Market Performance - The main board led the gains with stocks like Yongding Co. (+10.04%), Bomin Electronics (+10.04%), and Lianchuang Optoelectronics (+10.00%) showing significant increases [1] - The ChiNext board saw a strong performance with Meiansen (+15.21%) and Saiyi Information (+14.98%) leading the charge [1] - The Sci-Tech Innovation board was also active, with Guoguang Electric (+13.77%) and Zhiyuan Huilian (+11.20%) among the top performers [1] - Active sub-industries included SW Brand Consumer Electronics (+1.82%) and SW Passive Components (+1.60%) [1] Domestic News - Aibang VR announced it has completed a new round of financing worth several million yuan, focusing on expanding its research team and optimizing silicon carbide waveguide etching mass production processes [1] - Zhipu announced a strategic financing round exceeding 1 billion yuan, aimed at promoting technological innovation and ecological development of domestic GLM large models [1] - TSMC's 5/4nm process remains fully loaded, with increased chip production for Nvidia's B series and RTX 50 series compared to the beginning of the year [1] - Xiamen Silan's 8-inch silicon carbide power device chip manufacturing line project has officially topped out, with an investment of 7 billion yuan and expected production capacity of 420,000 8-inch SiC chips annually by 2026 [1] Company Announcements - Jibite announced progress on its investment fund, with changes in limited partners and an additional 50 million yuan commitment from Tianjin Dingsheng Wireless Network Technology Co. [2] - Tonghui Information reported a 2024 revenue of 217 million yuan, a year-on-year increase of 13.60%, but a net loss of 70 million yuan [2] - Yun Chuang Data reported a 2024 revenue of 262 million yuan, a year-on-year decrease of 11.27%, with a net loss of 105 million yuan [2] - Lian Technology announced a delay in part of its fundraising projects, with the Ningbo Lian Technology Co. expansion project now expected to reach operational status by June 30, 2025 [2] Overseas News - Ansys announced the official commissioning of its 8-inch SiC wafer joint venture factory, expected to start production in Q4 2025 and reach full capacity by 2028 [2] - BMW is preparing its Munich factory for the launch of the NEUE KLASSE (new generation model) in summer 2026, with three new production workshops under construction [2] - HP's CEO indicated that the company is considering relocating part of its manufacturing to the U.S., with less than 10% of North American sales expected to come from China by the end of the fiscal year [2] - Apple is developing a highly integrated Wi-Fi and Bluetooth chip for new Apple TV and HomePod mini models, potentially supporting Wi-Fi 6E and Wi-Fi 7 [2]