国内半导体测试设备领域迎来一家新的上市后备军。12月30日，证监会官网披露，深圳市辰卓科技有限公司（以下简称"辰卓科 技"）已在深圳证监局办理上市辅导备案登记，正式启动A股IPO进程，辅导机构为中信建投证券。 辰卓科技成立于2013年5月，是一家专注于以SoC（系统级芯片）测试机为核心的半导体测试设备供应商。公司主营业务包括 CIS（图像传感器）测试机、通用数字测试机、DDIC（显示驱动芯片）测试机等设备的研发、生产、销售与技术服务。2024 年，公司凭借其技术实力和市场表现，成功获评国家级专精特新"小巨人"企业。 成立至今，辰卓科技已累计服务超过200家国内外芯片客户，其中包括多家行业龙头企业。2024年，其SoC测试机在客户端实现 稳定量产运行超过400台，在半导体测试领域积累的知识产权已超过100项，展现出扎实的技术功底与市场竞争力。 目前，公司已实现CIS测试机与通用数字测试机的规模量产与商用，并推出了应用于显示驱动芯片测试的高性能DDIC测试机。 面向未来，辰卓科技计划进一步推出适用于AI、CPU、GPU、FPGA及通信等复杂SoC芯片测试的高端测试设备，持续拓展产品 线。 公开信息显示，辰卓科技已 ...

Investment Rating - The industry investment rating is "Outperform the Market" (maintained) [3] Core Viewpoints - The report highlights that AI is driving advanced packaging demand, with significant growth in storage-related businesses [2][4] - The semiconductor packaging sector experienced a slight decline in gross margin in Q3 2025, but year-on-year comparisons show growth [11][12] - The report emphasizes the importance of advanced packaging technologies in enhancing chip performance and integration, particularly with the ongoing development of Chiplet packaging concepts [4][5] Summary by Sections Overview - In Q3 2025, the semiconductor packaging sector's gross margin slightly decreased, with a gross margin of 21.09%, which is higher than the average of 15.79% for leading packaging companies [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - AI is significantly boosting demand for advanced packaging, with notable growth in the storage sector [17] - Major companies like ASE achieved revenues of 22.63 billion RMB in Q3 2025, reflecting an 8.34% quarter-on-quarter increase and a 16.90% year-on-year increase [18][19] - Advanced packaging services are expected to continue driving growth, particularly in AI-related applications [19][20] Testing - AI-related business growth is notable, with companies like Jingyuan Electronics reporting a revenue increase of 31.99% year-on-year in Q3 2025 [5][41] - Wei Ce Technology's revenue for the first three quarters of 2025 reached 10.83 billion RMB, a 46.22% year-on-year increase, driven by strong demand in computing and automotive electronics [5][41] Equipment - The report indicates that AI growth is leading to a continuous increase in orders, with companies like Besi reporting a 36.5% quarter-on-quarter increase in new orders [5][41] - ASMPT's revenue in Q3 2025 was 33.13 billion RMB, a 7.6% quarter-on-quarter increase, driven by growth in SMT business [5][41] Investment Recommendations - The report suggests focusing on companies benefiting from AI-driven demand, including packaging companies like ASE, Tongfu Microelectronics, and Changdian Technology, as well as testing companies like Jingyuan Electronics and Wei Ce Technology [5][41]

Group 1 - In the past week, 780 stocks were investigated by institutions, with Jingzhida receiving the most attention from 138 institutions [1][2] - Jingzhida delivered its first high-speed testing machine to key domestic clients, which is primarily used in the semiconductor memory testing segment, addressing high-speed testing needs [2][3] - The delivery of this equipment is expected to strengthen and enhance Jingzhida's core competitiveness, positively impacting its future development [3] Group 2 - Other companies such as Hanhigh Group, World, Xinlitai, and Dingtong Technology received over 50 institutional investigations [4] - World announced that by the first half of 2025, it expects to develop over 15 core component customers, achieving an order amount exceeding 4 million yuan, a year-on-year increase of approximately 240% [4] - Dingtong Technology stated that its liquid cooling products are primarily used for heat dissipation in connectors and optical module signal transmission contact surfaces [4] Group 3 - The average stock price of companies investigated by institutions fell by nearly 1% in the past week, while stocks like Fuzhijie Environmental Protection and Zhangjiang Hi-Tech rose over 20% [5] - Fuzhijie Environmental Protection is collaborating with East China University of Science and Technology on key technology development for green methanol production from biogas [5] - Huazhi Technology is developing solid-state battery thermal pressing fixtures with three core features aimed at improving production efficiency [5] Group 4 - Haibo Sichuang's stock price has been reaching historical highs, with the company noting a shift in the energy storage market from price-driven to value-driven, emphasizing cost-effectiveness and economic benefits over the equipment's lifecycle [6]

