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如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 NRC 。 如何粉碎一块薄饼？这个问题困扰着阿姆斯特丹纳米光刻高级研究中心 (ARCNL) 的研究员迪翁· 恩格尔斯 (Dion Engels)。 这里所说的薄饼指的是被粉碎的锡滴，它在 ASML 的光刻机中每秒被引爆五万次。这会产生等离 子体，发射出极紫外 (EUV) 光：一种极紫外辐射，将高度精细的芯片图案投射到硅片或晶圆上。 集成的晶体管越多，芯片的性能就越强。得益于 EUV 光刻机，如今用于手机或人工智能数据中心 的最先进处理器上的芯片设计线间距仅为几十纳米——百万分之一毫米。 ASML 与美国 Cymer 实验室合作研究 EUV 技术长达二十年，发现粉碎锡滴可以产生更多的 EUV 光。其结果是：生产英伟达、苹果、三星或英特尔先进芯片的机器很快就会更加高效地运转。 ASML 系统的许多基础设计都诞生于阿姆斯特丹东区的科学园。ARCNL 成立于十年前，与阿姆 斯特丹大学合作成立。其推动力来自 ASML 的技术总监兼联席总裁 Martin van den Brink，他于 去年退休。ARCNL 承担 ASML 三分之一的预算（每年约 400 万 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 NRC 。 如何粉碎一块薄饼？这个问题困扰着阿姆斯特丹纳米光刻高级研究中心 (ARCNL) 的研究员迪翁·恩 格尔斯 (Dion Engels)。 这里所说的薄饼指的是被粉碎的锡滴，它在 ASML 的光刻机中每秒被引爆五万次。这会产生等离子 体，发射出极紫外 (EUV) 光：一种极紫外辐射，将高度精细的芯片图案投射到硅片或晶圆上。 集成的晶体管越多，芯片的性能就越强。得益于 EUV 光刻机，如今用于手机或人工智能数据中心的 最先进处理器上的芯片设计线间距仅为几十纳米——百万分之一毫米。 ASML 与美国 Cymer 实验室合作研究 EUV 技术长达二十年，发现粉碎锡滴可以产生更多的 EUV 光。其结果是：生产英伟达、苹果、三星或英特尔先进芯片的机器很快就会更加高效地运转。 芯片元件尺寸缩小的速度正在放缓，因为芯片设计变得越来越高：制造商正在将芯片元件粘合在一 起，并想出更智能地排列晶体管的方法，例如从底部供电。 ASML 系统的许多基础设计都诞生于阿姆斯特丹东区的科学园。ARCNL 成立于十年前，与阿姆斯特 丹大学合作成立。其推动力来自 AS ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 semiengineering ，谢谢 。 半导体工程与业内专家齐聚一堂，深入探讨了光刻技术发展中光掩模所面临的关键挑战。随着先进 光刻节点向EUV（极紫外光刻）及更远技术推进，光掩模制造已成为半导体生产中最关键且成本 最高的环节之一。与此同时，非EUV应用也在延长旧工具和工艺的寿命，这促使行业必须在这两 个 极 端 寻 找 新 的 解 决 方 案 。 参 与 本 次 对 话 的 专 家 包 括 HJL Lithography 的 首 席 光 刻 师 Harry Levinson 、 D2S 的 首 席 执 行 官 Aki Fujimura 、 美 光 的 掩 模 技 术 高 级 总 监 Ezequiel Russell 以 及 Photronics的执行副总裁兼首席技术官Christopher Progler。以下是本次对话的节选内容。 SE：目前，EUV和非EUV光刻在最前沿的掩模相关挑战是什么？ Levinson： 对于EUV而言，最大的问题是成本——制造、维护和更换掩模的总费用。光掩模和 EUV掩模在其生命周期内的价格差异巨大。我认为这种情况不 ...

Financial Data and Key Metrics Changes - Revenue for the quarter totaled $167 million, which is above the midpoint of guidance, but down 4% year-over-year and 8% sequentially [5][17] - Non-GAAP operating income was $24 million, and non-GAAP EPS was $0.37, exceeding the high end of guidance [5] - Gross margin was approximately 42%, in line with guidance, while operating expenses were approximately $46 million, below guidance [20][23] Business Line Data and Key Metrics Changes - The Semiconductor business grew 10% sequentially and 3% year-over-year, representing 74% of total revenue [17] - Advanced Packaging saw significant growth, with expectations to double revenue to about $150 million in 2025 [28] - Revenue from the Compound Semiconductor market declined to $14 million, accounting for 9% of total revenue [18] Market Data and Key Metrics Changes - Revenue from China customers was flat in Q1 compared to Q4, increasing their share of total revenue from 39% to 42% [19] - Revenue from the Asia Pacific region (excluding China) increased from 31% to 36%, driven by sales to semiconductor customers in Taiwan [19] - The United States accounted for 15% of revenue, while EMEA contributed 7% [19] Company Strategy and Development Direction - The company aims to capitalize on long-term semiconductor industry growth, focusing on laser annealing and ion beam deposition technologies [10][12] - Strategic wins include being awarded Intel's 2025 EPYC supplier award, which validates the company's position in the semiconductor industry [6] - The company is focused on expanding its served available market (SAM) in laser annealing and advanced packaging due to increasing demand driven by AI and high-performance computing [12][15] Management's Comments on Operating Environment and Future Outlook - Management expressed confidence in long-term strategy despite uncertainties from recently enacted tariffs, which are causing some customers to delay shipments [9][22] - The company anticipates that gate all around and advanced packaging revenue could double in 2025 compared to 2024 [24] - Management noted that while there are headwinds from the mature node business in China, there are still growth opportunities in leading-edge investments [24] Other Important Information - Cash and short-term investments at the end of the quarter were $353 million, an increase from $345 million [21] - The company is monitoring tariff impacts closely and is working with customers to mitigate potential disruptions [22] Q&A Session Summary Question: Could you elaborate on the advanced packaging orders for your lithography tools? - The company announced $35 million in lithography orders, driven by advanced packaging and AI applications, with expectations for significant year-over-year growth in 2025 [28] Question: What is driving the recent strength in the lithography business? - The growth is primarily due to capacity buys from customers, particularly OSATs and IDMs, driven by demand for AI and high bandwidth memory [31] Question: Can you discuss the impact of tariffs on shipments to China? - Some customers are delaying shipments due to tariffs, with an anticipated $15 million impact on Q2 guidance [32][22] Question: What parts of the semiconductor business are expected to grow in 2025? - The company expects growth in advanced packaging and high bandwidth memory, which could offset declines in other areas [36][64] Question: Are there any updates on GaN power applications? - The company is making progress with a customer for GaN power applications, with plans to start pilot production in 2026 [50] Question: What is the outlook for the second half of the year? - The company anticipates that second half revenue could be flattish, with strength in gate all around and advanced packaging potentially offsetting headwinds from China [56]