 2022, compared to HKD 4,163 thousand for the same period in 2021[14] - The group reported a profit attributable to owners of approximately HKD 5.7 million, up from HKD 4.2 million in the same period last year[73] Assets and Liabilities - Total assets as of June 30, 2022, were HKD 256,241 thousand, a decrease from HKD 261,587 thousand as of December 31, 2021, indicating a decline of 2.5%[9] - Total liabilities decreased to HKD 16,232 thousand as of June 30, 2022, from HKD 18,402 thousand as of December 31, 2021, a decline of 11.8%[12] - The company’s non-current assets totaled HKD 130,602 thousand as of June 30, 2022, slightly down from HKD 132,036 thousand as of December 31, 2021, a decrease of 1.1%[9] - Trade receivables decreased to HKD 119,732 thousand as of June 30, 2022, from HKD 129,001 thousand as of December 31, 2021, representing a reduction of 7.5%[9] - The group’s bank borrowings decreased to HKD 20.3 million as of June 30, 2022, from HKD 23.6 million as of December 31, 2021[56] - Trade payables decreased to HKD 15.3 million as of June 30, 2022, from HKD 18.1 million as of December 31, 2021[54] Cash Flow and Investments - Operating cash flow for the six months ended June 30, 2022, was HKD 20,612 thousand, a significant improvement from a cash outflow of HKD 8,282 thousand in the same period of 2021[18] - The net cash used in investing activities was HKD 11,412 thousand for the six months ended June 30, 2022, compared to HKD 3,854 thousand in the same period of 2021[18] - Cash and cash equivalents increased to HKD 24,550 thousand as of June 30, 2022, from HKD 20,483 thousand at the beginning of the period[18] - The company has invested HKD 19.4 million in expanding capacity and upgrading production facilities, with no amount utilized as of June 30, 2022[124] - The company has allocated HKD 10.2 million for acquiring new intellectual property related to bonding wires, fully utilized by June 30, 2022[124] - The company has purchased equipment worth HKD 19.5 million to improve existing R&D facilities, with HKD 8.2 million utilized by June 30, 2022[124] - The company has engaged external consultants for R&D projects, with an expenditure of HKD 5.9 million, of which HKD 3.4 million has been utilized[124] Revenue Breakdown - The revenue from key products included HKD 60,300 thousand from bonding wires and HKD 55,150 thousand from packaging adhesives for the six months ended June 30, 2022[25] - Revenue from customers in mainland China (excluding Hong Kong) was HKD 122,055 thousand for the six months ended June 30, 2022, compared to HKD 120,899 thousand in the same period of 2021[28] - Revenue from bonding wire products decreased by 32.5% to approximately HKD 60.3 million, while revenue from packaging glue products surged by 94.0% to approximately HKD 55.2 million[67] Shareholder Information - As of June 30, 2022, the company has issued share capital of HKD 7,055,000, divided into 705,500,000 shares with a par value of HKD 0.01 each[137] - Mr. Zhou and Professor Zhou each hold 50.60% of the shares through BVI Holdings, which represents 357,000,000 shares[134] - The major shareholders include BVI Holdings with 50.60% and Chow Fung Wai Lan Rita with 50.67% due to spouse rights[134] - The company has a total of 16,050,000 shares held by Mr. Li, representing 2.27% of the issued share capital[134] Corporate Governance - The company has a clear governance structure with significant shareholding by its directors, ensuring alignment of interests[134] - The company has adhered to the corporate governance code as per GEM listing rules, ensuring a clear distinction between the roles of the chairman and the CEO, with no CEO appointed[144] - The audit committee, composed of three independent non-executive directors, has reviewed the unaudited condensed consolidated results for the period and confirmed compliance with applicable accounting standards and GEM listing rules[150] Future Plans and Market Outlook - The group plans to continue focusing on developing advanced semiconductor materials suitable for electric vehicles, mini LED, artificial intelligence, and 5G communication industries[66] - The group plans to launch three new series of adhesive products for the semiconductor and 5G industries, including epoxy insulation adhesive and conductive silver adhesive for LEDs[76] - The global semiconductor equipment sales are expected to grow by approximately 14.7% to USD 115.7 billion in 2022, with further growth anticipated in 2023[75] - The group is actively exploring potential merger and acquisition opportunities to capitalize on the recovery and rapid development of the 5G industry[79]
