Core Viewpoint - SK Hynix and SanDisk are collaborating to advance the global standardization of High Bandwidth Flash (HBF), aiming to fill the storage hierarchy gap between HBM and SSD, specifically optimized for AI inference [2][3]. Group 1: HBF Positioning - HBF is designed to bridge the storage hierarchy gap between ultra-fast HBM and high-capacity SSD, addressing the structural contradictions in existing storage architectures for AI services [5][6]. - HBF offers approximately 10 times the storage capacity of HBM while maintaining high bandwidth, making it suitable for AI inference scenarios [6]. Group 2: Industry Collaboration under OCP Framework - The collaboration between SK Hynix and SanDisk is based on their expertise in HBM and NAND design, packaging, and mass production, aiming for HBF standardization [6][7]. - The establishment of a dedicated working group under the Open Compute Project (OCP) signifies a shift from bilateral agreements to broader industry collaboration for HBF standardization [7][8]. Group 3: Market Outlook - Demand for HBF solutions is expected to accelerate around 2030, with market size projected to surpass HBM by around 2038 [4][10]. - The growth in AI workloads, particularly the shift from training to inference, is driving the need for fast, efficient, and high-capacity storage solutions, which HBF is well-positioned to meet [10].