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天津探路科技金融发展新路径
Zhong Guo Zheng Quan Bao· 2025-07-03 21:35
Core Viewpoint - The Tianjin Municipal Science and Technology Bureau has proposed an action plan to enhance financing for technology-driven enterprises through innovative financial models, including intellectual property (IP) pledge financing, aiming to significantly increase financial support for technological innovation by 2027 [1][3]. Group 1: Financing Innovations - The plan aims to explore new models for IP pledge financing, including bundling patents, trademarks, and copyrights, to improve financing accessibility for technology enterprises and reduce overall financing costs [1][3]. - By 2027, the goal is to exceed CNY 1 trillion in technology loan balances, with an annual growth rate higher than the average for all loans [1][3]. Group 2: Challenges in IP Financing - The complexity and diversity of IP types lead to significant valuation discrepancies, as different institutions may use varying assessment methods, creating uncertainty in IP value [2]. - The lack of fixed assets in technology enterprises often results in financing difficulties, making IP pledge financing a potential solution to unlock the value of intangible assets [1][2]. Group 3: Enhancing Bank Support - The plan encourages banks to separately allocate credit for technology enterprises and delegate approval and pricing authority to technology branches, which could streamline the credit approval process and enhance efficiency [3][4]. - There is a focus on building a talent pool that understands both finance and technology to improve the identification and assessment of technology innovation projects [3][4]. Group 4: Capital Market Development - The establishment of a gradient cultivation system for technology enterprises is proposed, aiming to identify and nurture high-potential technology unicorns and leading enterprises [4]. - The plan includes the encouragement of issuing technology innovation bonds to support financing in strategic emerging industries such as biomedicine and artificial intelligence, enhancing the efficiency and success rate of bond issuance [4][5].