骏码半导体(08490) - 2022 Q1 - 季度财报
2022-05-12 08:46
Financial Performance - Revenue for the three months ended March 31, 2022, was HKD 58,683 thousand, an increase of 6.1% from HKD 54,985 thousand in the same period of 2021[5] - Gross profit for the same period was HKD 15,250 thousand, representing a gross margin of 25.9%, compared to HKD 12,035 thousand in 2021[5] - The net profit for the period was HKD 2,113 thousand, up 24.0% from HKD 1,705 thousand in the previous year[5] - Total comprehensive income for the period was HKD 3,166 thousand, significantly higher than HKD 370 thousand in the same period last year[10] - Basic earnings per share increased to HKD 0.30 from HKD 0.24, reflecting a growth of 25.0%[12] - The company reported a net profit attributable to shareholders of approximately HKD 2.1 million for the period, compared to HKD 1.7 million in the previous year[66] - The profit attributable to the company's owners for the period was approximately HKD 2.1 million, compared to HKD 1.7 million for the same period last year[75] Revenue Breakdown - Revenue from bonding wire decreased by 27.3% to approximately HKD 29.4 million, while revenue from packaging adhesive increased significantly by 117.7% to approximately HKD 26.7 million[70] - The company served over 600 customers, including major LED, camera module, and IC manufacturers located primarily in China[68] Expenses and Costs - Selling and distribution expenses rose to HKD 4,461 thousand, up from HKD 2,611 thousand, indicating increased investment in market expansion[5] - Administrative expenses were HKD 7,465 thousand, slightly higher than HKD 7,026 thousand in the same period last year[5] - Financing costs increased to HKD 409,000 from HKD 294,000 in the previous year, primarily due to interest on discounted notes with recourse[29] - Sales and distribution expenses increased by 70.9% to approximately HKD 4.5 million, driven by increased transportation costs and higher sales commissions[74] Government Support and Taxation - The company received government subsidies amounting to HKD 360,000, slightly up from HKD 355,000 in the previous year[29] - The company’s effective tax rate for the period was 15% due to its qualification as a high-tech enterprise in Shantou, China[34] Market Outlook and Strategy - The company continues to focus on the development and sales of semiconductor packaging materials, with plans for future product innovations[20] - The company plans to continue focusing on the development of advanced semiconductor materials suitable for mini LED, artificial intelligence, and 5G industries[69] - The company expects continued growth in the global semiconductor materials market, projected to increase by 15.9% in 2021, reaching USD 64.3 billion[77] - The demand for semiconductor packaging materials is anticipated to grow steadily, particularly in China, due to effective COVID-19 control and rapid growth in the 5G industry[77] - The company plans to enhance its product development efforts in response to increasing demand from emerging markets such as 5G networks, automotive electrification, and IoT[77] Corporate Governance and Shareholding - The financial statements are prepared in accordance with Hong Kong Financial Reporting Standards, ensuring compliance and transparency[21] - The company has established an audit committee composed of three independent non-executive directors to review and supervise the financial reporting process and internal control procedures[110] - The company has complied with the corporate governance code as stipulated in the GEM Listing Rules during the reporting period[105] - Major shareholders include Mr. Zhou and Professor Zhou, each holding 50.60% of the company through controlled corporations[84] - As of March 31, 2022, the company had issued share capital of HKD 7,055,000, divided into 705,500,000 shares[88] - The company has not granted any share options under the share option scheme since its adoption on May 8, 2018, and there are no unexercised options as of March 31, 2022[102] - The maximum number of shares that can be granted under the share option scheme is capped at 10% of the shares issued at the time of listing, which amounts to 68,000,000 shares, approximately 9.6% of the issued shares as of the report date[101] Dividend and Acquisitions - The board did not recommend any dividend payment for the period, consistent with the previous year[80] - No significant acquisitions or disposals of subsidiaries or joint ventures occurred during the period[81] - There were no purchases, sales, or redemptions of the company's listed securities by the company or any of its subsidiaries during the reporting period[109] - The company has not identified any competing business interests held by its directors or controlling shareholders during the reporting period[103] Other Income - The company recorded other income of approximately HKD 0.4 million, compared to HKD 0.3 million for the same period in 2021[73]