Core Insights - The AI chip industry has seen a continuous increase in prosperity since 2025, with significant growth in the semiconductor equipment sector driven by AI-related investments [1] - Global semiconductor equipment company revenues are projected to grow by 12% year-on-year in 2025, with a 24% increase in Q2 2025 [1] - The demand for high-performance SoC testing machines and storage testing machines has surged due to the complexity of chip design and manufacturing [1] Industry Overview - The overseas semiconductor equipment market has experienced a 40% year-on-year growth, particularly in testing and packaging equipment [1] - In contrast, the Chinese market saw a slight decline of 1% year-on-year in H1 2025, although the domestic semiconductor equipment localization rate increased by 6 percentage points to 21% [1] Company Performance - Among semiconductor equipment manufacturers, notable revenue growth was observed in several companies, with North Huachuang achieving a revenue of 16.14 billion yuan, a year-on-year increase of 29.51% [2] - The highest net profit growth was recorded by Weidao Nano at 348.95%, followed by Changchuan Technology at 98.73% [3] - Changchuan Technology's growth is attributed to an expanded product range and a shift from mid-to-low-end to mid-to-high-end markets [3] Financial Metrics - Changchuan Technology's revenue for H1 2025 reached 2.167 billion yuan, with a 41.80% increase, driven by a 34.30% rise in testing machine revenue [4] - The company's gross margin has remained stable between 54% and 56%, with a reported gross margin of 54.93% in H1 2025 [4] - R&D investment for Changchuan Technology was 577 million yuan in H1 2025, representing a 35.38% increase and accounting for 26.65% of revenue [4] Market Outlook - The demand for AI and HBM technologies is expected to continue driving industry growth, particularly in the testing equipment sector [4] - Companies are advised to monitor inventory and order status in the short term while focusing on advancements in high-end equipment for SoC and storage testing in the long term [4]

Group 1 - The rapid development of AI chips is driving new demand for testing and packaging equipment, particularly for high-performance testing machines and advanced packaging technologies [2][4][38] - The semiconductor testing equipment market is expected to exceed $13.8 billion by 2025, with SoC and storage testing machines accounting for approximately $4.8 billion and $2.4 billion, respectively [3][50] - The complexity of SoC and advanced storage chips is increasing, leading to a significant rise in demand for high-performance testing machines [35][33] Group 2 - The demand for SoC testing machines is increasing due to the high integration and stability requirements of AI HPC chips, which significantly raise testing volume and time [3][50] - The storage testing machines are facing increased complexity due to HBM testing, which includes wafer-level testing and KGSD testing, replacing conventional packaging-level testing [3][44] - The core barriers in testing machines are the testing boards and chips, with a significant market share held by companies like Advantest and Teradyne, which dominate approximately 90% of the global semiconductor testing machine market [3][50] Group 3 - Advanced packaging technologies, such as HBM and CoWoS, are becoming mainstream, driving the demand for advanced packaging equipment [38][36] - The main difference between advanced and traditional packaging lies in the connection methods between chips and external electronics, with advanced packaging requiring more sophisticated equipment [4][38] - The investment suggestion highlights the potential opportunities in domestic testing and packaging equipment driven by AI chip advancements [4][5] Group 4 - The AI chip market in China is projected to reach approximately 140.6 billion yuan by 2024, with a compound annual growth rate (CAGR) of 36% from 2019 to 2024 [12][10] - The smart computing scale in China is expected to reach 640.7 EFLOPS by 2024, indicating a significant increase in demand for AI chips [12][10] - The end-side AI applications are rapidly expanding, leading to increased demand for SoC chips, which are expected to grow significantly in the market [27][25] Group 5 - The global SoC chip market is anticipated to reach $274.1 billion by 2030, driven by the increasing integration and performance requirements of AI applications [27][26] - SoC chips are essential for various applications, including mobile devices, smart home systems, and industrial control systems, highlighting their versatility [27][24] - The core of SoC chips lies in the IP cores, which are critical for achieving high integration, performance, and low power consumption [30][29] Group 6 - The majority of the AI chip market is still dominated by foreign giants, with domestic companies like Huawei, Haiguang, and Cambricon making strides to break the monopoly [32][31] - The performance of domestic AI chips is improving, with Huawei's Ascend series and Haiguang's DCU chips showing competitive capabilities against leading foreign products [32][31] - The ongoing trend of domestic substitution in the AI chip market is expected to accelerate as local companies enhance their technological capabilities [32][31]

