传感器微型化

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曝光!如何一次性“捕获”20多位“野生”生命科学仪器厂商CEO
仪器信息网· 2025-05-03 14:13
Core Viewpoint - The article highlights the upcoming 18th China Scientific Instrument Development Annual Conference (ACCSI 2025) scheduled for May 11-13, 2025, in Shanghai, focusing on the development of the scientific instrument industry in China and the seventh Life Science Instrument Development Forum as a high-end dialogue platform for industry leaders and experts to explore trends and high-quality development paths [2][3]. Group 1: Event Details - The 18th China Scientific Instrument Development Annual Conference aims to promote healthy and rapid development in the Chinese scientific instrument industry by facilitating effective communication among various stakeholders including government, industry, academia, research, application, investment, and media [3]. - The seventh Life Science Instrument Development Forum will take place on the morning of May 13, 2025, gathering industry leaders, technical experts, and industry elites to discuss cutting-edge trends and high-quality development paths [3]. Group 2: Attendees and Their Roles - Notable attendees include: - Guo Lei, Chairman/General Manager of Dalongxing Experimental Instruments (Beijing) Co., Ltd. - Liu Jiang, Vice President and General Manager of Greater China at Ruifudi - Bai Jingwei, Co-founder and Chief Scientist of Chengdu Qitan Technology Co., Ltd. - Liu Jiapeng, CEO of Shanghai Huixiang Information Technology Co., Ltd. - Liu Gang, Chairman and Chief Scientist of Liangzhun (Shanghai) Industrial Co., Ltd. [5][6]. Group 3: Forum Value Proposition - The forum offers strategic insights covering the localization strategies of international giants and the innovative breakthroughs of domestic enterprises across the entire industry chain [6]. - It addresses technological frontiers including AI integration, sensor miniaturization, and after-market services, providing opportunities for resource matching and direct dialogue with decision-makers from leading enterprises [6].
传感器,一些新趋势
半导体行业观察· 2025-04-20 03:50
Core Insights - The article discusses advancements in sensor miniaturization, highlighting innovations from Sony, OmniVision, and Georgia Tech that address engineering challenges in various applications such as autonomous robotics and brain-computer interfaces [1]. Group 1: Sony's AS-DT1 LiDAR Sensor - Sony has developed the AS-DT1 LiDAR sensor, which is the smallest and lightest in its category, measuring 29mm x 29mm x 31mm and weighing only 50 grams [3][5]. - The sensor utilizes a proprietary distance measurement module based on direct time-of-flight (dToF) architecture and employs single-photon avalanche diode (SPAD) technology for precise readings even on low-reflectivity objects [3][5]. - It has a measurement range of 40 meters indoors and 20 meters outdoors in bright sunlight, with a resolution of ±5 centimeters at 10 meters, making it suitable for applications in robotics and drones [5]. Group 2: OmniVision's OV50X Sensor - OmniVision's OV50X sensor features a 1-inch, 50-megapixel design that supports 110 dB single-exposure HDR and 8K video, pushing smartphone imaging closer to professional levels [6][9]. - The sensor's architecture allows for high sensitivity in low-light conditions and supports 12.5 MP at 180 fps or 60 fps for HDR, enhancing its versatility for various shooting scenarios [7][9]. - It employs 100% quad-phase detection technology for autofocus, ensuring faster and more reliable focusing across different scenes [9]. Group 3: Georgia Tech's Micro-Needle Brain Sensor - Georgia Tech has developed a micro-needle brain sensor designed to be inserted between hair follicles, providing a nearly invisible interface for high-fidelity neural data collection [11][13]. - The sensor achieves a low contact resistance of 0.03 kΩ·cm² and maintains signal integrity for up to 12 hours, allowing for wireless use without bulky equipment [13]. - In tests, participants were able to control augmented reality interfaces using brain activity, marking a significant step towards practical brain-computer interfaces [13].