骏码半导体(08490) - 2021 - 年度财报
2022-03-30 08:40
Financial Performance - The group's revenue increased by 45.2% to approximately HKD 249.0 million for the year ended December 31, 2021, compared to approximately HKD 171.6 million in 2020[13] - Gross profit rose by 69.8% to approximately HKD 58.3 million, with a gross margin improvement from 20.0% in 2020 to 23.4% in 2021[13] - Profit attributable to owners of the company was approximately HKD 6.8 million, with EBITDA of approximately HKD 29.3 million, up from HKD 4.5 million in 2020[13] - The group recorded revenue of approximately HKD 249.0 million for the year, an increase of about 45.2% compared to HKD 171.6 million in 2020, driven by strong demand in the semiconductor and LED industries as the Chinese market recovered from COVID-19[22] - The group's gross profit increased by 69.8% to approximately HKD 58.3 million, with a gross margin rising from about 20.0% to approximately 23.4% due to a better product mix and strong sales performance of new products[23] - The group reported a net profit attributable to shareholders of approximately HKD 6.8 million for the year, a significant turnaround from a loss of HKD 14.1 million in 2020[27] Business Strategy and Market Outlook - The company continues to focus on innovation in semiconductor packaging materials to capitalize on anticipated market recovery opportunities[18] - The company plans to seek new business collaborations and explore product agency opportunities related to electronic products and 5G technology[14] - The semiconductor industry is expected to experience rapid growth driven by demand for efficient power electronics and advancements in 5G, AI, cloud computing, and new energy vehicles[14] - The group plans to continue developing advanced semiconductor packaging materials and expand its product portfolio in 2022 to capture opportunities from the anticipated market recovery, particularly in the 5G sector[19] - The group expects the global semiconductor materials market to grow at a rate of 8.8% in 2022, reaching a historical high of USD 601 billion[19] Corporate Governance - The company emphasizes the importance of corporate governance, adhering to the GEM listing rules and corporate governance code as of December 31, 2021[79] - The board consists of seven members, including three executive directors and three independent non-executive directors, ensuring a balance of power[81] - The company has not appointed a CEO, with daily management executed by senior management and overseen by executive directors[79] - The independent non-executive directors have confirmed their independence according to GEM listing rules, ensuring compliance[85] - The company has a clear division of responsibilities between the chairman and the CEO, which is crucial for effective governance[82] - The board retains decision-making authority on major matters, including financial data and significant transactions[88] - The company has a compliance officer to oversee adherence to regulations and governance standards[75] - The company has established a structured approach to risk management and internal controls, vital for navigating economic changes[88] - The board of directors has adopted a diversity policy to enhance efficiency, considering factors such as gender, age, cultural background, and professional experience[92] Research and Development - The company has a strong focus on research and development, with key personnel having advanced degrees and significant industry experience[58][62] - The company has engaged external consultants for R&D projects, with an initial allocation of HKD 5.9 million, and has utilized HKD 3.0 million[49] - The company has invested HKD 19.4 million in acquiring or investing in the bonding wire business or related businesses[49] - The company has spent HKD 19.5 million on improving R&D facilities, with HKD 8.3 million reallocated[49] - The company has acquired bonding wire intellectual property in 2021 to enrich its product categories[49] Shareholder Information - The board proposed a final dividend of HKD 0.190 per share, subject to shareholder approval[13] - The group declared an interim dividend of HKD 0.00295 per share, totaling approximately HKD 2.1 million, and proposed a final dividend of HKD 0.00190 per share, amounting to about HKD 1.3 million[35][36] - As