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AMD ZEN 7,提前曝光
半导体行业观察· 2025-05-20 01:04
Core Viewpoint - AMD is advancing towards a more specialized CPU design strategy, planning to offer multiple versions of the same architecture to meet diverse performance and efficiency needs, starting with the Zen 7 series [1][2]. Summary by Sections Zen 7 Architecture - AMD plans to introduce at least four different versions of the Zen 7 architecture, targeting high-performance desktops, servers, low-power laptops, and handheld devices [1]. - The architecture will include classic Zen 7 for high performance, dense Zen 7c for high core count servers, low-power Zen 7 for efficiency, and efficient Zen 7 focusing on IPC [1][2]. Core and Cache Specifications - Each Zen 7 core is expected to feature 2MB of L2 cache, double that of Zen 5, and up to 7MB of stacked L3 3D V-Cache, manufactured using TSMC's 4nm process [3][5]. - The Zen 7 architecture is anticipated to improve IPC performance by 15% to 25% compared to Zen 6, with an initial target of over 20% [3][6]. Manufacturing and Technology - AMD is reportedly utilizing TSMC's 1.4nm technology for Zen 7 core chips, which would represent cutting-edge technology at the time of release [4]. - The design includes a new type of pure 3D core with extensive cache, which is expected to significantly enhance performance as core counts increase [4][5]. Release Timeline - Zen 7 is projected to begin tape-out by the end of 2026, with an official release expected in late 2027 or early 2028 [3][6].