Core Viewpoint - Chip Quasar Microelectronics Equipment Co., Ltd. (Chip Quasar) has submitted its prospectus for listing on the Hong Kong Stock Exchange, aiming to expand its market presence after being listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board since April 2021 [1][3]. Company Overview - Chip Quasar was established in June 2015 and transformed into a joint-stock company in October 2019. It went public on the Sci-Tech Innovation Board in April 2021 with an initial offering price of 15.23 CNY per share [1]. - The company specializes in manufacturing, selling, and maintaining direct imaging and direct writing lithography equipment, which are critical in the integrated circuit and related industries [3]. Financial Performance - In August 2023, Chip Quasar was approved for a private placement of 10.4972 million shares at a price of 75.99 CNY per share, raising approximately 798 million CNY, with net proceeds around 789 million CNY [3]. - The company's projected revenues for 2022, 2023, 2024, and the first half of 2025 are approximately 652 million CNY, 829 million CNY, 954 million CNY, and 654 million CNY, respectively. Corresponding net profits are estimated at 137 million CNY, 179 million CNY, 161 million CNY, and 142 million CNY [3][4]. - Chip Quasar is the largest supplier of PCB direct imaging equipment globally, holding a market share of 15% based on projected revenues for 2024 [3]. Product and Service Offering - The main products and services offered by Chip Quasar include PCB direct imaging equipment, automatic line systems, semiconductor direct writing lithography equipment, and after-sales maintenance services [3]. - Revenue from PCB direct imaging equipment and automatic line systems during the reporting period was approximately 527 million CNY, 590 million CNY, 773 million CNY, and 475 million CNY [4]. Production Facilities - Chip Quasar operates a production base in Hefei, China, with a total construction area of approximately 34,879.8 square meters, dedicated to producing high-end PCB direct imaging equipment, wafer-level packaging direct imaging lithography equipment, and FPD equipment [5].