Group 1: Company Overview - The company has over 20 years of experience in the semiconductor display equipment industry, mastering various technologies through continuous innovation and development [3] - It has established strong partnerships with renowned clients, including major companies like Bosch, Apple, and Foxconn, ensuring a stable customer base [3] Group 2: Competitive Advantages - The company possesses advanced product design and manufacturing capabilities, leading to high product quality and performance that ranks among the industry leaders [3] - It offers comprehensive, high-quality personalized services throughout the pre-sale, sale, and post-sale processes, contributing to a strong reputation in the industry [3] Group 3: Technological Developments - The company is actively involved in the semiconductor field, successfully entering the semiconductor packaging industry with its IC packaging equipment [4] - It has made significant advancements in solid-state battery technology, focusing on ultrasonic welding and automation equipment for lithium battery production [4] Group 4: Market Expansion - The company is expanding its presence in the overseas market, establishing relationships with several Fortune 500 companies, including Valeo and Harman [4] - It is also developing equipment for perovskite solar cells, with new products entering the debugging phase and preparing for shipment [4]

Group 1 - The company, LianDe Equipment (300545), participated in a specific investor survey on August 29, attended by 11 institutions including Penghua Fund and Nuoan Fund, with the company's board secretary Liu Yuqing receiving the visitors [1] - The investor relations activity focused on introducing the company's overview, development history, main business, recent operating performance, core advantages, and future development plans [1] Group 2 - The company has a diverse business portfolio, including new semiconductor display intelligent equipment, automotive intelligent cockpit system equipment, semiconductor packaging and testing equipment, and renewable energy equipment [2] - In the semiconductor equipment sector, the company specializes in packaging and testing equipment for the back-end process, having completed multiple equipment R&D projects and formed sales orders, with capabilities in various die bonding processes and related equipment [2] - The flexible AMOLED bonding equipment has been widely applied in the mass production of foldable screens for well-known domestic and international terminal customers, with shipments made for the three-fold screen supply chain [2] - In the solid-state battery and renewable energy business, the company has increased R&D investment in lithium battery pack blue film and ultrasonic welding for solid-state/semi-solid batteries, achieving product breakthroughs and sales orders [2] - The company is actively developing equipment for the VR/AR/MR display field, gaining favor from clients and establishing partnerships with leading international terminal customers [2] - The company is continuously monitoring industry dynamics and will make prudent decisions regarding mergers and acquisitions based on its strategic planning and market demand [2]

Company Overview - Shenzhen LianDe Automation Equipment Co., Ltd. has established long-term stable partnerships with renowned clients including Continental Automotive Electronics, Bosch, Harman, and Apple [2][3]. Advanced Packaging and Semiconductor Equipment - The company has successfully entered the semiconductor packaging industry with its developed semiconductor IC packaging equipment, focusing on advanced packaging technologies such as COF flip chip bonding equipment [4]. - LianDe is actively monitoring industry trends and technological advancements to seize opportunities in the semiconductor equipment sector [4]. Flexible AMOLED and Foldable Screen Applications - The company's flexible AMOLED bonding equipment is widely used in the mass production of foldable screens for well-known domestic and international smartphone brands [5]. - LianDe has established a leading position in the foldable screen bonding equipment market, leveraging its technological advantages [5]. Solid-State Battery Developments - In the new energy equipment sector, LianDe is increasing R&D investments in lithium battery packaging, cutting and stacking machines, and ultrasonic welding equipment, resulting in product breakthroughs and sales orders [6]. - The company has successfully shipped ultrasonic welding equipment related to new solid-state battery processes [6]. VR/AR/MR Display Equipment - LianDe has developed equipment for the VR/AR/MR display sectors, gaining recognition from clients in these emerging fields [7]. - The company has established partnerships with leading international clients in the VR/AR/MR display equipment market [7]. Mergers and Acquisitions Strategy - LianDe is actively seeking opportunities for resource integration and is considering mergers and acquisitions to enhance its operational capabilities, in line with regulatory support for industry consolidation [8].

Company Overview - Shenzhen LianDe Automation Equipment Co., Ltd. has over 20 years of experience in the semiconductor display equipment industry, achieving significant technological integration and product quality [2][3] - The company has established long-term partnerships with renowned clients such as Bosch, Apple, and Foxconn, enhancing its reputation in the industry [2] Competitive Advantages - The company possesses advantages in industry experience, R&D innovation, brand recognition, comprehensive service, and customer resources, leading to stable growth in operational scale and performance [3] Product Applications - The company's flexible AMOLED bonding equipment is widely used in the mass production of foldable screens for major smartphone brands, with ongoing collaborations for innovative flexible screen applications [4] - In the solid-state battery sector, the company is increasing R&D investment in various automation equipment, achieving product breakthroughs and generating sales orders [5] Semiconductor Equipment Progress - The company focuses on chip packaging and testing equipment, including advanced devices like COF flip chip machines and high-precision semiconductor equipment, with plans to expand its R&D investment in this area [6] VR/AR/MR Display Sector - The company has developed equipment for the VR/AR/MR display field, gaining recognition from clients in this emerging market and establishing partnerships with leading international manufacturers [7]