GenAI的内存解决方案 第 1 部分：能力的变化 所需能力 GenAI 应用需要高速、高带宽且低延迟的内存，以便实时处理海量数据。在需要实时决策和 预测的推理环节，数据的快速访问就显得尤为关键。 GenAI内存解决方案第 2 部分：HBM的竞争态势 内存设计的挑战与解决方案以及内存技术的最新趋势正在塑造高性能计算的未来及其竞争 格局。 竞争态势 技术革新： 具有传统接口的动态随机存取存储器（DRAM）在带宽和延迟方 面 存在局限，因此像高带宽内存（HBM）这类利用硅通孔（TSV）堆叠 DRAM 的 技术，就成为满足这些性能需求的关键解决方案。与内存设计相关的挑战与应 对办法，以及内存技术的新兴趋势，正塑造着高性能计算的未来与竞争格局。 优化策略： 未来，像3D-IC和（或）CoWoS等封装技术的进步，将在智能手 机、PC 等不同领域得到应用。智能手机受空间和成本限制，人们会尝试多种办 法，在不增加成本与空间占用的前提下，降低延迟、减少能耗。 应变准备 ： 目前仍不清楚到 2030 年哪些类型的GenAI模型和应用会流行，以 及具体数量是多少。因此，支持架构层面的进步并构建生态系统，以便能够应 对任何变化，将 ...

Group 1: Core Insights - GenAI applications require high-speed, high-bandwidth, and low-latency memory for real-time data processing, making fast data access critical for decision-making and predictions [2] - The competition landscape in memory technology is evolving, with challenges in memory design and emerging trends shaping the future of high-performance computing [4][6] - Custom HBM (High Bandwidth Memory) is becoming essential for AI systems, with significant growth expected as companies like NVIDIA, Amazon, and Microsoft drive its development [26][28] Group 2: Competitive Landscape - Samsung is lagging in HBM due to conservative actions in advanced testing and packaging, focusing too much on cost while failing to meet customer demands for heat dissipation and power consumption [7] - SK Hynix is leading the market by addressing NVIDIA's power and thermal constraints through innovative memory unit designs and backend processing [7][8] - Micron is entering the HBM market later than competitors, planning to launch HBM3e by 2025, while adopting proven bonding equipment and internal voltage conversion technologies [7][8] Group 3: China's Influence - China's influence in the storage market is expected to grow, depending on the new demand environment shaped by GenAI, technological changes, and U.S.-China policies [9] - By 2024, China's DRAM manufacturer CXMT is projected to account for 13% of global capacity, 6% of shipments, and 3.7% of revenue, with potential growth to match Micron's capacity by 2025 [12] - The Chinese semiconductor industry is working towards domestic supply chains for HBM and DRAM, but faces challenges due to U.S. regulations on advanced equipment [12][18] Group 4: Smartphone Integration - The integration of GenAI with smartphones is a significant development, requiring transformative memory solutions and altering the competitive landscape [11] - Samsung plans to improve HBM3e by Q1 2025, potentially increasing its HBM shipment from 8-9 billion gigabits to 11-12 billion gigabits [11] - China aims for domestic production of HBM3 by 2025, with a focus on self-sufficiency in GPU manufacturing and related technologies [11] Group 5: Future Trends and Innovations - The future of memory solutions will focus on balancing bandwidth, capacity, power consumption, and cost, with ARM's recent strategic adjustments influencing configurations [22] - Innovations like Processing In Memory (PIM) and Wide I/O are expected to enhance performance in high-end smartphones and other applications, although their adoption timelines vary [15][22] - The custom HBM market is projected to grow significantly, with estimates suggesting it could account for 30-40% of the overall HBM market by 2030 [29]