企业竞争图谱：2025年CMP设备 头豹词条报告系列 2025-02-21 未经平台授权，禁止转载 摘要 CMP设备通过化学腐蚀与机械研磨协同作用，实现晶圆表面高效去除与全局纳米级平坦化，是集成电路制造的关键工艺。随着集成电路线宽不断细小化，CMP技术日益重 要，步骤不断增加。CMP设备涉及多学科交叉，研发制造难度大。中国CMP设备市场规模受半导体技术发展和下游市场需求拉动，国家政策推动国产化进程。未来，先进 制程升级和多层金属化技术广泛应用将增加CMP设备需求，市场前景广阔。 行业定义 CMP设备（Chemical Mechanical Polishing）化学机械抛光设备，是通过化学腐蚀与机械研磨的协同配合作用，实现晶圆表面多余材料的高 效去除与全局纳米级平坦化——全局平整落差5nm以内的超高平整度，主要用于集成电路制造领域。目前集成电路组件普遍采用多层立体布线， 集成电路制造的工艺环节要进行多次循环，每完成一层布线都需要对晶圆表面进行全局平坦化和除杂，从而进行下一层布线。CMP设备在晶圆完 成每层布线后实现全局纳米级平坦化与表面多余材料的高效去除，保证光刻工艺套刻精度和多层金属互联的高质量实现。 行业分 ...

Investment Rating - The report indicates a positive outlook for the CMP equipment industry, highlighting significant growth potential driven by advancements in semiconductor technology and increasing demand for domestic production in China [1]. Core Insights - CMP (Chemical Mechanical Polishing) technology is essential for achieving high-efficiency removal of excess materials and global nano-level planarization of wafer surfaces, crucial for integrated circuit manufacturing [2][8]. - The CMP equipment market in China is expected to grow significantly, with projections showing an increase from 45 billion RMB in 2022 to 150 billion RMB by 2024, reflecting a compound annual growth rate (CAGR) of 82.57% [36]. - The report emphasizes the importance of CMP technology in advanced packaging processes and its increasing application in multi-layer metallization techniques, which will further drive demand for CMP equipment [39][40]. Industry Definition - CMP equipment is defined as devices that utilize a combination of chemical etching and mechanical grinding to achieve high-quality surface planarization of wafers, primarily used in the integrated circuit manufacturing sector [2]. Industry Classification - CMP equipment is categorized based on application needs into 8-inch CMP equipment, 12-inch CMP equipment, and 6/8-inch compatible CMP equipment [3][4]. Industry Characteristics - The CMP equipment industry is characterized by its critical role in wafer surface planarization, its application in advanced packaging, and the high complexity of its research and manufacturing processes [8][12]. Development History - The CMP technology was first proposed in 1965, with significant milestones including its application in DRAM chip manufacturing by IBM in 1988 and the emergence of Chinese companies like Huahai Qingshi in the CMP market [13][18]. Industry Chain Analysis - The CMP equipment industry chain consists of upstream raw materials, midstream manufacturing, and downstream applications, with significant involvement in integrated circuit silicon wafer manufacturing and packaging testing [19][31]. Market Size and Growth - The CMP equipment market is projected to grow from 183.27 billion RMB in 2025 to 486.86 billion RMB by 2029, with a CAGR of 27.67% [36]. Competitive Landscape - The CMP equipment market is highly monopolized, dominated by international giants such as Applied Materials and Ebara, while Chinese companies like Huahai Qingshi and Jingyi Jingwei are emerging as leaders in the domestic market [21][43].