of December 31, 2021, the company's distributable reserves were approximately HKD 169.7 million, down from HKD 180.2 million as of December 31, 2020[145] - The company has adopted a dividend policy prioritizing cash distribution to shareholders, with the payout ratio determined by the board based on financial performance and future prospects[199] Risk Management - The company is exposed to risks related to economic downturns, which may affect downstream customer demand for its products[150] - The company has expanded its supplier base to mitigate risks associated with supplier concentration[151] - The company's performance is significantly influenced by economic, political, and legal developments in China, where most of its assets and operations are located[152] - The semiconductor packaging materials industry is characterized by rapid technological changes, impacting the company's competitiveness[155] Sustainability and Corporate Social Responsibility - The company has implemented green office measures to promote sustainability and reduce energy consumption[157] - The group made charitable donations of approximately HKD 12,000 (RMB 10,000) during the review year, compared to none in 2020[198] Management and Personnel - Professor Zhou, the co-founder and executive director, has over 40 years of experience in the electronic materials industry and was appointed as an executive director on February 21, 2017[56] - Mr. Shi, the general manager, has over 15 years of experience in the electronic materials industry and has been with the group since May 2007[57] - The management team is well-versed in corporate governance and compliance, with members holding various leadership roles in other listed companies[65][67] - The company has a history of appointing experienced individuals to its management team, enhancing operational efficiency[81] Audit and Compliance - The audit committee, consisting of three independent non-executive directors, held four meetings during the year to review financial reporting and internal controls[103] - The remuneration committee convened two meetings to review the remuneration policy and structure for directors and senior management[106] - The nomination committee is responsible for developing nomination policies and advising on changes to the board, comprising two executive directors and three independent non-executive directors[107] - The audit committee reviewed the audited consolidated results for the year and confirmed compliance with applicable accounting standards[104] - The board has reviewed the internal control system and deemed it effective and adequate for the review year[117] - The risk management procedures were reviewed and considered effective and adequate for the review year[120]
骏码半导体(08490) - 2021 Q3 - 季度财报
2021-11-12 09:44
Financial Performance - For the three months ended September 30, 2021, the company reported revenue of HKD 61,086,000, representing a 31.0% increase from HKD 46,592,000 in the same period of 2020[6] - The gross profit for the nine months ended September 30, 2021, was HKD 40,569,000, up 82.0% from HKD 22,317,000 in the same period of 2020[6] - The company achieved a profit before tax of HKD 9,444,000 for the nine months ended September 30, 2021, compared to a loss of HKD 5,144,000 in the same period of 2020[6] - The net profit for the three months ended September 30, 2021, was HKD 2,126,000, a turnaround from a loss of HKD 3,666,000 in the same period of 2020[6] - The company reported total comprehensive income of HKD 2,303,000 for the three months ended September 30, 2021, compared to a total comprehensive loss of HKD 2,433,000 in the same period of 2020[9] - Basic earnings per share for the three months ended September 30, 2021, was HKD 0.30, compared to a loss per share of HKD 0.52 in the same period of 2020[9] - Revenue for the nine months ended September 30, 2021, reached HKD 183,376 thousand, up 58.5% from HKD 115,827 thousand in the same period of 2020[22] - For the nine months ended September 30, 2021, the company's revenue was approximately HKD 183.4 million, an increase of 58.3% compared to HKD 115.8 million for the same period in 2020[50] - Gross profit for the same period increased by 81.8% to approximately HKD 40.6 million, with a gross margin of 22.1%, up from 19.3% in the previous year[51] - The company reported a profit attributable to owners of approximately HKD 6.3 million for the nine months ended September 30, 2021, compared to a loss of HKD 6.4 million for the same period in 2020[55] Revenue Sources - Key product revenue for the nine months included HKD 129,130 thousand from bonding wire, a 