Core Viewpoint - The company has successfully launched the world's first single-chip 0.61-micron 50 million pixel image sensor, marking a significant advancement in high-pixel integrated technology and validating its Fab-Lite model [1][2] Group 1: Product Launch and Features - The 0.61-micron 50 million pixel image sensor has entered mass production and is suitable for various camera applications, including smartphone rear main cameras, ultra-wide-angle, and front cameras [1] - The product utilizes the proprietary GalaxyCell 2.0 process platform and is manufactured in the company's own wafer fab, enhancing the performance of small pixels [1] - It features a 1/2.88 optical size, which reduces the thickness of camera modules, and integrates single-frame high dynamic range (DAGHDR) technology to address overexposure and underexposure issues in backlit scenes [1] Group 2: Market Recognition and Future Plans - The successful entry into the brand smartphone rear main camera market signifies market recognition of the company's innovative high-pixel single-chip integration technology [2] - The company has previously achieved mass production of 0.7-micron and 1.0-micron 50 million pixel image sensor products, demonstrating a consistent advancement in its technology [2] - Future plans include further iterations of high-pixel products, such as 32 million and 50 million pixel specifications, as well as the introduction of products exceeding 100 million pixels to enhance core competitiveness and expand market share [2]