Core Insights - Huahai Qingke's stock price increased by 0.45% on September 22, with a trading volume of 1.408 billion yuan [1] - The company achieved a financing buy amount of 200 million yuan and a net financing purchase of 42.236 million yuan on the same day [1] - As of September 22, the total margin balance for Huahai Qingke was 1.353 billion yuan, with a financing balance of 1.348 billion yuan, representing 2.90% of its market capitalization [1] Financing and Margin Trading - On September 22, Huahai Qingke's financing buy was 200 million yuan, with a financing repayment of 157 million yuan [1] - The financing balance is at a high level, exceeding the 90th percentile of the past year [1] - The company had a margin sell of 2,200 shares and a margin repayment of 1,973 shares, with a margin balance of 5.5374 million yuan, which is below the 40th percentile of the past year [1] Company Performance - As of June 30, Huahai Qingke had 13,600 shareholders, a decrease of 10% from the previous period [2] - The average circulating shares per person increased by 54.75% to 17,452 shares [2] - For the first half of 2025, the company reported a revenue of 1.95 billion yuan, a year-on-year increase of 30.28%, and a net profit of 505 million yuan, up 16.82% year-on-year [2] Shareholder Structure - As of June 30, 2025, Huahai Qingke's top ten circulating shareholders included several ETFs, with Huaxia's ETF holding 8.9168 million shares, an increase of 904,700 shares [2] - E Fund's ETF held 6.8629 million shares, up by 1,149,700 shares [2] - The company has distributed a total of 271 million yuan in dividends since its A-share listing [2]

Core Viewpoint - The report highlights the potential growth of domestic computing power chips in China due to regulatory actions against NVIDIA, which may lead to an increase in market share for local manufacturers [1][2]. Group 1: Domestic Computing Power Chips - Chinese internet regulators have instructed major tech companies to cease all purchases of NVIDIA's AI chips and terminate existing orders, which is expected to boost the market share of domestic computing power chips [1][2]. - Huawei announced a three-year roadmap for its Ascend AI chips, planning to launch four new products from 2026 to 2028, including self-developed HBM technology [2]. Group 2: Advanced Process Expansion - Domestic advanced logic production is expanding beyond expectations, which is favorable for local equipment manufacturers [2]. - A new iteration cycle in storage technology is anticipated next year, aligning with the technological upgrade cycle [2]. Group 3: SoC Testing Market - The market for high-end SoC testing machines is expanding, with domestic companies like Huafeng Measurement and Changchuan Technology actively developing solutions to meet the high testing requirements of SoC chips [3]. - The need for advanced packaging in computing power chips is expected to benefit domestic equipment suppliers, as local manufacturers are likely to shift towards domestic advanced packaging supply chains [3]. Group 4: Investment Recommendations - Recommended companies in the front-end process include North Huachuang and Zhongwei Company for etching and thin film deposition equipment, and in the back-end packaging, companies like Huafeng Measurement and Changchuan Technology are highlighted [3][4]. - Advanced packaging equipment suppliers such as Jing Sheng Machine and other leading semiconductor equipment manufacturers are also noted as potential beneficiaries [3][4].