Core Viewpoint - The article emphasizes the urgent need to reduce the use of per- and polyfluoroalkyl substances (PFAS) in the semiconductor and electronics industry due to their environmental persistence and potential health risks. It proposes a framework for designers to quantify and minimize PFAS usage during the design phase of integrated circuits [1][44][47]. Group 1: PFAS Usage in Semiconductor Manufacturing - The electronics and semiconductor industry is a major consumer of PFAS, with an estimated 4.21 thousand tons used in Europe in 2020, primarily in fluoropolymers [6][8]. - PFAS usage in semiconductor manufacturing is expected to grow by 10% annually, driven by the increasing demand for electronic devices [2][3]. - The main applications of PFAS in semiconductor manufacturing include photoresists, anti-reflective coatings, and other coatings used in lithography processes [11][13]. Group 2: Environmental Impact and Design Optimization - The article presents a data-driven approach to model PFAS usage in integrated circuit manufacturing, identifying trade-offs between PFAS, carbon footprint, power, and performance [3][4]. - By optimizing the design to reduce the number of metal stacking layers, PFAS usage can be reduced by up to 1.7 times [9][30]. - The use of extreme ultraviolet (EUV) lithography can reduce PFAS layers by 18% compared to deep ultraviolet (DUV) lithography, highlighting the importance of technology choice in minimizing environmental impact [4][29]. Group 3: Framework for Sustainable Design - A framework is proposed to help designers quantify PFAS usage and its environmental impact during the design phase, integrating carbon modeling tools to assess trade-offs [9][14][47]. - The framework allows for the analysis of PFAS consumption across different manufacturing processes and encourages the exploration of PFAS-free alternatives [10][45]. - The article calls for a collaborative effort between academia and industry to address the sustainability challenges posed by PFAS in semiconductor manufacturing [11][44]. Group 4: Future Opportunities and Strategies - There is a pressing need for standardized PFAS quantification methods and strategies to extend hardware lifecycles to reduce electronic waste [45][46]. - The use of chiplet architectures presents opportunities for reducing PFAS usage by allowing for modular designs that require fewer metal interconnect layers [45][46]. - The article emphasizes the importance of addressing PFAS usage not only in manufacturing but also throughout the entire lifecycle of computing systems [47].