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富特科技(301607) - 2025年5月8日投资者关系活动记录表
2025-05-08 12:08
Group 1: Customer Structure and Revenue - In 2024, the concentration of customers decreased, with the top five customers accounting for 36.16% of revenue, down from 56.15% in 2023, a reduction of 3.87% year-on-year, due to the orderly mass production of new customer projects [1] - The company expects continued optimization of customer structure as the scale of designated customers expands [1] Group 2: Pricing Strategy - The company bases its pricing strategy on BOM raw material costs, considering manufacturing costs, period expenses, and reasonable profit margins, with dynamic adjustments based on project complexity and customer requirements [1] Group 3: Overseas Business Expansion - In 2024, direct export revenue accounted for 6.8% of total revenue, indicating initial success in overseas business expansion [2] - The company focuses on major international automotive enterprises, enhancing its market share through customized products and solutions [2] Group 4: Impact of Third-Generation Semiconductor Materials - The company has developed topology application technology based on SiC, improving power density and reducing component count, thus lowering costs and enhancing product reliability [3] - Ongoing research into GaN materials is also being conducted, with updates to be disclosed in future reports [3] Group 5: Gross Margin Fluctuations - Gross margin fluctuations are influenced by market competition and supply chain costs, with a slight decline in overall gross margin due to aggressive pricing strategies in the automotive sector [4] - The company aims to stabilize gross margin through technology cost reduction and supply chain collaboration [4] Group 6: Business Diversification - The company has expanded its business beyond core operations, developing products like smart DC charging power modules and liquid-cooled ultra-fast charging power modules, leveraging existing technology and experience [5] - The functionality of vehicle-mounted products has diversified, with plans to extend business based on market trends and energy network demands [6]
三安半导体:顶部散热封装在SiC功率半导体中的应用
行家说三代半· 2025-05-08 10:20
插播: 倒计时7天! 三菱电机、意法半导 体、Wolfspeed、三安半导体、天科合达、元山电子、大族半导体、香港大学、长飞先进、宏微科 技、利普思、昕感科技、国扬电子、国基南方、芯长征、合盛新材料、 瀚天天成、 芯研科、 国瓷功 能材料等邀您参加上海 "电动交通&数字能源SiC技术应用及供应链升级大会",点击文章底部 "阅读 原文" 即可报名参会。 除三安半导体外,会议还邀请了 三菱电机、意法半导体、Wolfspeed、天科合达、元山电子、大族半导 体、香港大学、长飞先进、宏微科技、利普思、昕感科技、国扬电子、国基南方、芯长征、合盛新材料、 瀚天天 成、 芯研科、 国瓷功能材料等 行业领 军企业&机构参与,将共论产业发展,再 谱产业新章。 大会现已开放报名渠道,因会议 名额有限 ,先到先得,欢迎各位行 家 扫码报名 参会,期待与你在上海相会! 本文发自【行家说三代半】,专注第三代半导体(碳化硅和氮化镓)行业观察。 其他人都在看: 长城为何联手英诺赛科?解密背后的GaN技术创新 5月15日, "行家说三代半"将在上海召开 "电动交通&数字能源SiC技术应用及供应链升级大会" ,三安半导体 已正式确认 出席本次 ...