Group 1 - The global photoresist market is expected to grow at an annual rate of approximately 5% from 2022 to 2027, despite a 2% decline in 2022 due to a drop in demand from the new display industry [7][8] - In the semiconductor sector, the global market size reached $573.5 billion in 2022, with a growth of 3.2% year-on-year, and the photoresist consumption in this sector was approximately 23.8 billion yuan, an increase of 8% [8] - The new display panel market saw a decline in output area by 4.3% in 2022, leading to a 19% decrease in photoresist consumption, but a projected growth of 6% in the next five years [9] Group 2 - China's photoresist demand is expected to grow at an annual rate of 7% from 2022 to 2027, driven by rapid development in the semiconductor, new display panel, and PCB industries [12][14] - In the semiconductor field, China's photoresist consumption reached 4.6 billion yuan in 2022, with a growth of 15%, and is expected to grow at 10% annually in the next five years [15] - The new display sector in China experienced a 13% decline in photoresist consumption in 2022, but is projected to grow at 8% annually over the next five years [16] Group 3 - The domestic photoresist production rate is currently low, with a heavy reliance on imports for semiconductor and display panel photoresists [21][22] - Several Chinese companies have made progress in the domestic production of G/I line photoresists, with KrF photoresists seeing some mature products, but overall domestic production remains below 5% [27][31] - The market for PCB photoresists is characterized by a stable supply of wet film photoresists and imaging solder masks, with a domestic production rate of approximately 55% [38] Group 4 - The key raw materials for photoresists are primarily imported, with significant reliance on foreign suppliers for components such as photoactive compounds and resins [39][40] - The development of domestic photoresist projects is underway, with over 20 projects focused on photoresists and related materials, indicating a growing opportunity for domestic production [44]

Core Position - Photolithography materials are crucial for chip manufacturing, directly affecting chip performance, yield, and cost, accounting for approximately one-third of the total manufacturing cost [2][10]. Key Materials - The three key materials in photolithography are SOC (Spin On Carbon), anti-reflective coatings (BARC/TARC), and photoresists, each playing a vital role in the photolithography process [10][14]. Market Drivers - The demand for materials is surging due to advanced logic and storage chips (like 3D NAND) requiring more photolithography steps, with domestic reliance on multiple exposure technologies further increasing material consumption [3][44]. Domestic Production Rate - The domestic production rate of photolithography materials is extremely low, with the market dominated by Japanese and American companies such as JSR, Shin-Etsu, and DuPont. The domestic market share for ArF photoresists is less than 2%, KrF photoresists is less than 5%, and EUV photoresists is at 0% [3][10]. Future Key Developments - The only path to achieving domestic substitution and technological catch-up is through breakthroughs in higher precision and stronger performance materials [4]. Domestic Company List - Key domestic companies include: - SOC: Xiamen Hengkang, Shanghai Xinyang Semiconductor, and Zhejiang Paibang New Materials [6]. - Anti-reflective coatings: Xiamen Hengkang, Fujian Hongguang, and Shanghai Xinkewai [7]. - Photoresists: Beijing Kehua, Suzhou Ruihong, and Shanghai Xinyang [7]. - Raw materials for photoresists: Xuzhou Bokan, Shengquan Group, and Qiangli New Materials [8]. - Adhesive materials: No mature domestic companies, primarily relying on imports [9]. Market Size and Growth - The domestic photolithography materials market is projected to grow from 53.7 billion yuan in 2019 to 121.9 billion yuan in 2023, with a compound annual growth rate (CAGR) of 22.7%, expected to reach 319.2 billion yuan by 2028 [48]. Photolithography Material Market Demand - The demand for photolithography materials is closely tied to the development of integrated circuit processes, with increasing exposure steps in advanced processes and the ongoing evolution of storage and logic chips driving the need for innovative materials [44][45]. Global Competitive Landscape - The global photolithography materials market is dominated by companies from the US and Japan, such as DuPont and Shin-Etsu, which have significant technological advantages and market shares [65].

Core Viewpoint - The article emphasizes the urgent need to reduce the use of per- and polyfluoroalkyl substances (PFAS) in the semiconductor and electronics industry due to their environmental persistence and potential health risks. It proposes a framework for designers to quantify and minimize PFAS usage during the design phase of integrated circuits [1][44][47]. Group 1: PFAS Usage in Semiconductor Manufacturing - The electronics and semiconductor industry is a major consumer of PFAS, with an estimated 4.21 thousand tons used in Europe in 2020, primarily in fluoropolymers [6][8]. - PFAS usage in semiconductor manufacturing is expected to grow by 10% annually, driven by the increasing demand for electronic devices [2][3]. - The main applications of PFAS in semiconductor manufacturing include photoresists, anti-reflective coatings, and other coatings used in lithography processes [11][13]. Group 2: Environmental Impact and Design Optimization - The article presents a data-driven approach to model PFAS usage in integrated circuit manufacturing, identifying trade-offs between PFAS, carbon footprint, power, and performance [3][4]. - By optimizing the design to reduce the number of metal stacking layers, PFAS usage can be reduced by up to 1.7 times [9][30]. - The use of extreme ultraviolet (EUV) lithography can reduce PFAS layers by 18% compared to deep ultraviolet (DUV) lithography, highlighting the importance of technology choice in minimizing environmental impact [4][29]. Group 3: Framework for Sustainable Design - A framework is proposed to help designers quantify PFAS usage and its environmental impact during the design phase, integrating carbon modeling tools to assess trade-offs [9][14][47]. - The framework allows for the analysis of PFAS consumption across different manufacturing processes and encourages the exploration of PFAS-free alternatives [10][45]. - The article calls for a collaborative effort between academia and industry to address the sustainability challenges posed by PFAS in semiconductor manufacturing [11][44]. Group 4: Future Opportunities and Strategies - There is a pressing need for standardized PFAS quantification methods and strategies to extend hardware lifecycles to reduce electronic waste [45][46]. - The use of chiplet architectures presents opportunities for reducing PFAS usage by allowing for modular designs that require fewer metal interconnect layers [45][46]. - The article emphasizes the importance of addressing PFAS usage not only in manufacturing but also throughout the entire lifecycle of computing systems [47].