Core Viewpoint - The construction of the semiconductor packaging and testing equipment R&D center by LianDong Technology has been delayed until December 31, 2026, due to the rapid evolution of the semiconductor market landscape and technology routes, necessitating dynamic adjustments in R&D direction and project content [1] Investment Project Summary - As of June 30, 2025, the project has utilized 147.661 million yuan, which accounts for 58.23% of the planned total investment [1] - An additional 105.9432 million yuan is required for subsequent construction [1]