Core Viewpoint - Baoli International (300135) announced on September 22 that its products mainly include SoC testing machines and wafer sorting machines, which cover a wide range of mainstream application scenarios [1] Group 1: Product Overview - The company offers various models of products tailored to different niche markets [1] - All products are developed in-house, with the underlying software and architecture being independently created by the company [1] - The company holds independent intellectual property rights for its products [1]

Core Viewpoint - The semiconductor testing equipment market is projected to exceed $13.8 billion by 2025, driven by the increasing complexity and demand for SoC and storage testing machines due to advancements in AI and HPC chips [1][3]. Group 1: Semiconductor Testing Equipment Market - The semiconductor testing equipment market is expected to reach $13.8 billion by 2025, with SoC and storage testing machines contributing approximately $4.8 billion and $2.4 billion, respectively [1][3]. - The demand for SoC testing machines is increasing due to the high integration, stability requirements, and advanced process characteristics of AI and HPC chips, leading to a significant rise in testing volume and time [1][3]. - Storage testing machines are becoming more complex due to HBM testing, which includes wafer-level testing and KGSD testing, enhancing the difficulty of storage testing processes [1][3]. Group 2: Advanced Packaging Equipment - The rapid development of AI chips is creating new demands for packaging equipment, particularly for HBM memory, which enhances the capacity of accelerator cards [2]. - Advanced packaging technologies such as CoWoS are critical for high-speed interconnections between GPUs and HBM, necessitating advanced packaging equipment [2][4]. - The difference between advanced and traditional packaging lies in the connection methods, with advanced packaging using faster transmission techniques, leading to increased equipment requirements [4]. Group 3: Investment Opportunities - Investors are encouraged to focus on domestic AI chip-related packaging equipment opportunities, as the complexity of testing increases with larger pins and currents in domestic AI chip manufacturing [5]. - Key domestic companies to watch in the testing equipment sector include Huafeng Measurement and Control and Changchuan Technology, which are positioned to benefit from breakthroughs in domestic testing machines [5]. - In the packaging equipment sector, companies like Jingsheng Electromechanical and Huahai Qingke are highlighted for their potential in advanced packaging equipment, as China strengthens its global competitiveness in the packaging segment [5].

Core Viewpoint - The report highlights the potential growth of domestic computing power chips in China due to regulatory actions against NVIDIA, which may lead to an increase in market share for local manufacturers [1][2]. Group 1: Domestic Computing Power Chips - Chinese internet regulators have instructed major tech companies to cease all purchases of NVIDIA's AI chips and terminate existing orders, which is expected to boost the market share of domestic computing power chips [1][2]. - Huawei announced a three-year roadmap for its Ascend AI chips, planning to launch four new products from 2026 to 2028, including self-developed HBM technology [2]. Group 2: Advanced Process Expansion - Domestic advanced logic production is expanding beyond expectations, which is favorable for local equipment manufacturers [2]. - A new iteration cycle in storage technology is anticipated next year, aligning with the technological upgrade cycle [2]. Group 3: SoC Testing Market - The market for high-end SoC testing machines is expanding, with domestic companies like Huafeng Measurement and Changchuan Technology actively developing solutions to meet the high testing requirements of SoC chips [3]. - The need for advanced packaging in computing power chips is expected to benefit domestic equipment suppliers, as local manufacturers are likely to shift towards domestic advanced packaging supply chains [3]. Group 4: Investment Recommendations - Recommended companies in the front-end process include North Huachuang and Zhongwei Company for etching and thin film deposition equipment, and in the back-end packaging, companies like Huafeng Measurement and Changchuan Technology are highlighted [3][4]. - Advanced packaging equipment suppliers such as Jing Sheng Machine and other leading semiconductor equipment manufacturers are also noted as potential beneficiaries [3][4].