46.4% increase from HKD 88,176 thousand in 2020[22] - Revenue from packaging materials for the nine months was HKD 47,533 thousand, a 138.0% increase from HKD 19,864 thousand in 2020[22] - Revenue from customers in mainland China (excluding Hong Kong) for the nine months was HKD 181,635 thousand, a 57.7% increase from HKD 115,068 thousand in 2020[25] Costs and Expenses - Total employee costs for the nine months ended September 30, 2021, were HKD 25,732 thousand, an increase from HKD 20,141 thousand in 2020[37] - Sales and distribution expenses increased by 27.9% to approximately HKD 9.6 million, primarily due to increased freight and travel expenses related to higher sales[54] - The sales cost for the nine months ended September 30, 2021, increased by 52.7% to approximately HKD 142.8 million, consistent with revenue growth[51] - The group incurred finance costs of HKD 290 thousand for bank loans in the nine months ended September 30, 2021, down from HKD 353 thousand in 2020[30] Government Support and Grants - The group received government grants totaling HKD 1,243 thousand for the nine months ended September 30, 2021, compared to HKD 3,478 thousand in 2020[29] - Other income and losses for the period were approximately HKD 1.3 million, a decrease from HKD 2.9 million in the previous year, mainly due to the absence of one-time government subsidies[52] Research and Development - The company continues to focus on developing advanced semiconductor materials suitable for the LED, AI, 5G, and automotive industries[47] - The company’s R&D expenses (excluding depreciation and employee costs) were approximately HKD 0.4 million for the nine months ended September 30, 2021, down from HKD 0.6 million in the previous year[51] - The group has launched three new LED application products, including non-conductive epoxy resin, non-conductive silicone, and conductive silver glue, expected to generate revenue in the coming years[60] - The company has developed a new type of copper alloy bonding wire specifically for IC products, which has received positive feedback from customers[60] Future Outlook - The company has not disclosed specific future outlook or guidance in the provided documents[6] - The company anticipates an increase in semiconductor demand due to the rapid development of 5G networks and big data processing systems[60] - The board remains optimistic about future industry developments, particularly in emerging markets such as 5G networks, automotive electrification, industrial automation, IoT, and AI[61] Corporate Governance - The company has established an audit committee consisting of three independent non-executive directors to oversee financial reporting and internal control processes[92] - The company has complied with the corporate governance code as stipulated in the GEM Listing Rules during the reporting period[86] - The company has not identified any business or interests that may compete with its operations from its directors or controlling shareholders[85] Shareholder Information - As of September 30, 2021, the company has issued capital of HKD 7,055,000, divided into 705,500,000 shares with a par value of HKD 0.01 each[68] - Major shareholders include Junma Technology Investment Holdings Limited and Chows Investment Group Limited, each holding 357,000,000 shares, representing 50.60% of the issued capital[76] - Chow Kuo Li Jen holds 100% equity in Chows Investment Group Limited, which is considered to have an interest in 357,000,000 shares of the company[2] - As of September 30, 2021, the beneficial ownership of shares includes 510,000 shares held by a director, representing 0.07% of the issued capital[66] Share Option Scheme - The company has not granted any share options under the share option scheme since its adoption on May 8, 2018, and there are no unexercised options as of September 30, 2021[4] - The share option scheme allows for a maximum of 68,000,000 shares to be granted, which is 10% of the shares issued at the time of listing on GEM[82] - The company has not issued any share options since the adoption of the scheme, and no options have lapsed, been exercised, or cancelled during the reporting period[84] Acquisitions and Disposals - The company has not made any significant acquisitions or disposals of subsidiaries, associates, or joint ventures during the reporting period[63] - The company is actively seeking potential acquisition opportunities to enhance its market position[61] Operational Challenges - The production of the innovative mini LED display packaging product was delayed by over six months due to COVID-19 but is now gradually returning to normal operations[60]