Core Viewpoint - The article discusses the transition of former Intel CEO Pat Gelsinger to xLight, a startup focused on revolutionizing EUV lithography technology through the use of particle accelerators, aiming to enhance semiconductor manufacturing efficiency and reduce costs significantly [1][5][6]. Group 1: Company Overview - xLight aims to commercialize Free Electron Lasers (FEL) powered by particle accelerators to produce EUV light, which is essential for advanced semiconductor manufacturing [4][6]. - The company claims its EUV light source will be four times more powerful than current technologies, potentially generating billions in additional annual revenue for semiconductor fabs [6][11]. Group 2: Technology and Innovation - Current EUV light generation methods, such as Laser Produced Plasma (LPP), are highly energy-intensive, producing only 500 watts of light from 1.5 megawatts of power [1][4]. - xLight's FEL technology is designed to be fully compatible with existing ASML tools, addressing the need for higher power sources (up to 2 kW) for future semiconductor manufacturing [4][5]. Group 3: Economic and Strategic Implications - The advancements in EUV technology are critical for maintaining the U.S.'s leadership in the semiconductor industry, which is vital for economic prosperity and national security [6][11]. - xLight's system is expected to reduce wafer costs by approximately 50% and lower capital and operational expenditures by over three times [6][11]. Group 4: Future Prospects - xLight is currently developing a fully functional prototype that will connect to ASML scanners and is expected to be operational by 2028 [6][8]. - The company believes its technology will not only enhance semiconductor applications but also address challenges in national security and biotechnology [7][8].

这家成立两年的公司正准备在2027年大规模生产采用2nm工艺的半导体，理论上，这将与台积电在芯片 制造能力方面相媲美。迄今为止，日本已拨出1.72万亿日元（115亿美元）来支持这家初创公司，以期 夺回被美国、中国台湾和韩国抢占的部分技术领导地位。日本还将向Rapidus提供高达8025亿日元（约 合54亿美元）的额外援助。 72岁的Rapidus CEO Atsuyoshi Koike表示："开发2nm技术和大规模生产技术极其困难，未来还有更多的 实验。我们将一步一步降低错误率，赢得客户信任。" 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 4月2日消息，日本晶圆代工创企Rapidus开始调试芯片制造设备，计划在4月底开始试产先进半导体，这 是其制造AI组件的关键一步。 Atsuyoshi Koike表示，Rapidus 4月1日已首次使用ASML设备进行极紫外（EUV）光刻。他说，第一批 测试芯片可能会在7月问世，该公司仍按计划在北海道北部岛屿的工厂大规模生产先进芯片。 国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 第二步：在公众号里面回复"加群"，按照提示操作即可。 爆料｜投稿｜合作｜ ...