Investment Rating - The industry investment rating is maintained as "Outperform" [3] Core Insights - The semiconductor packaging and testing industry is experiencing significant growth driven by AI and advanced packaging technologies, with major players focusing on creating one-stop solutions for packaging and testing [1][5] - Key companies such as Jiayuan Electronics and Weicai Technology are increasing their capital expenditures and expanding high-end testing capacities, reflecting strong demand across various applications [2][5] - The overall gross margin for the domestic packaging sector has shown a notable increase, with leading companies like Huada Technology and Liyang achieving higher margins compared to the industry average [11][12] Summary by Sections Overview - The gross margin for the semiconductor packaging sector has significantly improved, reaching 21.44% in Q2 2025, which is higher than the average for previous quarters [11][12] OSAT (Outsourced Semiconductor Assembly and Test) - Daylight Technology's advanced packaging revenue has surpassed 10% of its total, with a recovery in general business observed [17] - Anke Technology reported a revenue of 10.779 billion RMB in Q2 2025, with a 14.3% quarter-on-quarter growth, driven by strong demand in various markets [30][31] - Powertech Technology's revenue reached 4.226 billion RMB in Q2 2025, reflecting a 16.56% quarter-on-quarter increase [39] Testing - Jiayuan Electronics has significantly increased its capital expenditure, with a 149.64% quarter-on-quarter growth in Q2 2025 [2][3] - Weicai Technology has seen strong revenue and profit growth in H1 2025, driven by the increasing demand for high-end testing services [5][20] Equipment - AI continues to be the main driver for industry growth, with strong demand for TCB, hybrid bonding, and SoC testing equipment [5][21] - ASMPT reported a 50% year-on-year increase in TCB equipment orders in H1 2025 [5][23] Market Trends - The smartphone market is experiencing regional differentiation, with strong growth in specific areas such as the Middle East and Africa [6][28] - The automotive sector is showing positive trends, particularly in the new energy vehicle segment, while traditional fuel vehicles are stabilizing [6][32] Investment Recommendations - The report suggests focusing on key players in packaging, testing, and equipment sectors, including Daylight Technology, Tongfu Microelectronics, and ASMPT, among others [5][34]

Group 1: Company Research Insights - Southern Fund recently conducted research on 9 listed companies, focusing on their strategic directions and performance metrics [1][2][3][4][5][6][7][8][9] - Potevio Technology is focusing on satellite internet and has established a joint laboratory with Xidian ISN for low-orbit satellite communication products [1] - Longi Green Energy reported a main revenue of 32.813 billion yuan, a year-on-year decrease of 14.83%, while its net profit attributable to shareholders was -2.569 billion yuan, an increase of 50.88% year-on-year [2] - Hehe Information is accelerating new product launches and focusing on AI product strategies, with over 60% of its workforce in R&D [3] - Zoomlion is cautiously optimistic about market demand, with a significant increase in overseas revenue by approximately 15% [4] - Aotwei's semiconductor equipment gross margin is low due to long acceptance cycles, but it expects improvement with increased orders for aluminum wire bonding machines [5] - Jingzhida achieved a revenue of 444 million yuan in the first half of 2025, a year-on-year increase of 22.68%, with over 70% of revenue from semiconductor business [6] - Zhongke Lanyun reported a sales revenue of 444.45 million yuan in Q2, with a quarter-on-quarter growth of 21% [7] - Youyou Green Energy's revenue reached 720 million yuan in the first half of 2025, with a slight year-on-year increase of 0.11% [8] - Fuan Energy's total assets were 19.906 billion yuan, with an operating income of 15.338 billion yuan in the first half of 2025, maintaining stable growth [9] Group 2: Financial Performance Metrics - Longi Green Energy's second-quarter revenue was 19.161 billion yuan, a year-on-year decrease of 8.12%, with a net profit of -1.133 billion yuan, an increase of 60.66% [2] - Zoomlion's mid-term dividend payout exceeded 60%, reflecting a long-term stable return philosophy [4] - Aotwei's gross margin is expected to improve as it expands into advanced packaging and solid-state battery equipment [5] - Jingzhida's new orders are gradually increasing its market share, with a focus on high-end testing machines [6] - Zhongke Lanyun's net profit reached 86.2341 million yuan in Q2, with a quarter-on-quarter growth of 92.10% [7] - Youyou Green Energy's overall gross margin was 29.6%, with overseas sales gross margin at 55.1% [8] - Fuan Energy's cash flow from operating activities was 686 million yuan, a year-on-year increase of 602.45% [9]